| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/30/2004 | US20040264156 Electronic component module |
| 12/30/2004 | US20040264153 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics |
| 12/30/2004 | US20040264149 Environmental protection of serial ATA and other electronic devices |
| 12/30/2004 | US20040264148 Method and system for fan fold packaging |
| 12/30/2004 | US20040264142 Thermal standoff for close proximity thermal management |
| 12/30/2004 | US20040264141 Dissipating heat in an array of circuit components |
| 12/30/2004 | US20040264140 Power electronics component |
| 12/30/2004 | US20040264139 Process for manufacturing a cover |
| 12/30/2004 | US20040264114 Electronic apparatus including printed wiring board provided with heat generating component |
| 12/30/2004 | US20040264106 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same |
| 12/30/2004 | US20040264103 Capacitor, and capacitor manufacturing process |
| 12/30/2004 | US20040264057 Vibration proof suspension and disk unit |
| 12/30/2004 | US20040263845 Method and arrangement for aligning an optical component on a printed wiring board |
| 12/30/2004 | US20040263671 Solid-state imaging apparatus and camera using the same |
| 12/30/2004 | US20040263505 Display device |
| 12/30/2004 | US20040263313 High-voltage variable resistor |
| 12/30/2004 | US20040263308 Inductor formed between two layout layers |
| 12/30/2004 | US20040263290 Coaxial waveguide microstructures and methods of formation thereof |
| 12/30/2004 | US20040263181 Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby |
| 12/30/2004 | US20040262777 Components, methods and assemblies for multi-chip packages |
| 12/30/2004 | US20040262742 Semiconductor package with heat sink |
| 12/30/2004 | US20040262739 Circuits, multi-layer circuits, and methods of manufacture thereof |
| 12/30/2004 | US20040262737 Semiconductor module |
| 12/30/2004 | US20040262736 Tape carrier package |
| 12/30/2004 | US20040262735 Semiconductor device and production method thereof |
| 12/30/2004 | US20040262645 Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
| 12/30/2004 | US20040262644 Hybrid integrated circuit device |
| 12/30/2004 | US20040262582 Conducting inks |
| 12/30/2004 | US20040262367 Forming a desired fillet on the peripheral portion of a metal circuit; brazing |
| 12/30/2004 | US20040262278 Soldering method and apparatus |
| 12/30/2004 | US20040262040 Printed-wiring board and electronic device |
| 12/30/2004 | US20040262039 Bond finger on via substrate, process of making same, package made thereby, and method of assembling same |
| 12/30/2004 | US20040262036 Printed circuit board trace routing method |
| 12/30/2004 | US20040262032 Multilayer composite and method for preparing the same |
| 12/30/2004 | US20040262031 Enhancement of performance of a conductive wire in a multilayered substrate |
| 12/30/2004 | US20040262030 Conductive printed board, multicore cable and ultrasonic probe using the same |
| 12/30/2004 | US20040262028 Quadrax to Twinax conversion apparatus and method |
| 12/30/2004 | US20040261700 Industrial microdeposition system for polymer light emitting diode displays , printed circuit boards and the like |
| 12/30/2004 | US20040261594 Stamping device for generally flat articles |
| 12/30/2004 | US20040261263 Systems and methods for fabricating printed circuit boards |
| 12/30/2004 | US20040261251 Ultrasonic printed circuit board transducer |
| 12/30/2004 | DE202004017377U1 Multilayer flexible circuit board, has opposing flexible conducting structures forming electrical contact region, and upper/lower threads connecting opposing conducting structures in shape-locking manner |
| 12/30/2004 | DE10324737A1 Adhesive film for bonding polyimide, especially in flexible printed circuit boards, contains thermoplastic polymer and-or thermoplastic elastomer, at least one resin and organically-modified layer silicate or bentonite |
| 12/30/2004 | DE102004017984A1 Electrical board manufacture used in power electronics, involves setting conductive strips and heat sinks on conductive layers on both sides of non-conducting base material and fixing heat-dissipating components on conductive strips |
| 12/30/2004 | DE102004008897A1 Integration von Motorraumelektronik Integration of the engine compartment electronics |
| 12/29/2004 | WO2004114737A1 Dissipating heat in an array of circuit components |
| 12/29/2004 | WO2004114734A1 Circuit assembly and method of its manufacture |
| 12/29/2004 | WO2004114733A1 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization |
| 12/29/2004 | WO2004114732A1 Material including a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (poss) filler |
| 12/29/2004 | WO2004114217A2 Inspection system for and method of inspecting deposits printed on workpieces |
| 12/29/2004 | WO2004114029A1 Ground connection of a printed circuit board placed in a wristwatch type electronic device |
| 12/29/2004 | WO2004113935A2 Test fixture for impedance measurements |
| 12/29/2004 | WO2004113594A2 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles |
| 12/29/2004 | WO2004113466A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same |
| 12/29/2004 | WO2004113427A2 Nanoporous laminates |
| 12/29/2004 | WO2004113411A1 Polyphosphonate flame retardant curing agent for epoxy resin |
| 12/29/2004 | WO2004113327A1 Epoxy compound and cured epoxy resin product |
| 12/29/2004 | WO2004113065A1 Electrically conductive sheet whose electrically conductive layers on front and back surfaces are electrically connected to each other through through-holes |
| 12/29/2004 | WO2004113041A2 Method for producing a ceramic/metal substrate |
| 12/29/2004 | WO2004113023A1 Chemical-solution supplying apparatus |
| 12/29/2004 | WO2004096730A3 Ceramic composition and method for making the composition |
| 12/29/2004 | EP1492396A2 A thermal management device and method of making such a device |
| 12/29/2004 | EP1492201A2 Connection pin for connecting two circuit plates |
| 12/29/2004 | EP1492165A2 Electronic component module |
| 12/29/2004 | EP1492164A1 Method of manufacturing heat conductive substrate |
| 12/29/2004 | EP1492119A2 DVD apparatus |
| 12/29/2004 | EP1491927A1 Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method |
| 12/29/2004 | EP1491077A1 Control device |
| 12/29/2004 | EP1491058A1 Modular broadcast television products |
| 12/29/2004 | EP1490908A2 Power module comprising at least two substrates and method for producing the same |
| 12/29/2004 | CN1559162A Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board |
| 12/29/2004 | CN1559091A Battery pack and thermostat used for it |
| 12/29/2004 | CN1558712A Multilayer substrate module and wireless portable terminal |
| 12/29/2004 | CN1558711A A manufacturing method of microstrip gas compartment detector substrate |
| 12/29/2004 | CN1558710A Circuit board having deformation interrupting section and circuit board forming method |
| 12/29/2004 | CN1558409A Optical head device, optical disk apparatus using optical head device, and heat radiation mechanism |
| 12/29/2004 | CN1558207A Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics |
| 12/29/2004 | CN1182766C Electro-deposition copper foil through surface-processing, its mfg. method and use thereof |
| 12/29/2004 | CN1182764C Method for producing ceramic substrate |
| 12/29/2004 | CN1182762C High-speed circuit board with high-dielectric coefficient insulating material to lower wire impedance |
| 12/29/2004 | CN1182654C Electronic element and its mfg. method |
| 12/29/2004 | CN1182631C Electrical connector having customizable circuit board wafers |
| 12/29/2004 | CN1182621C Radio-frequency signal output module with radio-frequency power amplifier and isolation elements |
| 12/29/2004 | CN1182579C Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method |
| 12/29/2004 | CN1182506C 液晶显示器 LCD Monitor |
| 12/29/2004 | CN1182197C Size for filling through-hole and printing circuit board with the same size |
| 12/29/2004 | CA2525856A1 Polyphosphonate flame retardant curing agent for epoxy resin |
| 12/28/2004 | US6836669 Portable telephone provided with image pickup device |
| 12/28/2004 | US6836401 Capacitor, laminated capacitor, and capacitor built-in-board |
| 12/28/2004 | US6836397 Electrostatic discharge protection apparatus for a circuit board |
| 12/28/2004 | US6836390 Hard disk drive comprising a flexible printed circuit with a hole |
| 12/28/2004 | US6836310 Liquid crystal display device |
| 12/28/2004 | US6836138 Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same |
| 12/28/2004 | US6836018 Thermal-stress-absorbing interface structure between a semiconductor integrated circuit chip and a surface-mount structure; includes polymer layers, each having a different modulus of elasticity |
| 12/28/2004 | US6836016 Electromagnetic coupler alignment |
| 12/28/2004 | US6836011 Semiconductor chip mounting structure with movable connection electrodes |
| 12/28/2004 | US6836005 Semiconductor device |
| 12/28/2004 | US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 12/28/2004 | US6835897 Warpage preventing substrate |
| 12/28/2004 | US6835896 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device |