| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/26/2005 | CN1186971C Printed circuit board, battery pack, and method of manufacturing printed circuit board |
| 01/26/2005 | CN1186970C Digital signal distributor of 3D structure |
| 01/26/2005 | CN1186294C Crystal glass composite article, crystal glass, insulating composite article, insulating paste and thick film circuit board |
| 01/25/2005 | US6848045 Integrated USB connector for personal token |
| 01/25/2005 | US6847529 Ultra-low impedance power interconnection system for electronic packages |
| 01/25/2005 | US6847527 Interconnect module with reduced power distribution impedance |
| 01/25/2005 | US6847525 Forced convection heat sink system with fluid vector control |
| 01/25/2005 | US6847276 Radio frequency circuit module on multi-layer substrate |
| 01/25/2005 | US6847274 Multilayer coaxial structures and resonator formed therefrom |
| 01/25/2005 | US6847220 Method for ball grid array chip packages having improved testing and stacking characteristics |
| 01/25/2005 | US6846993 Multilayer printed wiring board and its manufacturing method |
| 01/25/2005 | US6846992 Power plane splitting using a contour method |
| 01/25/2005 | US6846991 Electrical component and a shuntable/shunted electrical component and method for shunting and deshunting |
| 01/25/2005 | US6846987 Power electronics component |
| 01/25/2005 | US6846765 Silicon nitride powder, silicon nitride sintered body, sintered silicon nitride substrate, and circuit board and thermoelectric module comprising such sintered silicon nitride substrate |
| 01/25/2005 | US6846761 Reinforcement of high density circuits |
| 01/25/2005 | US6846549 Multilayer printed wiring board |
| 01/25/2005 | US6846370 Resistive materials |
| 01/25/2005 | US6846194 Cam bumplett apparatus and system |
| 01/25/2005 | US6846094 Flexible LED lighting strip |
| 01/25/2005 | US6846093 Modular mounting arrangement and method for light emitting diodes |
| 01/25/2005 | US6845557 Method for producing an electronic package possessing controlled impedance characteristics |
| 01/25/2005 | US6845555 Component alignment methods |
| 01/25/2005 | CA2199655C Air-dielectric stripline |
| 01/20/2005 | WO2005006824A1 Method for minimizing the impedance discontinuity of a via |
| 01/20/2005 | WO2005006821A2 Component for a printed circuit board and method for fitting a printed circuit board with this component |
| 01/20/2005 | WO2005006815A2 Soft light fixture |
| 01/20/2005 | WO2005006519A1 Circuit arrangement for emv-suppression of a direct current motor, and switching module |
| 01/20/2005 | WO2005006499A1 Improved method for crimping at least one connector contact on a flexible electronic circuit |
| 01/20/2005 | WO2005006454A1 Substrate for information processor and information processor |
| 01/20/2005 | WO2005006357A1 Inductive-system |
| 01/20/2005 | WO2005005142A1 Conductive sheet having more than one through hole or via hole |
| 01/20/2005 | WO2004066364A3 Binder diffusion patterning of a thick film paste layer |
| 01/20/2005 | US20050014873 10-(3-(n-phenyl maleimide))-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide derivatives; resin stabilizers; corrosion resistance, no toxic fumes; printed circuit boards; processing heat resistance, reduced migration |
| 01/20/2005 | US20050014419 Extension mechanism and method for assembling overhanging components |
| 01/20/2005 | US20050014395 System for making high-speed connections to board-mounted modules |
| 01/20/2005 | US20050014388 Polyparaxylylene film, production method therefor and semiconductor device |
| 01/20/2005 | US20050014348 Method of making a semiconductor device having an opening in a solder mask |
| 01/20/2005 | US20050014298 Memory card with raised portion |
| 01/20/2005 | US20050014091 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 01/20/2005 | US20050014035 Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board |
| 01/20/2005 | US20050014006 Surface treatment of dielectric substrate using plasma polymerization; pretreatment before copper plating; bonding strength |
| 01/20/2005 | US20050013998 Multi-layer insulative film of improved internal adhesive strength is made by combining a layer of polyimide and a high-temperature bonding layer derived from a high temperature base polymer made of an optionally blended poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl ether]) (PFA resin) |
| 01/20/2005 | US20050013989 Coating aluminum nitride sheet with tungsten powder; forming holes; filling holes with tungsten powder; sintering |
| 01/20/2005 | US20050013560 Opto-electronic module form factor having adjustable optical plane height |
| 01/20/2005 | US20050013116 Actuation membrane for application to a card slot of a system |
| 01/20/2005 | US20050013112 Industry computer structure with two expansive forms |
| 01/20/2005 | US20050013106 Peripheral card with hidden test pins |
| 01/20/2005 | US20050013088 Capacitor device and method of manufacturing the same |
| 01/20/2005 | US20050013055 Method of head stack assembly flexible circuit assembly attached to an actuator arm |
| 01/20/2005 | US20050012729 Connection member and driving device of plasma display panel |
| 01/20/2005 | US20050012585 Space saving surface-mounted inductors |
| 01/20/2005 | US20050012572 Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same |
| 01/20/2005 | US20050012566 High-frequency layered part and manufacturing method thereof |
| 01/20/2005 | US20050012402 Power source input distribution to a power supply |
| 01/20/2005 | US20050012217 Multilayer wiring board and manufacture method thereof |
| 01/20/2005 | US20050012216 Solder interface locking using unidirectional growth of an intermetallic compound |
| 01/20/2005 | US20050012213 Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/20/2005 | US20050012199 Folded flex circuit interconnect having a grid array interface |
| 01/20/2005 | US20050012194 Electronic package having a folded package substrate |
| 01/20/2005 | US20050012192 Hybrid integrated circuit |
| 01/20/2005 | US20050011857 Thin film dielectrics for capacitors and methods of making thereof |
| 01/20/2005 | US20050011856 Method for making a multilayer module with high-density printed circuits |
| 01/20/2005 | US20050011676 Alternating voided areas of anti-pads |
| 01/20/2005 | US20050011675 Partially voided anit-pads |
| 01/20/2005 | US20050011674 Via and via landing structures for smoothing transitions in multi-layer substrates |
| 01/20/2005 | US20050011671 Memory card with and without enclosure |
| 01/20/2005 | US20050011669 Low temperature bonding of multilayer substrates |
| 01/20/2005 | US20050011668 Thin printed circuit board for manufacturing chip scale package |
| 01/20/2005 | US20050011602 Heating multilayer compressed films; lamination; controlling temperature; miniaturized circuits |
| 01/20/2005 | US20050011551 Thin film solar cell electrical contacts |
| 01/20/2005 | US20050011254 Integration of atmospheric intrusion sensors in electronic component packages |
| 01/20/2005 | DE19930639B4 Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands Means for dividing a plate-shaped object |
| 01/20/2005 | DE10330179A1 Verfahren zum Trennen flacher Werkstücke aus Keramik A method for separating flat ceramic workpieces |
| 01/20/2005 | DE10329143A1 Electronic module has an injection-molded wiring block or circuit support with contacts for externally mounted components and internal wiring for connecting the various components |
| 01/19/2005 | EP1499172A1 Electromagnetically shielded circuit device and shielding method therefor |
| 01/19/2005 | EP1499167A2 Folded flex circuit interconnect having a grid array interface |
| 01/19/2005 | EP1499002A2 Encoder system and method of assembly of such a system |
| 01/19/2005 | EP1498947A2 Electronic circuit with a power semiconductor device and a protection device protecting the power semiconductor device of overheating |
| 01/19/2005 | EP1498946A1 Circuit board, process for producing the same and power module |
| 01/19/2005 | EP1498944A1 Method of making capacitors |
| 01/19/2005 | EP1498909A1 Dielectric substrate comprising a polyimide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto |
| 01/19/2005 | EP1498870A2 Connection member and driving device of plasma display panel |
| 01/19/2005 | EP1498842A1 Communication device and package thereof |
| 01/19/2005 | EP1498396A1 Dielectric ceramic |
| 01/19/2005 | EP1498013A1 Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 01/19/2005 | EP1497892A2 Emi shielded module |
| 01/19/2005 | EP1497860A2 Dual-sided heat removal system |
| 01/19/2005 | EP1497810A1 Electrotechnical kit |
| 01/19/2005 | EP1497696A2 Photocurable compositions containing reactive particles |
| 01/19/2005 | EP1240648B8 Non-silicone conductive paste for the electrical industry, and its use |
| 01/19/2005 | EP1118076A4 Large value buried inductors in low temperature co-fired ceramic circuit boards |
| 01/19/2005 | CN2673035Y Fixed circuit board rack |
| 01/19/2005 | CN2673034Y Printed circuit board with optimum electromagnetic, electric and mechanical contact |
| 01/19/2005 | CN1568640A High speed differential signal edge card connector and circuit board layouts therefor |
| 01/19/2005 | CN1568545A Electronic device carrier adapted for transmitting high frequency signals |
| 01/19/2005 | CN1568544A High-density flip-chip interconnect |
| 01/19/2005 | CN1568295A Sodium copper titanate compositions containing a rare earth, yttrium or bismuth |
| 01/19/2005 | CN1568130A Structure of printed circuit board used for household electrical appliances |
| 01/19/2005 | CN1568129A Circuit substrate and manufacturing method thereof |