| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/19/2005 | CN1568128A Structure of printed circuit board for household electrical appliance |
| 01/19/2005 | CN1568127A Structure of printed circuit board for household electrical appliance |
| 01/19/2005 | CN1567075A LCD module and printed circuit board thereof |
| 01/19/2005 | CN1185918C Manufacturing method of planar printed circuit board with polymer thick-film resistor |
| 01/19/2005 | CN1185917C Serial circuit board and its manufacture method |
| 01/19/2005 | CN1185916C Printed circuit board fixing pin assembly and assembling method thereof |
| 01/19/2005 | CN1185915C Flexible substrate, semiconductor device, camera device and X-ray camera system |
| 01/19/2005 | CN1185914C Circuit board |
| 01/19/2005 | CN1185913C Wiring circuit board with projecture and its producing method |
| 01/19/2005 | CN1185912C Differential circuit structure of PCB and its preparing process |
| 01/19/2005 | CN1185715C An integrated circuit and manufacturing method thereof |
| 01/19/2005 | CN1185692C Electric linking parts and its manufacturing method |
| 01/18/2005 | US6845492 Signal via impedance adjustment tool |
| 01/18/2005 | US6845167 Contacting arrangement for an electroacoustic microphone transducer |
| 01/18/2005 | US6845017 Substrate-level DC bus design to reduce module inductance |
| 01/18/2005 | US6845013 Right-angle power interconnect electronic packaging assembly |
| 01/18/2005 | US6844824 Multi color and omni directional warning lamp |
| 01/18/2005 | US6844725 Electric and magnetic field detection device and electric and magnetic field measurement apparatus |
| 01/18/2005 | US6844659 Wiring board and method of manufacturing same |
| 01/18/2005 | US6844620 Power layout structure of main bridge chip substrate and motherboard |
| 01/18/2005 | US6844505 Reducing noise effects in circuit boards |
| 01/18/2005 | US6844504 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/18/2005 | US6844501 Flat flexible cable |
| 01/18/2005 | US6844283 Zero thermal expansion material and practical component parts making use of the same |
| 01/18/2005 | US6844220 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 01/18/2005 | US6843660 Cable systems and related methods |
| 01/18/2005 | US6843657 High speed, high density interconnect system for differential and single-ended transmission applications |
| 01/18/2005 | US6843608 Transparent substrate and hinged optical assembly |
| 01/18/2005 | US6843407 Solder bump fabrication method and apparatus |
| 01/14/2005 | CA2473824A1 Dielectric substrates comprising a polyimide core layer and a high temperature fluoropolymer bonding layer, and methods relating thereto |
| 01/13/2005 | WO2005004572A1 Shielding for emi-endangered electronic components and/or circuits of electronic devices |
| 01/13/2005 | WO2005004567A1 Process for producing substrate incorporating component |
| 01/13/2005 | WO2005004566A1 Testing of interconnections between stacked circuit boards |
| 01/13/2005 | WO2005004565A1 Packaging electrode, package, device and process for producing device |
| 01/13/2005 | WO2005004562A1 Integrated electromechanical arrangement and method of production |
| 01/13/2005 | WO2005004560A1 Soft magnetic material for manufacturing printed circuit boards |
| 01/13/2005 | WO2005004558A2 Method for the manufacture of printed circuit boards with embedded resistors |
| 01/13/2005 | WO2005004322A1 Oscillator and transmission/reception device |
| 01/13/2005 | WO2005004297A1 Method for the space-saving installation of electrical wiring |
| 01/13/2005 | WO2005004182A2 Method of layering green sheet and method of producing laminated ceramic electronic component |
| 01/13/2005 | WO2005004176A1 High-frequency heating device |
| 01/13/2005 | WO2005004050A1 Conductive sheet for non-contact type ic card having built-in antenna and non-contact type ic card having built-in antenna |
| 01/13/2005 | WO2005003860A1 Photosensitive resin composition, laminate thereof and process for producing the same |
| 01/13/2005 | WO2005003208A1 Epoxy resin composition |
| 01/13/2005 | WO2005002779A1 Method for separating flat ceramic workpieces with a calculated radiation spot length |
| 01/13/2005 | WO2004034410A3 Via-less electronic structures and methods |
| 01/13/2005 | WO2004023245A3 Power control for instrumented medication package |
| 01/13/2005 | US20050009980 Hardening; curing agents; adhesives; coatings; fireproofing |
| 01/13/2005 | US20050009975 Mixture of epoxy resin, curing agrent, ceramic powder and polarity adjuster; printed circuit and capacitor embedded in printed circuit |
| 01/13/2005 | US20050009386 Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits |
| 01/13/2005 | US20050009327 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof |
| 01/13/2005 | US20050009234 Stacked module systems and methods for CSP packages |
| 01/13/2005 | US20050008882 Phenol resin composition and phenol resin copper-clad laminate |
| 01/13/2005 | US20050008874 nondeforming, low temperature fired multilayer glass laminates structures having capacitor functions |
| 01/13/2005 | US20050008824 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body |
| 01/13/2005 | US20050008360 Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate |
| 01/13/2005 | US20050007807 Apparatus and method for mounting microelectronic devices on a mirrored board assembly |
| 01/13/2005 | US20050007806 Apparatus and method for mounting microelectronic devices on a mirrored board assembly |
| 01/13/2005 | US20050007723 Methods for forming a high performance capacitor |
| 01/13/2005 | US20050007717 [offset circuit for supressing electromagnetic interference and operation method thereof] |
| 01/13/2005 | US20050007708 Controller and rectifier for an electrical machine, and electrical machine |
| 01/13/2005 | US20050007354 Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus |
| 01/13/2005 | US20050007281 Surface-mounted antenna apparatus |
| 01/13/2005 | US20050007139 Power semiconductor module with detector for detecting main circuit current through power semiconductor element |
| 01/13/2005 | US20050006765 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/13/2005 | US20050006744 Package for semiconductor devices |
| 01/13/2005 | US20050006721 Configuration and method for manufacturing filters comprising LC circuit |
| 01/13/2005 | US20050006342 Solder mask removal method |
| 01/13/2005 | US20050006142 Circuit board with in-built electronic component and method for manufacturing the same |
| 01/13/2005 | US20050006141 Circuit assembly having compliant substrate structures for mounting circuit devices |
| 01/13/2005 | US20050006140 Circuit board with at least one electronic component |
| 01/13/2005 | US20050006138 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/13/2005 | US20050006137 Electronic device carrier adapted for transmitting high frequency signals |
| 01/13/2005 | US20050006136 Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials |
| 01/13/2005 | US20050006126 Low cost shielded cable manufactured from conductive loaded resin-based materials |
| 01/13/2005 | US20050006115 Heat dissipating microdevice and method of making the same |
| 01/13/2005 | US20050006026 Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate |
| 01/13/2005 | US20050005996 Liquid droplet ejection apparatus, method of ejecting liquid droplet, method of manufacturing electrooptic device, electrooptic device, electronic device, and substrate |
| 01/13/2005 | US20050005439 Coupling of conductive vias to complex power-signal substructures |
| 01/13/2005 | US20050005438 Method of testing printed circuit board opening spacings |
| 01/13/2005 | US20050005424 Method of manufacturing planar inductors |
| 01/13/2005 | US20050005420 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
| 01/13/2005 | DE4343706B4 Hitzeempfindlicher Kondensator Heat-sensitive capacitor |
| 01/13/2005 | DE20023606U1 Electrical or electronic device, e.g. voltage adapter for lamp, has circuit board carrying conductor to be protected with reduced cross-section burn-through region |
| 01/13/2005 | DE10337567B3 Protective structure for securing hardware against break-in, has contact between elastomer and circuit board interrupted when attempt is made to remove circuit board |
| 01/13/2005 | DE10326286A1 Mobilfunkgerät Mobile device |
| 01/13/2005 | DE10326086A1 Computer-controlled positioning method for measuring head relative to circuit board for automatic testing, uses search movement to detect alignment marking coordinates used for subsequent positioning |
| 01/13/2005 | DE102004021156A1 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production |
| 01/12/2005 | EP1496729A2 Method of assembling a printed circuit to a support |
| 01/12/2005 | EP1496728A1 Circuit assemby having compliant substrate stuctures for mounting circuit devices |
| 01/12/2005 | EP1496563A2 Circuit board bonded to ground, "T" branching circuit, waveguide-microstrip transition |
| 01/12/2005 | EP1496546A2 Heat conductive substrate press-mounted in printed circuit board hole for transferring heat from integrated circuit to heat sink |
| 01/12/2005 | EP1496078A1 Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 01/12/2005 | EP1495869A1 Ink-jet printer, ink-jet head and method of manufacturing the ink-jet head |
| 01/12/2005 | EP1461387A4 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 01/12/2005 | EP1332654B1 Methods of positioning components using liquid prime movers and related structures |
| 01/12/2005 | EP1129605B1 Edge connectors for printed circuit boards comprising conductive ink |
| 01/12/2005 | EP1123643B1 Printed board assembly and method of its manufacture |
| 01/12/2005 | EP1112673B1 Printed conductors made of polyalkylene dioxythiophene |
| 01/12/2005 | CN2671290Y Double surface inserting plate |