H05K 1 - Printed circuits - Patents Sitemap

Patents for H05K 1 - Printed circuits (98,583)
12/2004
12/15/2004	CN1180516C Folding electronic apparatus
12/15/2004	CN1180477C Semiconductor device adn semiconductor assembly
12/15/2004	CN1180365C Method of producing smart card
12/15/2004	CN1180006C Preparation method of polyether imide flexible printed circuit substrate material
12/15/2004	CN1179845C Composite laminated plate and its mfg process
12/14/2004	US6832049 Optical Module
12/14/2004	US6832045 Exposure device
12/14/2004	US6831848 Programmable power supply to simultaneously power a plurality of electronic devices
12/14/2004	US6831841 Flexible substrate, electro-optical device and electronic device
12/14/2004	US6831835 Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
12/14/2004	US6831544 Apparatus and method for PCB winding planar magnetic devices
12/14/2004	US6831528 High-frequency switching module and high-frequency apparatus equipped with the same
12/14/2004	US6831371 Integrated circuit substrate having embedded wire conductors and method therefor
12/14/2004	US6831236 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
12/14/2004	US6831235 Printed-circuit board, multilayer printed-circuit board and method of manufacture thereof
12/14/2004	US6831234 Multilayer printed circuit board
12/14/2004	US6831233 Chip package with degassing holes
12/14/2004	US6831129 Printed circuits; fireproofing, waterproofing, bonding strength
12/14/2004	US6831009 Wiring substrate and an electroless copper plating solution for providing interlayer connections
12/14/2004	US6830875 Preventing cylindrical volume curing; rapid, inexpensive; quality photolithograhic method
12/14/2004	US6830823 Gold powders, methods for producing powders and devices fabricated from same
12/14/2004	US6830806 Methods of manufacture of electric circuit substrates and components having multiple electric characteristics and substrates and components so manufactured
12/14/2004	US6830627 Copper cleaning compositions, processes and products derived therefrom
12/14/2004	US6830476 Electric power and communications signal distribution unit, particularly for heads of combination weighers
12/14/2004	US6830461 Electrical contact and electrical connection device using same
12/14/2004	US6830459 High current, high mechanical strength connectors for insulated metal substrate circuit boards
12/14/2004	US6830391 Media cartridge with printed circuit board for use in a printing system
12/14/2004	US6830194 Built-in multifunctional card reader
12/14/2004	US6830177 Method and apparatus to compliantly interconnect commercial-off-the-shelf chip scale packages and printed wiring boards
12/14/2004	US6829823 Forming plated through hole; surface roughness facilitates deposition of conductive metal; shrinkage inhibition
12/14/2004	CA2370086C Inverted board mounted electromechanical device
12/14/2004	CA2300020C Electronic circuit board and soldering method therefor
12/12/2004	CA2470790A1 Technique for interconnecting multilayer circuit boards
12/09/2004	WO2004107830A1 Compact via transmission line for printed circuit board and its designing method
12/09/2004	WO2004107826A2 Multi functional timepiece module with application specific printed circuit boards
12/09/2004	WO2004107263A1 Semiconductor device and its manufacturing method
12/09/2004	WO2004107260A2 Method for producing a contactless ticket comprising a chip
12/09/2004	WO2004106441A1 Method of inkjet printing a fluorpolymer solution to a substrate and articles therefrom
12/09/2004	WO2004106223A1 Carbon nanotube device, process for producing the same and carbon nanotube transcriptional body
12/09/2004	WO2004093505A3 Emi shielding for electronic component packaging
12/09/2004	WO2004069941A3 High conductivity inks with improved adhesion
12/09/2004	WO2004061905A3 A method for forming ceramic film capacitors
12/09/2004	WO2004047240A3 Apparatus for crosstalk compensation in a telecommunications connector
12/09/2004	US20040250229 Non-uniform decoupling capacitor distribution for providing more uniform noise reduction across chip
12/09/2004	US20040249040 Ceramic multilayer composite with inorganic particles having surface areas with photolithigraphic process for stacking
12/09/2004	US20040248468 High data rate interconnecting device
12/09/2004	US20040248439 Electrical contacting method
12/09/2004	US20040248438 Reinforced substrates with face-mount connectors
12/09/2004	US20040248437 Reinforced substrates having edge-mount connectors
12/09/2004	US20040248434 Flexible print circuit, wire harness, and wiring structure using shape memory material
12/09/2004	US20040248432 Connector having a bypass capacitor and method for reducing the impedance and length of a return-signal path
12/09/2004	US20040247950 Battery pack and thermostat used for it
12/09/2004	US20040247921 Controlling etching depth; dielectric film for flexible circuits containing liquid crystalline polymer and polyimide
12/09/2004	US20040247916 conjugated conductive polymer and a substrate of a heat stabilized, heat-set oriented poly(ethylene naphthalate) film; high brightness, high contrast, very fast response speed and wide viewing angle, thin profile, low power consumption
12/09/2004	US20040247907 Polyimide-metal layered products and polyamideimide-metal layered product
12/09/2004	US20040247881 Curable flame retardant epoxy resin compositions
12/09/2004	US20040247880 Nanoporous laminates
12/09/2004	US20040247842 Using porous substrate; ink jet discharging liquid material ; forming circuit pattern
12/09/2004	US20040246692 Electronic circuit component
12/09/2004	US20040246691 Dual pitch contact pad footprint for flip-chip chips and modules
12/09/2004	US20040246690 Printed circuit board, method for producing same and semiconductor device
12/09/2004	US20040246689 Apparatus and method for mounting a surface mount component in an etched well in a printed circuit board
12/09/2004	US20040246688 Technique for laminating multiple substrates
12/09/2004	US20040246683 Electrical circuit arrangement comprised of a number of electrically interconnected circuit components
12/09/2004	US20040246681 Stack up assembly
12/09/2004	US20040246680 Stack up assembly
12/09/2004	US20040246662 Power module package for high frequency switching system
12/09/2004	US20040246644 Surge protector assembly with ground-connected status indicator circuitry
12/09/2004	US20040246626 Wired circuit board
12/09/2004	US20040246187 Printed circuit board and wireless communication apparatus
12/09/2004	US20040246092 Electrical devices
12/09/2004	US20040246064 Multilayer circuit board for high frequency signals
12/09/2004	US20040246008 Apparatus and method for detecting and rejecting high impedance interconnect failures in manufacturing process
12/09/2004	US20040245996 Apparatus and method for monitoring and predicting failures in system interconnect
12/09/2004	US20040245969 Power converters
12/09/2004	US20040245674 Method for packaging small size memory cards
12/09/2004	US20040245640 Wiring board and circuit module
12/09/2004	US20040245628 Tape package having test pad on reverse surface and method for testing the same
12/09/2004	US20040245624 Using solder balls of multiple sizes to couple one or more semiconductor structures to an electrical device
12/09/2004	US20040245620 Memory card capable of indicating an inserting direction
12/09/2004	US20040245619 Wired circuit board
12/09/2004	US20040245615 Point to point memory expansion system and method
12/09/2004	US20040245508 Thick film conductor compositions for use on aluminum nitride substrates
12/09/2004	US20040245507 Conductor composition and method for production thereof
12/09/2004	US20040245242 Heat-activated electrical coupling for in situ circuit reconfiguration
12/09/2004	US20040245210 Method for the manufacture of printed circuit boards with embedded resistors
12/09/2004	US20040245111 Plating tank for wire patterns on film carrier; prevent bubble adhesion
12/09/2004	US20040245109 Film carrier tape for mounting electronic devices thereon, production method thereof and plating apparatus
12/09/2004	US20040245015 Wired circuit board
12/09/2004	US20040245012 Set of printed circuit boards
12/09/2004	US20040245011 Power plane splitting using a contour method
12/09/2004	US20040244613 System and methods for data-driven control of manufacturing processes
12/09/2004	DE202004012964U1 Gassackmodul The airbag module
12/09/2004	DE202004007207U1 Flexible circuit substrate, comprises conductive track layer divided into repeated sections that are folded e.g. in zigzag
12/09/2004	DE19549635B4 Verfahren zur Verbindung eines flexiblen Substrats mit einem Chip A method of connecting a flexible substrate having a chip
12/09/2004	DE10336861B3 Determining surface position of workpiece in laser processing machine involves measuring carrier marker at several defined carrier height positions using camera, deriving and storing calibration curve
12/09/2004	DE10323168A1 Labeling element for an electronic component, e.g. for storage of component specific information, comprises a memory and antenna that permits reading from or writing to the memory via electromagnetic waves
12/09/2004	DE102004024937A1 Montierbare Mikroelektronikbaugruppe Leaded microelectronics assembly
12/09/2004	DE102004024753A1 Konforme Dichtfolie Compliant sealing film
12/08/2004	EP1484950A2 Method for electrical connection

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