Patents for H05K 1 - Printed circuits (98,583) |
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01/27/2005 | WO2005008698A1 Surface mounting type part |
01/27/2005 | WO2005008663A1 An improved method of head stack assembly flexible circuit assembly attached to an actuator arm |
01/27/2005 | WO2005007742A1 Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same |
01/27/2005 | WO2005007725A1 Asymmetric polymer film, method for the production and the utilization thereof |
01/27/2005 | WO2005007724A1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
01/27/2005 | WO2004100227A3 Application specific heat-dissipating apparatus that provides electrical isolation for components |
01/27/2005 | WO2004099728A3 Measuring device comprising a probe |
01/27/2005 | WO2004061960A3 Semiconductor device power interconnect striping |
01/27/2005 | WO2004006173A3 Method for the production of electrically-conducting connections on chipcards |
01/27/2005 | US20050022149 Generating a split power plane of a multi-layer printed circuit board |
01/27/2005 | US20050020803 Resin containing transition metal oxide particles, the melting point of the biaxially oriented thermoplastic resin film is higher than the melting point of the thermoplastic resin; heat resistance, thermal dimensional stability |
01/27/2005 | US20050020801 Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
01/27/2005 | US20050020781 Resin composition containing rubber component, and film and electronic part using the same |
01/27/2005 | US20050020702 Organic compositions |
01/27/2005 | US20050020079 Structure having flush circuit features and method of making |
01/27/2005 | US20050020062 Substrate with multiple conductive layers and methods for making and using same |
01/27/2005 | US20050019707 Method for forming patterned insulating elements and methods for making electron source and image display device |
01/27/2005 | US20050019654 Battery provided with terminals |
01/27/2005 | US20050019599 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil |
01/27/2005 | US20050019598 The laminate of a electrolytically plated copper film and a polyimide film using no adhesive and on which a fine circuit pattern can be formed; copper film has at most 200 protrusions having a diameter of >15 mu m (abnormally large protrusions) on a surface not facing the polyimide film; peel strength |
01/27/2005 | US20050019592 cyano-functional styrenic polymers with high dielectric constant; high observed device mobilities; capable of being solution-deposited, e.g., by spin-coating |
01/27/2005 | US20050019541 Lightweight circuit board with conductive constraining cores |
01/27/2005 | US20050019535 Lightweight circuit board with conductive constraining cores |
01/27/2005 | US20050019534 Method for producing a hybrid product composed of several wiring planes, as well as a sensor or evaluation circuit and a control device with hybrid product produced by the inventive method |
01/27/2005 | US20050019527 Lamination of liquid crystal polymer dielectric films |
01/27/2005 | US20050019519 Tamper-evident, heat resistant cast label stock |
01/27/2005 | US20050019495 Method for producing contact terminal with textured surface and use thereof |
01/27/2005 | US20050019203 Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate |
01/27/2005 | US20050018994 Active and passive to-can extension boards |
01/27/2005 | US20050018972 Housing and mounting structure |
01/27/2005 | US20050018495 Arrangement of integrated circuits in a memory module |
01/27/2005 | US20050018412 Pitch change and chip scale stacking system |
01/27/2005 | US20050018410 Printed circuit board assembly with integrated connector |
01/27/2005 | US20050018409 Flexible substrate and electronic device |
01/27/2005 | US20050018407 Stack up assembly |
01/27/2005 | US20050018406 Stack up assembly |
01/27/2005 | US20050018390 Electronic control unit |
01/27/2005 | US20050018356 Wireless suspension design to accommodate multiple drive designs |
01/27/2005 | US20050018352 Flexible printed circuit for spindle motor and disk drive having the same |
01/27/2005 | US20050017918 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium |
01/27/2005 | US20050017902 Dielectric antenna module |
01/27/2005 | US20050017838 Signal processing circuit board with variable resistor which is hardly declined in the mechanical strength while its variable resistor is not limited to one particular location for the installation |
01/27/2005 | US20050017830 Enclosure and substrate structure for a tuner module |
01/27/2005 | US20050017827 Signal transmission structure |
01/27/2005 | US20050017740 Module part |
01/27/2005 | US20050017375 Ball grid array package substrate and method for manufacturing the same |
01/27/2005 | US20050017373 Electronic circuit device and its manufacturing method |
01/27/2005 | US20050017347 Circuit module and manufacturing method thereof |
01/27/2005 | US20050017345 Flexible tape electronics packaging and methods of manufacture |
01/27/2005 | US20050017344 Interconnecting component |
01/27/2005 | US20050017337 Stacking apparatus for integrated circuit assembly |
01/27/2005 | US20050017271 Multilayered substrate for semiconductor device and method of manufacturing same |
01/27/2005 | US20050017081 Memory card, and receptacle for same |
01/27/2005 | US20050017054 Flyback transformer wire attach method to printed circuit board |
01/27/2005 | US20050016897 Connection structure of circuit substrate |
01/27/2005 | US20050016767 Electronic module with dual connectivity |
01/27/2005 | US20050016766 Backplane configuration with shortest-path-relative-shift routing |
01/27/2005 | US20050016765 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
01/27/2005 | US20050016764 Wiring substrate for intermediate connection and multi-layered wiring board and their production |
01/27/2005 | US20050016763 Circuit board with embedded components and method of manufacture |
01/27/2005 | US20050016749 Method and system for optimizing routing layers and board space requirements for a ball grid array land pattern |
01/27/2005 | US20050016746 Ground shield structure |
01/27/2005 | US20050016325 Metal slurry for electrode formation and production method of the same |
01/27/2005 | US20050015976 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
01/27/2005 | DE202004018336U1 Speichermodul Memory module |
01/27/2005 | DE10330754A1 Manufacturing electrical circuit, involves using regions between metallized free areas as contact pins for electrical connection of individual conducting tracks to external circuits or connecting plugs |
01/27/2005 | DE10330448A1 Verfahren zum platzsparenden Anbringen elektrischer Leitungen A method for space-saving mounting electrical lines |
01/27/2005 | DE10329267A1 Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces |
01/27/2005 | DE10328776B3 Stanzvorrichtung für flächige Gegenstände Punching device for flat objects |
01/27/2005 | DE10328362A1 Preparation of conductive substrate by light exposure of a photosensitive layer of a conductive substrate, etching and removal of the photosensitive layer |
01/27/2005 | DE10328282A1 Verbindungsstift für die Verbindung zweier Platinen Connecting pin for connecting two boards |
01/27/2005 | DE10326989A1 Measurement device with a measurement sensor, especially for use with railway rolling stock, has a circuit board with a flexible section or area linking two adjoining rigid circuit board areas |
01/27/2005 | DE102004021570A1 Fastening and/or contacting appliance for flexible solar cells onto circuit boards, enabling conductive and mechanically solid connection, even at extreme temperature fluctuations |
01/27/2005 | DE10030436B4 Verfahren zur Herstellung einer Masse für eine elektrisch leitfähige Dickschicht, Masse für eine elektrisch leitfähige Dickschicht und laminiertes keramisches Elektronikteil A process for preparing a composition for an electrically conductive thick film composition for an electrically conductive thick film and laminated ceramic electronic part |
01/26/2005 | EP1501341A2 Arrangement for carrying electrical conductors |
01/26/2005 | EP1501340A2 Flexible substrate and electronic device |
01/26/2005 | EP1501127A2 Power semiconductor module with base plate having high bending stiffness |
01/26/2005 | EP1501104A1 Circuit board having resistor and method for manufacturing the circuit board |
01/26/2005 | EP1500743A1 Heat-resistant synthetic fiber sheet |
01/26/2005 | EP1500316A1 Method for creating a trench structure in a polymer substrate |
01/26/2005 | EP1500315A1 Low loss dielectric material for printed circuit boards and integrated circuit chip packaging |
01/26/2005 | EP1500314A1 Electrically insulating body, and electronic device |
01/26/2005 | EP1500168A1 Completely integrated ethernet connector |
01/26/2005 | EP1500136A1 Semiconductor device and method of manufacturing same |
01/26/2005 | EP1500043A2 Manufacturing method for a wireless communication device and manufacturing apparatus |
01/26/2005 | CN2674701Y 电连接器 The electrical connector |
01/26/2005 | CN1571867A Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
01/26/2005 | CN1571630A A shielding arrangement |
01/26/2005 | CN1571629A Circuit arrangement for components to be cooled and corresponding cooling method |
01/26/2005 | CN1571626A Bonding pads for a printed circuit board |
01/26/2005 | CN1571623A Flexible circuit board connector capable of preventing interference from electromagnetic wave |
01/26/2005 | CN1571622A Separately controlled printed circuit board |
01/26/2005 | CN1571621A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
01/26/2005 | CN1571620A Structure of substrate, structure of insulating layer of substrate, and manufacturing method thereof |
01/26/2005 | CN1571076A Low cost shielded cable manufactured from conductive loaded resin-based materials |
01/26/2005 | CN1571074A Conductive rubber and electronic component using same |
01/26/2005 | CN1570717A Signal transmission device for liquid crystal display |
01/26/2005 | CN1570657A Circuit board, disk apparatus and methods of identifying a head ic |
01/26/2005 | CN1569995A Method and apparatus for production of fluorine-containing polyimide film |
01/26/2005 | CN1186972C 印制电路板 Printed circuit board |