Patents for H05K 1 - Printed circuits (98,583)
01/2005
01/27/2005WO2005008698A1 Surface mounting type part
01/27/2005WO2005008663A1 An improved method of head stack assembly flexible circuit assembly attached to an actuator arm
01/27/2005WO2005007742A1 Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same
01/27/2005WO2005007725A1 Asymmetric polymer film, method for the production and the utilization thereof
01/27/2005WO2005007724A1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same
01/27/2005WO2004100227A3 Application specific heat-dissipating apparatus that provides electrical isolation for components
01/27/2005WO2004099728A3 Measuring device comprising a probe
01/27/2005WO2004061960A3 Semiconductor device power interconnect striping
01/27/2005WO2004006173A3 Method for the production of electrically-conducting connections on chipcards
01/27/2005US20050022149 Generating a split power plane of a multi-layer printed circuit board
01/27/2005US20050020803 Resin containing transition metal oxide particles, the melting point of the biaxially oriented thermoplastic resin film is higher than the melting point of the thermoplastic resin; heat resistance, thermal dimensional stability
01/27/2005US20050020801 Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins
01/27/2005US20050020781 Resin composition containing rubber component, and film and electronic part using the same
01/27/2005US20050020702 Organic compositions
01/27/2005US20050020079 Structure having flush circuit features and method of making
01/27/2005US20050020062 Substrate with multiple conductive layers and methods for making and using same
01/27/2005US20050019707 Method for forming patterned insulating elements and methods for making electron source and image display device
01/27/2005US20050019654 Battery provided with terminals
01/27/2005US20050019599 Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
01/27/2005US20050019598 The laminate of a electrolytically plated copper film and a polyimide film using no adhesive and on which a fine circuit pattern can be formed; copper film has at most 200 protrusions having a diameter of >15 mu m (abnormally large protrusions) on a surface not facing the polyimide film; peel strength
01/27/2005US20050019592 cyano-functional styrenic polymers with high dielectric constant; high observed device mobilities; capable of being solution-deposited, e.g., by spin-coating
01/27/2005US20050019541 Lightweight circuit board with conductive constraining cores
01/27/2005US20050019535 Lightweight circuit board with conductive constraining cores
01/27/2005US20050019534 Method for producing a hybrid product composed of several wiring planes, as well as a sensor or evaluation circuit and a control device with hybrid product produced by the inventive method
01/27/2005US20050019527 Lamination of liquid crystal polymer dielectric films
01/27/2005US20050019519 Tamper-evident, heat resistant cast label stock
01/27/2005US20050019495 Method for producing contact terminal with textured surface and use thereof
01/27/2005US20050019203 Silver alloy material, circuit substrate, electronic device, and method for manufacturing circuit substrate
01/27/2005US20050018994 Active and passive to-can extension boards
01/27/2005US20050018972 Housing and mounting structure
01/27/2005US20050018495 Arrangement of integrated circuits in a memory module
01/27/2005US20050018412 Pitch change and chip scale stacking system
01/27/2005US20050018410 Printed circuit board assembly with integrated connector
01/27/2005US20050018409 Flexible substrate and electronic device
01/27/2005US20050018407 Stack up assembly
01/27/2005US20050018406 Stack up assembly
01/27/2005US20050018390 Electronic control unit
01/27/2005US20050018356 Wireless suspension design to accommodate multiple drive designs
01/27/2005US20050018352 Flexible printed circuit for spindle motor and disk drive having the same
01/27/2005US20050017918 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium
01/27/2005US20050017902 Dielectric antenna module
01/27/2005US20050017838 Signal processing circuit board with variable resistor which is hardly declined in the mechanical strength while its variable resistor is not limited to one particular location for the installation
01/27/2005US20050017830 Enclosure and substrate structure for a tuner module
01/27/2005US20050017827 Signal transmission structure
01/27/2005US20050017740 Module part
01/27/2005US20050017375 Ball grid array package substrate and method for manufacturing the same
01/27/2005US20050017373 Electronic circuit device and its manufacturing method
01/27/2005US20050017347 Circuit module and manufacturing method thereof
01/27/2005US20050017345 Flexible tape electronics packaging and methods of manufacture
01/27/2005US20050017344 Interconnecting component
01/27/2005US20050017337 Stacking apparatus for integrated circuit assembly
01/27/2005US20050017271 Multilayered substrate for semiconductor device and method of manufacturing same
01/27/2005US20050017081 Memory card, and receptacle for same
01/27/2005US20050017054 Flyback transformer wire attach method to printed circuit board
01/27/2005US20050016897 Connection structure of circuit substrate
01/27/2005US20050016767 Electronic module with dual connectivity
01/27/2005US20050016766 Backplane configuration with shortest-path-relative-shift routing
01/27/2005US20050016765 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
01/27/2005US20050016764 Wiring substrate for intermediate connection and multi-layered wiring board and their production
01/27/2005US20050016763 Circuit board with embedded components and method of manufacture
01/27/2005US20050016749 Method and system for optimizing routing layers and board space requirements for a ball grid array land pattern
01/27/2005US20050016746 Ground shield structure
01/27/2005US20050016325 Metal slurry for electrode formation and production method of the same
01/27/2005US20050015976 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit
01/27/2005DE202004018336U1 Speichermodul Memory module
01/27/2005DE10330754A1 Manufacturing electrical circuit, involves using regions between metallized free areas as contact pins for electrical connection of individual conducting tracks to external circuits or connecting plugs
01/27/2005DE10330448A1 Verfahren zum platzsparenden Anbringen elektrischer Leitungen A method for space-saving mounting electrical lines
01/27/2005DE10329267A1 Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces
01/27/2005DE10328776B3 Stanzvorrichtung für flächige Gegenstände Punching device for flat objects
01/27/2005DE10328362A1 Preparation of conductive substrate by light exposure of a photosensitive layer of a conductive substrate, etching and removal of the photosensitive layer
01/27/2005DE10328282A1 Verbindungsstift für die Verbindung zweier Platinen Connecting pin for connecting two boards
01/27/2005DE10326989A1 Measurement device with a measurement sensor, especially for use with railway rolling stock, has a circuit board with a flexible section or area linking two adjoining rigid circuit board areas
01/27/2005DE102004021570A1 Fastening and/or contacting appliance for flexible solar cells onto circuit boards, enabling conductive and mechanically solid connection, even at extreme temperature fluctuations
01/27/2005DE10030436B4 Verfahren zur Herstellung einer Masse für eine elektrisch leitfähige Dickschicht, Masse für eine elektrisch leitfähige Dickschicht und laminiertes keramisches Elektronikteil A process for preparing a composition for an electrically conductive thick film composition for an electrically conductive thick film and laminated ceramic electronic part
01/26/2005EP1501341A2 Arrangement for carrying electrical conductors
01/26/2005EP1501340A2 Flexible substrate and electronic device
01/26/2005EP1501127A2 Power semiconductor module with base plate having high bending stiffness
01/26/2005EP1501104A1 Circuit board having resistor and method for manufacturing the circuit board
01/26/2005EP1500743A1 Heat-resistant synthetic fiber sheet
01/26/2005EP1500316A1 Method for creating a trench structure in a polymer substrate
01/26/2005EP1500315A1 Low loss dielectric material for printed circuit boards and integrated circuit chip packaging
01/26/2005EP1500314A1 Electrically insulating body, and electronic device
01/26/2005EP1500168A1 Completely integrated ethernet connector
01/26/2005EP1500136A1 Semiconductor device and method of manufacturing same
01/26/2005EP1500043A2 Manufacturing method for a wireless communication device and manufacturing apparatus
01/26/2005CN2674701Y 电连接器 The electrical connector
01/26/2005CN1571867A Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board
01/26/2005CN1571630A A shielding arrangement
01/26/2005CN1571629A Circuit arrangement for components to be cooled and corresponding cooling method
01/26/2005CN1571626A Bonding pads for a printed circuit board
01/26/2005CN1571623A Flexible circuit board connector capable of preventing interference from electromagnetic wave
01/26/2005CN1571622A Separately controlled printed circuit board
01/26/2005CN1571621A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
01/26/2005CN1571620A Structure of substrate, structure of insulating layer of substrate, and manufacturing method thereof
01/26/2005CN1571076A Low cost shielded cable manufactured from conductive loaded resin-based materials
01/26/2005CN1571074A Conductive rubber and electronic component using same
01/26/2005CN1570717A Signal transmission device for liquid crystal display
01/26/2005CN1570657A Circuit board, disk apparatus and methods of identifying a head ic
01/26/2005CN1569995A Method and apparatus for production of fluorine-containing polyimide film
01/26/2005CN1186972C 印制电路板 Printed circuit board