| Patents for H05K 1 - Printed circuits (98,583) |
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| 10/27/2004 | CN1541052A Method of assembling electronic parts |
| 10/27/2004 | CN1541051A Soldering resist compsn. and printed wiring board |
| 10/27/2004 | CN1541048A Mfg. method of circuit substrate, circuit substrate and liquid spraying appts |
| 10/27/2004 | CN1541047A Pins of outputting high current |
| 10/27/2004 | CN1541046A Structure of signal transferring |
| 10/27/2004 | CN1541045A Structure of signal transferring |
| 10/27/2004 | CN1541044A Structure of circuit board in use for product of household electrical appliance |
| 10/27/2004 | CN1541043A Structure of circuit board in use for product of household electrical appliance |
| 10/27/2004 | CN1540995A Improved backboard possessing C typed layout structure |
| 10/27/2004 | CN1540824A Casing of electrical connector |
| 10/27/2004 | CN1540750A Surface-mounting high frequency modular |
| 10/27/2004 | CN1540749A Thin flm bearing belt of mounting electronic parts, its prodn. method and printing screen for coating welding resistance agent |
| 10/27/2004 | CN1540692A 镀覆接线端 Plated terminals |
| 10/27/2004 | CN1539862A Novel polyester, its film and laminated material |
| 10/27/2004 | CN1173611C Multi-layer printed circuit board |
| 10/27/2004 | CN1173610C Printed circuit boards |
| 10/27/2004 | CN1173609C Single system module for electric/electronic equipment |
| 10/27/2004 | CN1173439C 印制电路板和连接器组件 Printed circuit board and connector assembly |
| 10/27/2004 | CN1173371C Conductive formation and electronic equipment using such conductive formation |
| 10/27/2004 | CN1173257C Upper chip for secondary board of optic mouse and optical mouse using same |
| 10/27/2004 | CN1172872C Glass ceramics composition and electronic parts and multilayered LC multiple component using same |
| 10/27/2004 | CN1172871C Glass-ceramic composition for ceramic-type electromic element, ceramic-type electronic element and process for preparing malti-layer ceramic-type electronic element |
| 10/26/2004 | US6810138 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 10/26/2004 | US6809943 Programmable power supply |
| 10/26/2004 | US6809937 Method and apparatus for shock and vibration isolation of a circuit component |
| 10/26/2004 | US6809935 Thermally compliant PCB substrate for the application of chip scale packages |
| 10/26/2004 | US6809688 Radio communication device with integrated antenna, transmitter, and receiver |
| 10/26/2004 | US6809617 Edge plated transmission line and switch integrally formed therewith |
| 10/26/2004 | US6809608 Transmission line structure with an air dielectric |
| 10/26/2004 | US6809583 Electronic device for supplying DC power and having noise filter mounted with excellent noise reduction |
| 10/26/2004 | US6809416 Low thermal resistance; heat spreader in thermal contact with the semiconductor die; connected by vias to selected conductive terminals on the second surface |
| 10/26/2004 | US6809415 Printed-circuit board and method of manufacture thereof |
| 10/26/2004 | US6809413 Microelectronic device package with an integral window mounted in a recessed lip |
| 10/26/2004 | US6809403 Fault tolerant electrical circuit and method |
| 10/26/2004 | US6809367 Device for interconnecting, in three dimensions, electronic components |
| 10/26/2004 | US6809268 Printed wiring substrate and method for fabricating the same |
| 10/26/2004 | US6809260 Apparatus and method for an integrated high-performance electrical interconnect |
| 10/26/2004 | US6809255 Radio frequency ground shield |
| 10/26/2004 | US6809130 Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same |
| 10/26/2004 | US6809046 Non-heat cleaned fabrics and products including the same |
| 10/26/2004 | US6809045 Screen ink printed film carrier and electrically modulated device using same |
| 10/26/2004 | US6808866 Steps of pressing, etching and insulating are executed on a flexible insulation tape in reel- to-reel fashion. thereafter, the flexible insulation tape is punched to form sprocket holes and cut along the parallel lines where the |
| 10/26/2004 | US6808825 Copper alloy foil |
| 10/26/2004 | US6808818 Can be bonded to a metal film, particularly, a stainless steel film and a copper film, with a high strength and which can be easily etched |
| 10/26/2004 | US6808798 Semiconductor chips are mounted on a heat conductive resin substrate which polybenzazole fibers are oriented in a thick direction and/or in a direction of a surface of a resin substrate. |
| 10/26/2004 | US6808676 Method and device for producing shaped ceramic bodies using setter plates |
| 10/26/2004 | US6808670 Process for manufacturing inorganic article |
| 10/26/2004 | US6808642 Method for producing multilayer substrate and electronic part, and multilayer electronic part |
| 10/26/2004 | US6808578 Method for producing ceramic substrate |
| 10/26/2004 | US6808397 Mounting structure of connector for use with circuit board |
| 10/26/2004 | US6807732 Methods for modifying inner-layer circuit features of printed circuit boards |
| 10/26/2004 | US6807731 Electromagnetic interference shield in the form of a thin metal film or foil; reduces amount of electromagnetic interference emissions from penetrating within the assembly to the circuit board |
| 10/26/2004 | US6807730 Pad structure of semiconductor package |
| 10/26/2004 | CA2376697C An adhesion promoting layer for use with epoxy prepregs |
| 10/21/2004 | WO2004091270A1 Array for electrical connection |
| 10/21/2004 | WO2004091267A1 Method for packaging small size memory cards |
| 10/21/2004 | WO2004091266A1 Circuit board and process for producing the same |
| 10/21/2004 | WO2004091054A1 Electronic component provided with a single connector grouping together radio frequency signals and digital signals, corresponding support, electronic system and method for the implementation thereof |
| 10/21/2004 | WO2004090942A2 Thermally conductive adhesive composition and process for device attachment |
| 10/21/2004 | WO2004090912A1 Paste composition and dielectric composition using the same |
| 10/21/2004 | WO2004090893A1 System and method for improving hard drive actuator lead attachment |
| 10/21/2004 | WO2004090723A2 A high reliability memory module with a fault tolerant address and command bus |
| 10/21/2004 | WO2004090701A2 Physical presence determination in a trusted platform |
| 10/21/2004 | WO2004067647A3 High conductivity inks with low minimum curing temperatures |
| 10/21/2004 | US20040209984 Flame resistant thermoplastic moulding materials |
| 10/21/2004 | US20040209522 Connector |
| 10/21/2004 | US20040209490 Modules having a plurality of contacts along edges thereof configured to conduct signals to the modules and further having a plurality of contacts along edges thereof configured to conduct signals from the modules |
| 10/21/2004 | US20040209399 Electronic parts packaging structure and method of manufacturing the same |
| 10/21/2004 | US20040209398 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 10/21/2004 | US20040209397 Semiconductor package for improved recognition and mounting |
| 10/21/2004 | US20040209396 Electronic unit integrated into a flexible polymer body |
| 10/21/2004 | US20040209197 Photogravure press and method for manufacturing multilayer-ceramic electronic component |
| 10/21/2004 | US20040209106 thin films comprising metallic carriers, barriers layers, a second metallic layer selected from zinc, copper and cobalt, and/or arsenic, manganese, tin, vanadium, molybdenum, antimony or tungsten, and electrodeposited overcoating, used for printed circuits; electrical and electronic apparatus; multilayer |
| 10/21/2004 | US20040209091 perforating sheets to improve accuracy of processing and plating throwing power |
| 10/21/2004 | US20040209055 Multilayer ceramic composition |
| 10/21/2004 | US20040209054 Circuit elements having an embedded conductive trace and methods of manufacture |
| 10/21/2004 | US20040208933 Method for manufacturing multilayer circuit board |
| 10/21/2004 | US20040208633 Optical communication device, optical transmitter, optical transmitter-receiver, and optical transmission system |
| 10/21/2004 | US20040208461 Transparent substrate and hinged optical assembly |
| 10/21/2004 | US20040208416 Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| 10/21/2004 | US20040207990 Stair-step signal routing |
| 10/21/2004 | US20040207989 System and method for improving power distribution current measurement on printed circuit boards |
| 10/21/2004 | US20040207975 Electronic circuit unit having mounting structure with high soldering reliability |
| 10/21/2004 | US20040207496 [method for tuning parameter of rf transmission line and structure thereof] |
| 10/21/2004 | US20040207487 High-frequency electronic component and its designing method |
| 10/21/2004 | US20040207421 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 10/21/2004 | US20040207134 Method of manufacturing ceramic laminated body |
| 10/21/2004 | US20040207094 Package substrate and a flip chip mounted semiconductor device |
| 10/21/2004 | US20040207090 Low capacitance wiring layout and method for making same |
| 10/21/2004 | US20040207073 Electronic apparatus |
| 10/21/2004 | US20040207053 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 10/21/2004 | US20040206968 Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
| 10/21/2004 | US20040206916 Printed circuit board with integrated antenna and implantable sensor processing system with integrated printed circuit board antenna |
| 10/21/2004 | US20040206829 throughplating of flexible printed boards |
| 10/21/2004 | US20040206546 Method for producing a ceramic substrate and ceramic substrate |
| 10/21/2004 | US20040206534 Power electronics component |
| 10/21/2004 | US20040206457 Intensive machine for performing a plurality of processes in fabrication of multilayer substrate |
| 10/21/2004 | US20040206172 In-vehicle electronic device, thermal flowmeter and electronic circuit board |
| 10/21/2004 | DE19930197B4 Flüssigkristallanzeige und Verfahren zu deren Herstellung Liquid crystal display and method for their preparation |
| 10/21/2004 | DE10314909A1 Multi-pole flat flexible foil cable e.g. for circuit boards, has matched width of contact surfaces and/or spacing of adjacent contact surfaces |