| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/22/2004 | CN1555952A Connecting method of electric conductor and welding flux and electron component element using said method |
| 12/22/2004 | CN1181718C Multi-layer circuit board and its preparing process |
| 12/22/2004 | CN1181716C Multilayer ceramic supporting base with anchored welding pad and its mfg. method |
| 12/22/2004 | CN1181714C Method for making multi-layer circuit board by substrate with open |
| 12/22/2004 | CN1181711C Electric load |
| 12/22/2004 | CN1181710C Method for mfg. glass-ceramic board |
| 12/22/2004 | CN1181140C Polyporous material |
| 12/22/2004 | CN1181139C 树脂组合物和挠性印刷电路板 The resin composition and the flexible printed circuit board |
| 12/21/2004 | US6834200 Ceramic based multi-site electrode arrays and methods for their production |
| 12/21/2004 | US6834131 System and method for integrating optical layers in a PCB for inter-board communications |
| 12/21/2004 | US6833998 Circuit board assembly with separable first and second circuit board devices |
| 12/21/2004 | US6833997 Combination terminal/leadframe for heat sinking and electrical contacts |
| 12/21/2004 | US6833775 Microwave circuit |
| 12/21/2004 | US6833727 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 12/21/2004 | US6833674 Heat-dissipation structure of plasma display panel device |
| 12/21/2004 | US6833618 Memory system with a socket having socket pins for mounting memory modules |
| 12/21/2004 | US6833615 Via-in-pad with off-center geometry |
| 12/21/2004 | US6833613 Stacked semiconductor package having laser machined contacts |
| 12/21/2004 | US6833611 Semiconductor device |
| 12/21/2004 | US6833513 Crosstalk reduction in a PWB connector footprint |
| 12/21/2004 | US6833512 Substrate board structure |
| 12/21/2004 | US6833511 Multilayer circuit board and method of manufacturing the same |
| 12/21/2004 | US6833509 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 12/21/2004 | US6833198 Copper clad laminate |
| 12/21/2004 | US6833181 Conductive resin composition and contact board using the same |
| 12/21/2004 | US6833042 Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
| 12/21/2004 | US6832725 Optical reader comprising multiple color illumination |
| 12/21/2004 | CA2334524C Electronic apparatus provided with an electronic circuit substrate having high heat dissipation |
| 12/19/2004 | CA2469371A1 Dielectric substrate with selectively controlled effective permittivity and loss tangent |
| 12/16/2004 | WO2004110120A1 Printed board and printed board unit |
| 12/16/2004 | WO2004110116A1 Production method for feedthrough electrode-carrying substrate |
| 12/16/2004 | WO2004110115A1 Prepreg for printed wiring board and copper-clad laminated board |
| 12/16/2004 | WO2004110114A1 Flexible wiring board and flex-rigid wiring board |
| 12/16/2004 | WO2004110113A2 Electrical devices embedded in printed circuit boards |
| 12/16/2004 | WO2004110034A1 Mobile radio device |
| 12/16/2004 | WO2004109922A2 Compact electromagnetic coupler for use with digital transmission systems |
| 12/16/2004 | WO2004109802A1 Memory expansion and integrated circuit stacking system and method |
| 12/16/2004 | WO2004109798A1 Method and assembly for thermally protecting electronic units in an electronic device |
| 12/16/2004 | WO2004109774A2 Selective reference plane bridge(s) on folded package |
| 12/16/2004 | WO2004109719A2 Polymer thick film resistor, layout cell, and method |
| 12/16/2004 | WO2004108826A2 Curable flame retardant epoxy resin compositions |
| 12/16/2004 | WO2004108825A1 Process for producing modified epoxy resin |
| 12/16/2004 | WO2004108791A1 Resin composition for printed wiring board, prepreg, and laminate obtained with the same |
| 12/16/2004 | WO2004108397A1 Method for producing laminate |
| 12/16/2004 | WO2004107973A1 Serpentine and corduroy circuits to enhance the stretchablity of a stretchable electronic device |
| 12/16/2004 | WO2004057687A3 Light-emitting arrangement |
| 12/16/2004 | US20040253855 Conductor of flexible material, component comprising such flexible conductor, and method of manufacturing such conductor |
| 12/16/2004 | US20040253850 Electrical connector housing |
| 12/16/2004 | US20040253825 Semiconductor device |
| 12/16/2004 | US20040252501 Light source coupler, illuminant device, patterned conductor, and method for manufacturing light source coupler |
| 12/16/2004 | US20040252491 Printed circuit board lamp |
| 12/16/2004 | US20040252475 Module part |
| 12/16/2004 | US20040252473 Electronic apparatus |
| 12/16/2004 | US20040252470 Slot apparatus for memory module |
| 12/16/2004 | US20040252462 Land grid array assembly using a compressive load |
| 12/16/2004 | US20040252413 Magnetic disk drive |
| 12/16/2004 | US20040252086 Self light emitting type display device |
| 12/16/2004 | US20040252010 Circuit board having resistor and method for manufacturing the circuit board |
| 12/16/2004 | US20040251559 Hybrid integrated circuit package substrate |
| 12/16/2004 | US20040251544 Interconnection pattern design |
| 12/16/2004 | US20040251537 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate |
| 12/16/2004 | US20040251534 [layout structure and method for supporting two different package techniques of cpu ] |
| 12/16/2004 | US20040251533 Hybrid integrated circuit device |
| 12/16/2004 | US20040251527 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 12/16/2004 | US20040251435 Optical sensor and image forming apparatus |
| 12/16/2004 | US20040251231 Circuit board and manufacturing method of the same |
| 12/16/2004 | US20040251230 Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom |
| 12/16/2004 | US20040251047 Via structure for increased wiring on printed wiring boards |
| 12/16/2004 | US20040251046 Blind hole termination of pin to pcb |
| 12/16/2004 | US20040250750 Functionalised nanoparticle films |
| 12/16/2004 | US20040250407 Device comprising components vertically stacked thereon and method for manufacturing the same |
| 12/16/2004 | DE10324156A1 Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät Method and apparatus for thermal protection of electronic devices in an electronic device |
| 12/16/2004 | DE10311021A1 Smart data card has a processor chip module set into a recess in the plastic card and secured by using laser energy |
| 12/16/2004 | DE102004024616A1 Wärmeableitkonstruktion Heat dissipation |
| 12/16/2004 | CA2789741A1 Process for producing modified epoxy resin |
| 12/16/2004 | CA2526461A1 Process for producing modified epoxy resin |
| 12/15/2004 | EP1487247A1 Electrical connector housing |
| 12/15/2004 | EP1487060A2 Technique for interconnecting multilayer circuit boards |
| 12/15/2004 | EP1487018A2 Flexible substrate for a semiconductor package and method of manufacturing the same |
| 12/15/2004 | EP1486912A1 Conductive paste and method of forming antenna for transponder |
| 12/15/2004 | EP1486521A1 Curable resins and curable resin compositions containing the same |
| 12/15/2004 | EP1486104A2 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 12/15/2004 | EP1485251A1 Silicone resin based composites interleaved for improved toughness |
| 12/15/2004 | EP1092338B1 Assembly of an electronic component with spring packaging |
| 12/15/2004 | CN2664341Y Circuit board edge fastener structure |
| 12/15/2004 | CN1555667A Surface mounting package |
| 12/15/2004 | CN1555577A Non-conductive substrate forming a strip or a panel, on which a plurality of carrier elements are configured |
| 12/15/2004 | CN1555576A Thin electronic label and method for making same |
| 12/15/2004 | CN1555575A Layered dielectric nanoporous materials and methods of producing same |
| 12/15/2004 | CN1555572A Inter-carrier for electronic components and method to solder-contact of such an inter-carrier |
| 12/15/2004 | CN1555563A Conductive materials with electrical stability for use in electronics devices |
| 12/15/2004 | CN1555444A Non-woven sheet of aramid floc |
| 12/15/2004 | CN1555313A High nitrogen containing triazine-phenol-aldehyde condensate |
| 12/15/2004 | CN1555309A Security tag and process for making same |
| 12/15/2004 | CN1555303A System and method for unveiling targets embedded in a multi-layered electrical circuit |
| 12/15/2004 | CN1555217A Microwave artificial band gap material constituted by using passive device |
| 12/15/2004 | CN1180667C Radio-electronic element |
| 12/15/2004 | CN1180666C Printing circuit board and method for producing printing circuit board |
| 12/15/2004 | CN1180665C Printed distributing board |
| 12/15/2004 | CN1180560C Front end module of mobile communication device |