Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/25/2014US20140374897 Thermal interface material for integrated circuit package and method of making the same
12/25/2014US20140374896 Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device
12/25/2014US20140374891 Semiconductor device with heat spreader and thermal sheet
12/25/2014US20140374887 Composition for forming passivation film, including resin having carbon-carbon multiple bond
12/25/2014US20140374886 Method for fabricating a substrate and semiconductor structure
12/25/2014US20140374885 Narrow gap device with parallel releasing structure
12/25/2014US20140374884 Photo-curable composition for imprints, pattern forming method and pattern
12/25/2014US20140374883 Semiconductor package and method of fabricating the same
12/25/2014US20140374882 Semiconductor Device with Recombination Centers and Method of Manufacturing
12/25/2014US20140374877 Integrated Circuits With On-Die Decoupling Capacitors
12/25/2014US20140374872 Controlled Buckling Structures in Semiconductor Interconnects and Nanomembranes for Stretchable Electronics
12/25/2014US20140374861 Epitaxial wafer and manufacturing method thereof
12/25/2014US20140374856 Apparatus and Method for Preventing Stiction of MEMS Devices Encapsulated by Active Circuitry
12/25/2014US20140374838 FinFETs with Nitride Liners and Methods of Forming the Same
12/25/2014US20140374832 Beol selectivity stress film
12/25/2014US20140374829 Integrated circuit device and method for manufacturing same
12/25/2014US20140374826 Vertical Gate LDMOS Device
12/25/2014US20140374822 Semiconductor device and method for manufacturing the same
12/25/2014US20140374819 Semiconductor device and semiconductor device fabrication method
12/25/2014US20140374812 Device including active floating gate region area that is smaller than channel area
12/25/2014US20140374811 Methods of forming semiconductor device structures and related semiconductor devices and structures
12/25/2014US20140374807 METHOD OF DEVICE ISOLATION IN CLADDING Si THROUGH IN SITU DOPING
12/25/2014US20140374805 Semiconductor structure and manufacturing method thereof
12/25/2014US20140374804 Micromechanical Sensor Apparatus having a Movable Gate and Corresponding Production Method
12/25/2014US20140374798 Lattice-Mismatched Semiconductor Structures with Reduced Dislocation Defect Densities and Related Methods for Device Fabrication
12/25/2014US20140374796 Semiconductor structure with aspect ratio trapping capabilities
12/25/2014US20140374793 Manufacturing method for semiconductor device
12/25/2014US20140374774 Semiconductor device and method for manufacturing same
12/25/2014US20140374771 Semiconductor multi-layer substrate, semiconductor device, and method for manufacturing the same
12/25/2014US20140374769 Gan-based schottky barrier diode with algan surface layer
12/25/2014US20140374768 High quality gan high-voltage hfets on silicon
12/25/2014US20140374758 System for Wafer-Level Phosphor Deposition
12/25/2014US20140374743 Oxide semiconductor film and formation method thereof
12/25/2014US20140374702 Carbon nanostructure device fabrication utilizing protect layers
12/25/2014US20140374307 System and method for controlling transportation of substrate of liquid crystal panel
12/25/2014US20140374144 Method for the temporary connection of a product substrate to a carrier substrate
12/25/2014US20140374031 Wafer debonding and cleaning apparatus and method
12/25/2014US20140374025 Microwave plasma device
12/25/2014US20140374024 Apparatus for removing particles from a twin chamber processing system
12/25/2014US20140374023 Apparatuses and Methods for Gas Mixed Liquid Polishing, Etching, and Cleaning
12/25/2014US20140374022 Substrate processing apparatus and substrate processing method
12/25/2014US20140373884 Substrate processing apparatus
12/25/2014US20140373882 Treatment liquid supply apparatus and substrate treatment apparatus including the same
12/25/2014US20140373881 Substrate treating apparatus
12/25/2014US20140373880 Apparatus for contamination removal using magnetic particles
12/25/2014US20140373877 Liquid processing apparatus and liquid processing method
12/25/2014US20140373874 Brush mandrel for pva sponge brush
12/25/2014US20140373870 Liquid Chemical for Forming Protecting Film
12/25/2014US20140373869 Method for removing solder balls from chip
12/25/2014US20140373387 Heat treatment apparatus
12/25/2014US20140373384 Method of collapse-free drying of high aspect ratio structures
12/25/2014US20140373289 Substrate holding apparatus and substrate cleaning apparatus
12/24/2014CN204045612U 用于接收至少一个太阳能电池印刷巢的旋转台和包括该旋转台的太阳能电池处理系统 Means for receiving at least one rotary table nest printed solar cell comprising a solar cell processing system and the rotary table
12/24/2014CN204045565U 晶片封装体 Chip package
12/24/2014CN204045562U 一种用于半导体封装设备的引线框架抓放机构 Lead frame for semiconductor packaging equipment pick and place mechanism
12/24/2014CN204045561U 封测设备拾取头 IC packaging and testing equipment pickup
12/24/2014CN204045560U 晶圆切割自动装夹装置 Wafer Cutting automatic clamping device
12/24/2014CN204045559U 一种二极管送料机构 To a diode feeding mechanism
12/24/2014CN204045558U 半导体器件阵列式倒片封装机构 A semiconductor device package array rewind mechanism
12/24/2014CN204045557U 封测设备真空小转盘 Small vacuum packaging and testing equipment turntable
12/24/2014CN204045556U 一种氮气封装氮化镓半导体处理罐 One of nitrogen packaged GaN semiconductor processing tank
12/24/2014CN204045555U 一种半导体硅片晶粒分裂装置 A semiconductor silicon crystal splitting device
12/24/2014CN204045554U 一种用于高温扩散氧化炉的水冷炉体 A water-cooled high-temperature diffusion furnace oxidation furnace
12/24/2014CN204045553U 一种平板清洗支架 A flat wash stand
12/24/2014CN204045552U Ic芯片自动检测封选装带机 Ic chip with optional automatic detection of seal machine
12/24/2014CN204045551U 接触孔偏移量测结构 Contact holes offset measurement structure
12/24/2014CN204045550U 一种全自动封装系统 A fully automatic packaging system
12/24/2014CN204045549U 灌胶工装 Glue Tooling
12/24/2014CN204044840U 指纹识别模组 Fingerprint Module
12/24/2014CN204039507U 湿制程系统 Wet process systems
12/24/2014CN204038562U 一种用于硅片传输系统的顶升换向机构 A silicon wafer transfer system jacking commutation mechanism
12/24/2014CN204036682U 晶圆切割进料装置 Wafer cutting feed means
12/24/2014CN204035749U 一种防止电解倾斜、电容浮起的工装结构 A method for preventing electrolytic tilt, capacitor floating tooling structure
12/24/2014CN1866545B 空气隧道浮栅存储单元及其制造方法 Air tunnel floating gate memory cell and its manufacturing method
12/24/2014CN104247575A 用于处理前级真空管线中废气的设备 For treating exhaust gas foreline device
12/24/2014CN104247051A 发光二极管 Led
12/24/2014CN104247048A 多结太阳能电池装置的制造 Multi-junction solar cell manufacturing apparatus
12/24/2014CN104247047A 多结太阳能电池装置的制造 Multi-junction solar cell manufacturing apparatus
12/24/2014CN104247036A 用于产生掺杂有钠的五元化合物半导体cztsse的方法 Doped with sodium five-membered compound semiconductor cztsse method for producing
12/24/2014CN104247033A 具有局部背接触的太阳能电池的制造方法 A process for production of local back contact solar cell
12/24/2014CN104247030A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/24/2014CN104247028A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/24/2014CN104247027A 功率晶体管模块 Power Transistor Module
12/24/2014CN104247026A 碳化硅半导体装置及其制造方法 Silicon carbide semiconductor device and manufacturing method thereof
12/24/2014CN104247025A 具有高发射极栅极电容的绝缘栅双极晶体管 An emitter having a high gate capacitance of an insulated gate bipolar transistor
12/24/2014CN104247024A 碳化硅半导体器件 Silicon carbide semiconductor device
12/24/2014CN104247017A 防止电荷丢失的存储器单元 Preventing charge loss of the memory cell
12/24/2014CN104247015A 具有有源漂移区带的半导体布置 A semiconductor arrangement of the active zone of the drift
12/24/2014CN104247005A 半导体装置 Semiconductor device
12/24/2014CN104247004A 半导体晶片的制作方法 Fabrication of a semiconductor wafer
12/24/2014CN104247003A 针对防止静电夹盘的黏接粘合剂侵蚀的方法及设备 Methods for preventing electrostatic chuck erosion bonding adhesive and equipment
12/24/2014CN104247002A 具有增强射频及温度均匀性的静电夹盘 Having enhanced temperature uniformity of RF and electrostatic chucks
12/24/2014CN104247001A 具有馈通结构的基板支撑件 Feed-through structure having a substrate support member
12/24/2014CN104247000A 衬底的粘合方法和装置 A substrate bonding method and apparatus
12/24/2014CN104246999A 晶片图数据核对系统以及晶片图数据核对方法 Wafer map data checking systems and wafer map data reconciliation method
12/24/2014CN104246998A 部件压接装置 Member crimping means
12/24/2014CN104246997A 安装结构体及其制造方法 Mounting structure and manufacturing method thereof
12/24/2014CN104246996A 焊料凸块及其形成方法、以及具备有焊料凸块的基板及其制造方法 And method of forming the solder bump, and the substrate and manufacturing method comprising the solder bumps
12/24/2014CN104246995A 具有对准机构的光学装置 Optical device having an alignment mechanism
12/24/2014CN104246994A 具有鳍结构的半导体器件和形成具有鳍结构的半导体器件的方法 A semiconductor device having a fin structure and a method for forming a semiconductor device having a fin structure
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