Patents for H05K 1 - Printed circuits (98,583)
02/2005
02/03/2005US20050023275 Procedure for soldering the constituent layers of a multilayer printed circuit and the machine used for same
02/03/2005US20050023241 Method of fabricating a high-layer-count backplane
02/03/2005US20050023147 Including an interconnect pattern having portions of its surface with different properties; since the first and second plating layers are formed on the interconnect pattern, oxidation of the surface of the interconnect pattern can be prevented, and also the electrical contact resistance can be lowered
02/03/2005US20050023034 Printed wiring board and manufacturing method therefor
02/03/2005US20050023033 Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
02/03/2005US20050023032 Laminated wiring board and its mounting structure
02/03/2005US20050023031 Method for making a flat flex cable
02/03/2005US20050023030 Printed circuit board with a heat dissipation element and package comprising the printed circuit board
02/03/2005US20050022379 Method of making a semiconductor device having an opening in a solder mask
02/03/2005US20050022375 Method and apparatus for shock and vibration isolation of a circuit component
02/03/2005DE202004017145U1 Field bus unit for an EIB, European installation bus, universal interface has suitable switching means and contacting and coupling means mounted on a common circuit board
02/03/2005DE10336634B3 Electronic device e.g. for motor vehicle controllers, has inner layer forming flexible connections between circuit boards of 2 assemblies and lead-through capacitors in common with other conducting tracks of first assembly
02/03/2005DE10331238A1 Electric motor with multi-part circuit board e.g. for motor vehicle door fittings, has first part of circuit board arranged completely in housing of electric motor
02/03/2005DE10331008A1 Reflowlötbarer Bauelementeträger Reflowlötbarer component support
02/03/2005DE10330873A1 Flight control system, especially for a missile or drone has attitude and navigation sensors mounted on the same circuit board as a data processing and control unit
02/03/2005DE102004034396A1 Electrical connector for wiring looms has printed circuit on flexible element that is fitted with stiffening connectors
02/03/2005DE102004033401A1 Mikroelektronikeinheit mit rohrförmigem Gehäuse Microelectronics unit with a tubular housing
02/03/2005DE102004023674A1 Process for coating unfired ceramic foils used in the manufacture of strip conductors comprises cutting ceramic foils to a required length, forming recesses a surface side, and further processing
02/03/2005DE102004015925A1 An einer Oberfläche angebrachte Antennenvorrichtung Attached to a surface antenna device
02/03/2005DE10114030B4 Dielektrische Porzellanzusammensetzung für Hochfrequenzanwendungen, Verfahren zu ihrer Herstellung und Verwendung der Dielektrischen Porzellanzusammenzetzung zur Herstellung von Dielektrischen Resonatoren und Streifenleitungen Dielectric porcelain composition for high-frequency applications, processes for their preparation and use of the dielectric Porzellanzusammenzetzung for the production of dielectric resonators and strip lines
02/02/2005EP1503615A2 Circuit board having a cooled component, particularly a SMD-component
02/02/2005EP1503452A1 Electrical connector for connecting electrical units, electrical device, and production metod for producing electrical device
02/02/2005EP1503433A2 Mount for semiconductor light emitting device
02/02/2005EP1503417A1 Stacked memory and manufacturing method thereof
02/02/2005EP1503409A2 Module with embedded semiconductor IC which has a narrow electrode pitch and method of fabricating the module
02/02/2005EP1503216A1 Sheet-form connector and production method and application therefor
02/02/2005EP1501756A2 Method of manufacturing an electronic device in a cavity with a cover
02/02/2005EP1436142A4 Metal-containing web processed with a continuous etch process
02/02/2005EP1214741B1 Control device, particularly for use in automotive engineering
02/02/2005EP1029431B1 Via pad geometry supporting uniform transmission line structures
02/02/2005CN2676568Y Microwave artificial band gap material composed of chip inductor capacitor
02/02/2005CN2676255Y Time control switch for microcomputer
02/02/2005CN1575627A Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method
02/02/2005CN1575522A Substrate design and process for reducing electromagnetic emission
02/02/2005CN1575511A Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces
02/02/2005CN1575500A Multilayer circuit and method of manufacturing
02/02/2005CN1575232A Fluoropolymer laminates and a process for manufacture thereof
02/02/2005CN1575210A 超声波印刷电路板换能器 Ultrasonic transducers printed circuit board
02/02/2005CN1575124A Substrate holder
02/02/2005CN1575111A Printed wiring board for mounting semiconductor
02/02/2005CN1575110A Structure of terminal member
02/02/2005CN1575107A Electrical contacting method
02/02/2005CN1575098A Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet for green sheet used in the manufacturing process
02/02/2005CN1575096A Electronic circuit device and its manufacturing method
02/02/2005CN1575095A Circuit board having resistor and method for manufacturing the circuit board
02/02/2005CN1575094A Multilayer circuit board and method for manufacturing the same
02/02/2005CN1575093A Electronic substrate, electronic circuit and method and device for manufacture of the same
02/02/2005CN1575092A Thermophilic polyimide resin and cast-on-copper laminate
02/02/2005CN1575091A Wired circuit board
02/02/2005CN1575090A 混合集成电路装置 Hybrid integrated circuit device
02/02/2005CN1574799A Compact electromagnetic coupler for use with digital transmission systems
02/02/2005CN1574584A Control unit and compressor used thereby
02/02/2005CN1574475A Standoff/mask structure for electrical interconnect
02/02/2005CN1574471A Electrical connector housing
02/02/2005CN1574451A Methods for making microwave circuits
02/02/2005CN1574411A Methods for depositing a thickfilm dielectric on a substrate
02/02/2005CN1574349A Lsi package
02/02/2005CN1574310A Intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate
02/02/2005CN1574307A 半导体器件 Semiconductor devices
02/02/2005CN1574304A Package for semiconductor devices
02/02/2005CN1574302A 半导体器件 Semiconductor devices
02/02/2005CN1574262A 集成电路器件和布线板 IC devices and wiring board
02/02/2005CN1574261A Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus
02/02/2005CN1574237A Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate
02/02/2005CN1574129A Multilayer ceramic electronic component and mounting structure and method for the same
02/02/2005CN1574114A 电阻器和电路板 The resistors and the circuit board
02/02/2005CN1574061A Termination providing apparatus mounted on memory module or socket and memory system using the apparatus
02/02/2005CN1574027A Wired circuit board
02/02/2005CN1574026A Wired circuit board
02/02/2005CN1573942A Method and apparatus for bonding flexible board
02/02/2005CN1573894A Electro-optical module, power supply substrate, wiring substrate, and electronic apparatus
02/02/2005CN1573879A Self light emitting type display device
02/02/2005CN1573652A Electronic apparatus including printed wiring board provided with heat generating component
02/02/2005CN1573545A Light-sensitive sheet, light-sensitive layers, image pattern forming method, and wiring pattern forming method
02/02/2005CN1573445A Liquid crystal display device and method of fabricating the same
02/02/2005CN1572910A Plating machine and process for producing film carrier tapes for mounting electronic parts
02/02/2005CN1572838A Thermosetting resin composition and articles using the same
02/02/2005CN1188018C Interconnecting device for electronic equipments
02/02/2005CN1188017C System and method for providing anti-high voltage ability between contact pins of connector
02/02/2005CN1187844C Flat type LED and mfg. method thereof
02/02/2005CN1187138C Waste recovery method of circuit products with welded parts
02/01/2005US6850414 Electronic printed circuit board having a plurality of identically designed, housing-encapsulated semiconductor memories
02/01/2005US6850197 Printed circuit board antenna structure
02/01/2005US6850084 Assembly for testing silicon wafers which have a through-via
02/01/2005US6849953 Microelectronic assemblies with composite conductive elements
02/01/2005US6849943 Power module package for high frequency switching system
02/01/2005US6849935 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
02/01/2005US6849934 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device
02/01/2005US6849800 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
02/01/2005US6849480 Surface mount IC stacking method and device
02/01/2005US6849479 Substrate based ESD network protection method for flip chip design
02/01/2005US6848953 Power connector
02/01/2005US6848913 Integrated device electronics connector
02/01/2005US6848178 Enhancement of current-carrying capacity of a multilayer circuit board
02/01/2005CA2326244C Electrical connecting element and method of producing the same
01/2005
01/27/2005WO2005009094A1 Electronic module and method for the production thereof
01/27/2005WO2005008839A1 Flat cable provided with a contact device and electric device provided with said type of cable
01/27/2005WO2005008765A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections
01/27/2005WO2005008761A1 Layered components, materials, methods of production and uses thereof
01/27/2005WO2005008733A2 Modular electronic assembly and method of making