Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/17/2014CN104217992A 半导体器件及其形成方法 Semiconductor device and method for forming
12/17/2014CN104217991A 互连结构的形成方法 The method of forming an interconnect structure
12/17/2014CN104217990A 一种形成接触孔的方法 A method of forming a contact hole
12/17/2014CN104217989A 接触孔结构的制造方法 The method of manufacturing a contact hole structure
12/17/2014CN104217988A 一种深槽隔离结构的制造方法 A method for producing deep trench isolation structure
12/17/2014CN104217987A 隔离结构及其形成方法、包括其的图像传感器及制造方法 Isolation structure and forming method, comprising an image sensor and its manufacturing method
12/17/2014CN104217986A 浅沟槽隔离结构的制作方法和nand闪存的制作方法 Production method Production method of shallow trench isolation structure and a nand flash
12/17/2014CN104217985A 半导体器件和浅沟槽的制作方法 Fabrication of a semiconductor device and shallow trench
12/17/2014CN104217984A 防止芯片裂纹的顶针方法 Methods to prevent chip crack thimble
12/17/2014CN104217983A 用于处理载体的方法和载体 The method for processing vectors and vectors
12/17/2014CN104217982A 一种快速热过程机台反应气体的预热系统 A rapid thermal process machines reaction gas preheating system
12/17/2014CN104217981A 半导体制造系统中的离子源清洁方法 Semiconductor manufacturing system ion source cleaning methods
12/17/2014CN104217980A 衬底移除设备以及使用其制造平板显示装置的方法 Substrate removal equipment and flat panel display device manufactured using a method
12/17/2014CN104217979A 基板清洗装置和基板清洗方法 Means a substrate cleaning method and a substrate cleaning
12/17/2014CN104217978A 半导体批次产品的处理系统和方法 Batch processing system and method of semiconductor products
12/17/2014CN104217977A 硅片激光退火设备的工件台装置 The work station device wafer laser annealing device
12/17/2014CN104217976A 一种键合加热装置及加热方法 A bonded heating apparatus and heating method
12/17/2014CN104217975A 一种测量1c塑封金线偏移量的方法 1c a plastic gold offset method to measure
12/17/2014CN104217974A 高深宽比沟槽刻蚀残留缺陷的检测方法 Detection of high aspect ratio trench etch residue defects
12/17/2014CN104217973A 检测多晶硅栅极氧化层缺失的方法 Detecting the polysilicon gate oxide deletion method
12/17/2014CN104217972A 浸润液体补充装置及补充方法与具有浸润液体补充装置的晶圆切割道检测机 Infiltration of liquid supplements and complementary methods and devices have infiltrated liquid supplement channel detection device wafer cutting machine
12/17/2014CN104217971A 以阶层式分组及过滤来识别晶圆系统性缺陷的系统与方法 In hierarchical grouping and filtering systems and methods to identify systemic wafer defect
12/17/2014CN104217970A 采样量测方法和系统 Sampling methods and measurement systems
12/17/2014CN104217969A 半导体器件封装方法 The semiconductor device packaging method
12/17/2014CN104217968A 用于加工半导体工件的方法 A method for processing a semiconductor workpiece
12/17/2014CN104217967A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104217966A 包括两个基板的功率模块及其制造方法 Includes both a method of manufacturing a power module substrate
12/17/2014CN104217965A 芯片堆叠封装体及其制作方法 Chip stack package and fabrication method thereof
12/17/2014CN104217964A 导电插塞的形成方法 A method for forming conductive plug
12/17/2014CN104217963A 通过开锥孔进行锥槽离子注入制作半导体器件超级结的方法 Injection of fabricating a semiconductor device by opening super junction tapered cone holes trough plasma process
12/17/2014CN104217962A 晶体管以及制造晶体管的方法 The method of manufacturing a transistor and a transistor
12/17/2014CN104217961A 使用牺牲性鳍来制作半导体器件的方法 Use sacrificial fin to a method for fabricating a semiconductor device
12/17/2014CN104217960A 使用用于源极/漏极限域的间隔物的半导体器件的制作方法 The method used for making the source / drain region of the spacer limits semiconductor device
12/17/2014CN104217959A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104217958A 一种用于提高GaN外延层高电阻特性的预处理方法 A GaN epitaxial storey pretreatment method for improving the resistance characteristic
12/17/2014CN104217957A 晶体管及其形成方法 Transistor and method of forming
12/17/2014CN104217956A Pm0s晶体管及其制作方法 Pm0s transistor and its manufacturing method
12/17/2014CN104217955A N型晶体管及其制作方法、互补金属氧化物半导体 N-type transistor and its manufacturing method, complementary metal oxide semiconductor
12/17/2014CN104217954A 晶体管的形成方法 The method for forming a transistor
12/17/2014CN104217953A Pm0s晶体管及其制作方法 Pm0s transistor and its manufacturing method
12/17/2014CN104217952A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/17/2014CN104217951A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
12/17/2014CN104217950A 一种平面vdm0s器件及其制造方法 A flat vdm0s device and manufacturing method
12/17/2014CN104217949A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104217948A 半导体制造方法 Semiconductor manufacturing method
12/17/2014CN104217947A 半导体制造方法 Semiconductor manufacturing method
12/17/2014CN104217946A FinFET的制备方法 FinFET preparation
12/17/2014CN104217945A 双极晶体管、半导体器件和双极晶体管的形成方法 The method of forming a bipolar transistor, a semiconductor device and a bipolar transistor
12/17/2014CN104217944A 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/17/2014CN104217943A 用于处理半导体工件的设备 Apparatus for processing semiconductor workpieces
12/17/2014CN104217942A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/17/2014CN104217941A 加工装置以及信息交换方法 Processing device and information exchange methods
12/17/2014CN104217940A 多晶硅薄膜的制备方法 The method for preparing the polysilicon thin film
12/17/2014CN104217939A 电子装置及其制造方法 Electronic device and method of manufacturing
12/17/2014CN104217938A 半导体结构的形成方法 The method of forming a semiconductor structure
12/17/2014CN104217937A 一种异向导电膜贴附装置及调整切刀的方法 A heterogeneous devices attached to the conductive film and method for adjusting the cutter
12/17/2014CN104217936A 用于制造半导体部件的方法 The method for producing a semiconductor member
12/17/2014CN104217935A 晶体管的形成方法 The method for forming a transistor
12/17/2014CN104217934A 栅极的形成方法 The method of forming a gate
12/17/2014CN104217933A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/17/2014CN104217932A 提高扩散炉首尾芯片参数一致性的方法 Improve diffusion furnace inclusive chip parameters consistent method
12/17/2014CN104217931A 一种石墨烯掺杂的方法及掺杂石墨烯 One kind of graphene doping method and doped graphene
12/17/2014CN104217930A 一种石墨烯图案的形成方法 A method of forming a graphene pattern
12/17/2014CN104217929A 一种外延片及其加工方法 An epitaxial chip and processing methods
12/17/2014CN104217928A 纳米级微结构的制备方法 Preparation nanoscale microstructures
12/17/2014CN104217927A 多层绝缘薄膜的图形化方法及芯片的多层绝缘薄膜 Multi-layer insulation film multilayered insulating film patterning method and chips
12/17/2014CN104217926A 将施王晶片扭曲到寄王晶片的相应扭曲的方法 The twist to the corresponding twisted piece 施王晶 king sent wafer method
12/17/2014CN104217925A 一种降低绝缘体上硅材料埋氧层中正电荷密度的方法 A method of silicon-on-insulator material buried oxide layer positive charge density is reduced
12/17/2014CN104217916A 一种刻蚀装置、刻蚀系统及刻蚀终点探测方法 One kind of etching apparatus, etching etching endpoint detection system and method
12/17/2014CN104217915A 等离子体处理装置的包括流动的保护性液体层的室壁 The plasma processing apparatus includes a chamber wall flow protective liquid layer
12/17/2014CN104217912A 用于使用聚焦离子束进行半导体器件的平面剥层的前体 Plane for a focused ion beam a semiconductor device precursor delamination
12/17/2014CN104216233A 曝光方法 Exposure method
12/17/2014CN104216232A 改善光刻胶固化后变形及半导体器件保护层曝光的方法 After curing the resist deformation and improve semiconductor device protection layer exposure method
12/17/2014CN104216185A 液晶显示装置及其制造方法 A liquid crystal display device and manufacturing method
12/17/2014CN104215644A 测试治具和测试方法 Test fixture and test methods
12/17/2014CN104214166A 流体压力缸 Fluid pressure cylinder
12/17/2014CN104212375A 粘接片、及切割/芯片接合薄膜 The adhesive sheet, and cutting / die-bonding film
12/17/2014CN104212374A 热固型芯片接合薄膜、带切割片的芯片接合薄膜及半导体装置的制造方法 The method of manufacturing a thin film semiconductor device and a thermosetting die-bonding film with the die-bonding dicing sheet
12/17/2014CN104212369A 热固型芯片接合薄膜、带切割片的芯片接合薄膜和半导体装置的制造方法 The method of manufacturing a thin film semiconductor device and a thermosetting die-bonding film with the die-bonding dicing sheet
12/17/2014CN104210067A 模制用模组和具有该模制用模组的树脂模制装置 And molded with a module with a module of the molded resin molding apparatus having
12/17/2014CN104209945A 机械臂控制装置、基板输送装置、基板处理装置、机械臂控制方法 Manipulator control means, the substrate transfer apparatus, the substrate processing apparatus, the manipulator control method
12/17/2014CN104209254A 用于多孔低介电常数材料的紫外光固化工艺方法 A process for UV curing a porous low dielectric constant material
12/17/2014CN103500745B 柔性显示基板及其制备方法、柔性显示装置 A flexible display substrate and its preparation method, the flexible display device
12/17/2014CN103342965B 一种用于不锈钢金属制品的超精抛光蜡 Ultra-fine polishing wax for stainless steel products
12/17/2014CN103262250B 半导体装置和显示装置 The semiconductor device and a display device
12/17/2014CN103236419B 阵列基板的制备方法、阵列基板以及显示装置 The method for preparing the array substrate, the array substrate and a display device
12/17/2014CN103199096B 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and manufacturing method thereof
12/17/2014CN103107128B 一种三维芯片结构的金属键合的方法 Metal bonding method of the three-dimensional structure of the chip
12/17/2014CN103080160B 树脂组合物和使用树脂组合物制作的半导体装置 The resin composition and a semiconductor device produced by using the resin composition
12/17/2014CN102931054B 一种实现P型SiC材料低温欧姆合金退火的方法 A P-type SiC material annealed alloy low ohmic methods to achieve
12/17/2014CN102918180B 大面积电极上的紧密安装的陶瓷绝缘体 Ceramic insulator tightly installed on the large-area electrode
12/17/2014CN102912176B 高端封装银合金键合丝及其制备方法 High-end packaging silver alloy bonding wire and preparation method
12/17/2014CN102903663B 具有封装隔离区域的半导体装置及其制造方法 A semiconductor device and manufacturing method of a package isolated area
12/17/2014CN102902123B 太阳能液晶面板及其制作方法 Solar LCD panel and manufacturing method thereof
12/17/2014CN102881632B 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/17/2014CN102881631B 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/17/2014CN102854687B 一种金属氧化物边缘场开关型液晶显示面板及其制造方法 Panel and manufacturing method of a metal oxide fringe field switching liquid crystal display
12/17/2014CN102804360B 半导体装置 Semiconductor device
12/17/2014CN102785932B 一种全自动固晶机的上料机构 One kind of the feeding mechanism of automatic Bonder
12/17/2014CN102782050B 固化性组合物、固化物和固化性组合物的使用方法 Use curable composition, cured product of the curable composition and
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