Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/23/2014US8916914 Field effect transistor having double transition metal dichalcogenide channels
12/23/2014US8916912 Semiconductor device comprising a transistor gate having multiple vertically oriented sidewalls
12/23/2014US8916906 Boron-containing buffer layer for growing gallium nitride on silicon
12/23/2014US8916905 Photoelectric conversion device
12/23/2014US8916884 Light-emitting device
12/23/2014US8916881 Semiconductor device and method for manufacturing semiconductor device
12/23/2014US8916880 Silicon carbide epitaxial wafer and semiconductor device
12/23/2014US8916875 Semiconductor packages
12/23/2014US8916872 Method of forming a stacked low temperature diode and related devices
12/23/2014US8916866 Semiconductor device
12/23/2014US8916804 Heat treatment method, recording medium having recorded program for executing heat treatment method, and heat treatment apparatus
12/23/2014US8916797 Crystallization apparatus using sequential lateral solidification
12/23/2014US8916768 Surface passivation of silicon based wafers
12/23/2014US8916767 Solar cell and method of fabricating the same
12/23/2014US8916633 TAB leader tape made of polyphenylene ether-based resin
12/23/2014US8916484 Remote plasma radical treatment of silicon oxide
12/23/2014US8916483 Methods of forming semiconductor structures including III-V semiconductor material using substrates comprising molybdenum
12/23/2014US8916482 Method of making a lithography mask
12/23/2014US8916481 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
12/23/2014US8916480 Chemical vapor deposition film profile uniformity control
12/23/2014US8916479 Selective etching of titanium nitride
12/23/2014US8916478 Method for manufacturing semiconductor device and semiconductor device
12/23/2014US8916477 Polysilicon etch with high selectivity
12/23/2014US8916476 Microfine structure formation method and microfine structure formed body
12/23/2014US8916475 Patterning method
12/23/2014US8916474 Semiconductor modules and methods of formation thereof
12/23/2014US8916473 Method for forming through-base wafer vias for fabrication of stacked devices
12/23/2014US8916472 Interconnect formation using a sidewall mask layer
12/23/2014US8916471 Method for forming semiconductor structure having through silicon via for signal and shielding structure
12/23/2014US8916470 Method of manufacturing sidewall spacers on a memory device
12/23/2014US8916469 Method of fabricating copper damascene
12/23/2014US8916468 Semiconductor device fabrication method
12/23/2014US8916467 SOI radio frequency switch with enhanced signal fidelity and electrical isolation
12/23/2014US8916466 Method for manufacturing dual damascene wiring in semiconductor device
12/23/2014US8916465 UBM structures for wafer level chip scale packaging
12/23/2014US8916464 Structures and methods for improving solder bump connections in semiconductor devices
12/23/2014US8916463 Wire bond splash containment
12/23/2014US8916462 Method for manufacturing semiconductor device
12/23/2014US8916461 Electronic fuse vias in interconnect structures
12/23/2014US8916460 Semiconductor device and method for fabricating the same
12/23/2014US8916459 Compound semiconductor device with mesa structure
12/23/2014US8916458 III-nitride quantum well structure, a method for producing the same, and a light-emitting unit using the same
12/23/2014US8916457 In situ synthesis of nanoparticles on substrates by inkjet printing
12/23/2014US8916456 Group III-V substrate material with particular crystallographic features
12/23/2014US8916455 Method of growing heteroepitaxial single crystal or large grained semiconductor films on glass substrates and devices thereon
12/23/2014US8916454 Method for making semiconducting single wall carbon nanotubes
12/23/2014US8916453 Method for manufacturing an electronic component
12/23/2014US8916452 Semiconductor device and method of forming WLCSP using wafer sections containing multiple die
12/23/2014US8916451 Thin film wafer transfer and structure for electronic devices
12/23/2014US8916450 Method for improving quality of spalled material layers
12/23/2014US8916449 Package structure and substrate bonding method
12/23/2014US8916448 Metal to metal bonding for stacked (3D) integrated circuits
12/23/2014US8916447 Method of fabricating semiconductor device
12/23/2014US8916446 Bipolar junction transistor with multiple emitter fingers
12/23/2014US8916445 Semiconductor devices and methods of manufacture
12/23/2014US8916444 Non-uniform channel junction-less transistor
12/23/2014US8916443 Semiconductor device with epitaxial source/drain facetting provided at the gate edge
12/23/2014US8916441 FinFET device and methods of fabrication
12/23/2014US8916440 Semiconductor structures and methods of manufacture
12/23/2014US8916439 Method for forming dual gate insulation layers and semiconductor device having dual gate insulation layers
12/23/2014US8916437 Insulated gate field effect transistor having passivated schottky barriers to the channel
12/23/2014US8916436 MIM capacitor with plate having high melting point
12/23/2014US8916435 Self-aligned bottom plate for metal high-K dielectric metal insulator metal (MIM) embedded dynamic random access memory
12/23/2014US8916433 Superior integrity of high-k metal gate stacks by capping STI regions
12/23/2014US8916432 Methods to integrate SONOS into CMOS flow
12/23/2014US8916431 Semiconductor device having epitaxial semiconductor layer above impurity layer
12/23/2014US8916430 Methods for fabricating integrated circuits with the implantation of nitrogen
12/23/2014US8916429 Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing
12/23/2014US8916428 Method of forming a semiconductor device
12/23/2014US8916427 FET dielectric reliability enhancement
12/23/2014US8916426 Passive devices for FinFET integrated circuit technologies
12/23/2014US8916425 Method for forming microcrystalline semiconductor film and method for manufacturing semiconductor device
12/23/2014US8916424 Method for manufacturing semiconductor device
12/23/2014US8916423 Semiconductor device and method of manufacturing the same
12/23/2014US8916422 Semiconductor packages and methods of packaging semiconductor devices
12/23/2014US8916421 Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
12/23/2014US8916420 Chip package and manufacturing method thereof
12/23/2014US8916419 Lid attach process and apparatus for fabrication of semiconductor packages
12/23/2014US8916418 Surface-emitting laser module, optical scanner device, and image forming apparatus
12/23/2014US8916417 Method of manufacturing semiconductor device having chip stacks combined in relation to the number of chips having defects
12/23/2014US8916416 Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
12/23/2014US8916415 Method and device for producing a metallic contact structure for making electrical contact with a photovoltaic solar cell
12/23/2014US8916414 Method for making memory cell by melting phase change material in confined space
12/23/2014US8916413 Phase change memory and manufacturing method therefor
12/23/2014US8916411 Absorber layer for a thin film photovoltaic device with a double-graded band gap
12/23/2014US8916410 Methods of manufacturing light to current converter devices
12/23/2014US8916409 Photovoltaic device using nano-spheres for textured electrodes
12/23/2014US8916407 MEMS device and method of manufacturing same
12/23/2014US8916406 Organic electroluminescence device and production method thereof
12/23/2014US8916405 Light emitting diode (LED) using carbon materials
12/23/2014US8916404 E-paper array substrate with storage capacitor electrode and manufacturing method thereof
12/23/2014US8916403 Method for producing a plurality of optoelectronic semiconductor chips
12/23/2014US8916402 Semiconductor light emitting device including substrate having protection layers providing protection against chemicals and method for manufacturing the same
12/23/2014US8916401 Method for fabricating semiconductor light emitting device
12/23/2014US8916400 Manufacturing method for an LED comprising a nitrided AlN reflecting layer
12/23/2014US8916399 Method of manufacturing light emitting device including light emitting element and wavelength converting member
12/23/2014US8916397 Method for producing an electronic component and electronic component
12/23/2014US8916396 Method of manufacturing semiconductor element
12/23/2014US8916395 Metallic and semiconducting carbon nanotube sorting
12/23/2014US8916394 Method for manufacturing a carbon nanotube field emission device with overhanging gate
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