| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/28/2004 | US6797891 Flexible interconnect cable with high frequency electrical transmission line |
| 09/28/2004 | US6797890 High frequency module device and method for its preparation |
| 09/28/2004 | US6797889 Assembly of power circuits and numerical data printed on a multilayer board |
| 09/28/2004 | US6797888 Junction flexible wiring circuit board |
| 09/28/2004 | US6797881 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 09/28/2004 | US6797821 Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins |
| 09/28/2004 | US6797750 Flame-retardant epoxy resin composition, molded article thereof, and electronic part |
| 09/28/2004 | US6797662 Placing a silver-containing material in contact with surface of steel, heating steel in an oxidizing atmosphere to cause ceramic surface layer to form and to cause silver to occur in and create electroconductive pathways through the layer |
| 09/28/2004 | US6797616 Circuit boards containing vias and methods for producing same |
| 09/28/2004 | US6797543 Process for manufacturing IC card |
| 09/28/2004 | US6797392 Electronics |
| 09/28/2004 | US6797367 Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board |
| 09/28/2004 | US6797345 Thermotropic liquid-crystalline polyester, containing a combination of an aromatic dicarboxylic acid, aromatic diol and aromatic hydroxycarboxylic acid |
| 09/28/2004 | US6797145 Current carrying structure using voltage switchable dielectric material |
| 09/28/2004 | US6797093 Sintering an unsintered laminated body formed by laminating together first and second green sheets capable of exhibiting different shrinking behaviors during a sintering process; inhibit the undesired shrinkage |
| 09/28/2004 | US6797092 Method and apparatus for manufacturing monolithic ceramic electronic component |
| 09/28/2004 | US6797018 Solid-state energy storage module employing integrated interconnect board |
| 09/28/2004 | US6796847 Electrical connector for telecommunications applications |
| 09/28/2004 | US6796808 Electric junction box |
| 09/28/2004 | US6796807 Adapter for surface mount devices to through hole applications |
| 09/28/2004 | US6796804 Circuit card package including a parent card and capable of accommodating at least one child card |
| 09/28/2004 | US6796803 Computer system, switch connector, and method for controlling operations of the computer system |
| 09/28/2004 | US6796027 Method of manufacturing printed wiring board |
| 09/24/2004 | CA2462036A1 Transformers or inductors (transductor) and antennas manufactured from conductive loaded resin-based materials |
| 09/23/2004 | WO2004082352A2 Method and device for controlling or influencing the printing process used for solder paste printing |
| 09/23/2004 | WO2004082345A2 Method and device for aligning a substrate and a printing screen during solder paste printing |
| 09/23/2004 | WO2004082344A1 A substrate structure, a method and an arrangement for producing such substrate structure |
| 09/23/2004 | WO2004082343A1 Method for high-frequency tuning an electrical device, and a printed circuit board suitable therefor |
| 09/23/2004 | WO2004082342A1 A method and device for protection of a component or module |
| 09/23/2004 | WO2004082180A2 Method for optimizing high frequency performance of via structures |
| 09/23/2004 | WO2004082080A1 Connection structure for coaxial connector and multilayer substrate |
| 09/23/2004 | WO2004082022A2 Method for producing an electronic component or module and a corresponding component or module |
| 09/23/2004 | WO2004082019A1 Printed wiring board, method for manufacturing same, lead frame package and optical module |
| 09/23/2004 | WO2004081952A1 Polymer composite high-dielectric-constant material, multilayer printed circuit board and module board |
| 09/23/2004 | WO2004081079A1 Curable dielectric polynorbornene composition and circuit boards made therefrom |
| 09/23/2004 | WO2004081076A1 Polymeric epoxy resin composition |
| 09/23/2004 | WO2004080897A1 Heat-resistant aluminum hydroxide and method for preparation thereof |
| 09/23/2004 | WO2004061954A3 Electronic unit integrated into a flexible polymer body |
| 09/23/2004 | WO2004001567A3 Tablet computing device with three-dimensional docking support |
| 09/23/2004 | US20040186690 System and method for tracking engineering changes relating to a circuit card |
| 09/23/2004 | US20040186220 Polymer-wrapped single wall carbon nanotubes |
| 09/23/2004 | US20040185714 Coaxial dual pin sockets for high speed I/O applications |
| 09/23/2004 | US20040185697 Computer system, switch connector, and method for controlling operations of the comuter system |
| 09/23/2004 | US20040185688 Connector interface pad for structurally integrated wiring |
| 09/23/2004 | US20040185667 Method of continuous processing of thin-film batteries and like devices |
| 09/23/2004 | US20040185388 Printed circuit board, method for producing same, and ink therefor |
| 09/23/2004 | US20040185379 Multilayer circuit component and method for manufacturing the same |
| 09/23/2004 | US20040185310 Battery device with conductive layer, cathode, anode and electrolyte layer for electrical isolation |
| 09/23/2004 | US20040185284 Ultrathin charge dissipation coatings |
| 09/23/2004 | US20040184654 Optimizing selection of reference markings used in estimating the position of an imaging device |
| 09/23/2004 | US20040184301 Arrangement of integrated circuits in a memory module |
| 09/23/2004 | US20040184300 Arrangement of integrated circuits in a memory module |
| 09/23/2004 | US20040184299 Arrangement of integrated circuits in a memory module |
| 09/23/2004 | US20040184293 Switching power supply unit |
| 09/23/2004 | US20040184272 Substrate for light-emitting diode (LED) mounting including heat dissipation structures, and lighting assembly including same |
| 09/23/2004 | US20040184255 Method for wave soldering of surface mounted light emitting diodes |
| 09/23/2004 | US20040184254 Placement structure of an integrated motherboard for small form factor computer |
| 09/23/2004 | US20040184248 Power delivery apparatus, systems, and methods |
| 09/23/2004 | US20040184247 Near-end crosstalk compensation at multi-stages |
| 09/23/2004 | US20040184244 Circuit board assembling structure |
| 09/23/2004 | US20040184219 Assembly of semiconductor device, interposer and substrate |
| 09/23/2004 | US20040184128 Optical deflector and optical scanner having the optical deflector |
| 09/23/2004 | US20040183985 Liquid crystal display apparatus |
| 09/23/2004 | US20040183959 Liquid crystal display device having flexible substrates |
| 09/23/2004 | US20040183859 Ink-jet head unit |
| 09/23/2004 | US20040183743 Enhanced antenna using flexible circuitry |
| 09/23/2004 | US20040183648 Strain sensors and housings and circuit boards with integrated strain sensors |
| 09/23/2004 | US20040183645 Inductance element, laminated electronic component, laminated electronic component module and method for producing these element, component and module |
| 09/23/2004 | US20040183524 Method and apparatus for implementing printed circuit board high potential testing to identify latent defects |
| 09/23/2004 | US20040183458 Uninterruptible led bulb string structure |
| 09/23/2004 | US20040183213 Semiconductor packaging substrate and method of producing the same |
| 09/23/2004 | US20040183212 Electronic package with strengthened conductive pad |
| 09/23/2004 | US20040183211 Chip carrier with optimized circuitization pattern |
| 09/23/2004 | US20040183193 Packaging method, packaging structure and package substrate for electronic parts |
| 09/23/2004 | US20040183186 Low-profile electronic circuit module and method for manufacturing the same |
| 09/23/2004 | US20040183183 Integrated circuit stacking system and method |
| 09/23/2004 | US20040183094 Structure to accommodate increase in volume expansion during solder reflow |
| 09/23/2004 | US20040182837 Stripping insulation from flat cables |
| 09/23/2004 | US20040182819 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 09/23/2004 | US20040182604 Pinned electronic package with strengthened conductive pad |
| 09/23/2004 | US20040182601 Substrate for circuit wiring |
| 09/23/2004 | US20040182594 Anti-abrasive mechanism confining flat flexible cable in position in flatbed image scanner |
| 09/23/2004 | US20040182265 Wiring substrate |
| 09/23/2004 | US20040181940 Conductor board and method for producing a conductor board |
| 09/23/2004 | US20040181932 System and method for manufacturing a hard disk drive suspension flexure and for preventing damage due to electrical arcing |
| 09/23/2004 | DE20122195U1 Trägersubstrat für elektronische Bauteile Substrate for electronic components |
| 09/23/2004 | DE19715926B4 Herstellungsverfahren für einen externen Anschluß für ein Kugelgitterarray-(BGA)Halbleiterbauteil Manufacturing method for an external connection for a Kugelgitterarray- (BGA) semiconductor device |
| 09/23/2004 | DE10310503A1 Current measurement arrangement has a test current source of known value that permits the calibration of a measurement resistance prior to, or during, current measurement processes |
| 09/23/2004 | DE10310498A1 Device for detecting an electric current including a wiring carrier and a resistance film useful in automobile construction, e.g. for current sensors, battery energy management modules, high current starter-generator modules |
| 09/23/2004 | DE10309805A1 Flammschutzmittel-Dispersion Flame retardant dispersion |
| 09/23/2004 | DE102004010883A1 Schaltungsplatine Circuit board |
| 09/23/2004 | DE102004010013A1 Verfahren zum Kontaktieren eines Chipmoduls A method for contacting a chip module |
| 09/23/2004 | DE102004001763A1 Magnetooptischer Kopf und magnetooptische Speicheranordnung Magneto Optical head and magneto-optical storage device |
| 09/23/2004 | DE10031487B4 Schaltungsverbindungsanordnung in einer Fahrzeugtür Circuit connection arrangement in a vehicle door |
| 09/22/2004 | EP1460890A1 Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 09/22/2004 | EP1460889A2 Plastic package with high heat dissipation and method for manufacturing the same |
| 09/22/2004 | EP1460888A1 Low-profile electronic circuit module and method for manufacturing the same |
| 09/22/2004 | EP1460887A2 Connector interface pad for structurally integrated wiring |
| 09/22/2004 | EP1460712A1 Enhanced coil antenna performance using flexible printed circuit |
| 09/22/2004 | EP1460690A1 Optimization of routing layers and board space requirements in a BGA package (fka BGA package) |