Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2015
01/06/2015US8927393 Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
01/06/2015US8927392 Methods for forming crystalline thin-film photovoltaic structures
01/06/2015US8927391 Package-on-package process for applying molding compound
01/06/2015US8927390 Intrench profile
01/06/2015US8927389 Semiconductor devices and methods of fabricating the same
01/06/2015US8927388 Method of fabricating dielectric layer and shallow trench isolation
01/06/2015US8927387 Robust isolation for thin-box ETSOI MOSFETS
01/06/2015US8927386 Method for manufacturing deep-trench super PN junctions
01/06/2015US8927385 ZTCR poly resistor in replacement gate flow
01/06/2015US8927384 Methods of fabricating a semiconductor memory device
01/06/2015US8927382 Photo-semiconductor device and method of manufacturing the same
01/06/2015US8927381 Self-aligned bipolar junction transistors
01/06/2015US8927380 SOI bipolar junction transistor with substrate bias voltages
01/06/2015US8927379 Method to bridge extrinsic and intrinsic base by selective epitaxy in BiCMOS technology
01/06/2015US8927378 Trench silicide contact with low interface resistance
01/06/2015US8927377 Methods for forming FinFETs with self-aligned source/drain
01/06/2015US8927376 Semiconductor device and method of forming epitaxial layer
01/06/2015US8927375 Forming silicon-carbon embedded source/drain junctions with high substitutional carbon level
01/06/2015US8927374 Semiconductor device and fabrication method thereof
01/06/2015US8927373 Methods of fabricating non-planar transistors including current enhancing structures
01/06/2015US8927372 Semiconductor device and method of fabricating the same
01/06/2015US8927370 Method for fabricating memory
01/06/2015US8927369 Method of forming a trench gate MOSFET having a thick bottom oxide
01/06/2015US8927368 Method for manufacturing silicon carbide semiconductor device
01/06/2015US8927367 Semiconductor device including metal-oxide-semiconductor field effect transistors and methods of fabricating the same
01/06/2015US8927366 Method of manufacturing a non-volatile memory device having a vertical structure
01/06/2015US8927365 Method of eDRAM DT strap formation in FinFET device structure
01/06/2015US8927364 Structure and method of high-performance extremely thin silicon on insulator complementary metal—oxide—semiconductor transistors with dual stress buried insulators
01/06/2015US8927363 Integrating channel SiGe into pFET structures
01/06/2015US8927362 CMOS device and method of forming the same
01/06/2015US8927361 High threshold voltage NMOS transistors for low power IC technology
01/06/2015US8927359 Multi-composition dielectric for semiconductor device
01/06/2015US8927358 Metal oxide semiconductor device having a predetermined threshold voltage and a method of making
01/06/2015US8927357 Junction field-effect transistor with raised source and drain regions formed by selective epitaxy
01/06/2015US8927356 Removal of nitride bump in opening replacement gate structure
01/06/2015US8927355 Method of manufacturing semiconductor devices
01/06/2015US8927354 Antimonide-based compound semiconductor with titanium tungsten stack
01/06/2015US8927353 Fin field effect transistor and method of forming the same
01/06/2015US8927352 Channel epitaxial regrowth flow (CRF)
01/06/2015US8927351 Method for manufacturing semiconductor device
01/06/2015US8927350 Integration flow for LDD and spacer fabrication on a sacrificial amorphous carbon gate structure
01/06/2015US8927349 Semiconductor device and manufacturing method thereof
01/06/2015US8927348 Method of manufacturing group-III nitride semiconductor light-emitting device, and group-III nitride semiconductor light-emitting device, and lamp
01/06/2015US8927347 Method for manufacturing semiconductor device
01/06/2015US8927346 Electrically and/or thermally actuated device
01/06/2015US8927345 Device package with rigid interconnect structure connecting die and substrate and method thereof
01/06/2015US8927344 Die substrate with reinforcement structure
01/06/2015US8927343 Package process
01/06/2015US8927342 Leadframe for electronic components
01/06/2015US8927341 Semiconductor device and production method therefor
01/06/2015US8927340 Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same
01/06/2015US8927339 Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
01/06/2015US8927338 Flexible, stretchable electronic devices
01/06/2015US8927337 Stacked packaging improvements
01/06/2015US8927336 Packaging structure
01/06/2015US8927335 Method for bonding of chips on wafers
01/06/2015US8927334 Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package
01/06/2015US8927333 Die carrier for package on package assembly
01/06/2015US8927332 Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice
01/06/2015US8927331 Method of manufacturing nonvolatile memory device
01/06/2015US8927330 Methods for manufacturing a metal-oxide thin film transistor
01/06/2015US8927329 Method for manufacturing oxide semiconductor device with improved electronic properties
01/06/2015US8927328 3 dimensional semiconductor device and method of manufacturing the same
01/06/2015US8927325 Method for producing an organic radiation-emitting component and organic radiation-emitting component
01/06/2015US8927324 Method for the production of a wafer-based, back-contacted heterojunction solar cell and heterojunction solar cell produced by the method
01/06/2015US8927322 Combinatorial methods for making CIGS solar cells
01/06/2015US8927321 Method for producing solid-state imaging device
01/06/2015US8927320 Method of bonding by molecular bonding
01/06/2015US8927319 Methods of preparing flexible photovoltaic devices using epitaxial liftoff, and preserving the integrity of growth substrates used in epitaxial growth
01/06/2015US8927318 Spalling methods to form multi-junction photovoltaic structure
01/06/2015US8927317 Method for producing a selective doping structure in a semiconductor substrate in order to produce a photovoltaic solar cell
01/06/2015US8927316 Camera module and method of manufacturing the camera module
01/06/2015US8927315 High-throughput assembly of series interconnected solar cells
01/06/2015US8927314 Method of manufacturing solar cell with two exposed surfaces of arc layer disposed at different levels
01/06/2015US8927312 Method of fabricating MEMS transistors on far back end of line
01/06/2015US8927310 Method of fabricating patterned substrate
01/06/2015US8927309 Method for producing organic light-emitting diode illuminating device
01/06/2015US8927306 Etched-facet lasers having windows with single-layer optical coatings
01/06/2015US8927305 Method of manufacturing light emitting device
01/06/2015US8927304 LED package and method of manufacturing the same
01/06/2015US8927303 Method for manufacturing light-emitting diode
01/06/2015US8927302 Chemical vapor deposition apparatus and method for manufacturing light-emitting devices using same
01/06/2015US8927301 Spin-torque based memory device with read and write current paths modulated with a non-linear shunt resistor
01/06/2015US8927200 Double patterning method
01/06/2015US8927199 Mask and method of manufacturing array substrate using the same
01/06/2015US8927189 Photoresist composition and method of manufacturing display device using same
01/06/2015US8927059 Deposition of metal films using alane-based precursors
01/06/2015US8926859 Polishing composition for silicon wafers
01/06/2015US8926850 Plasma processing with enhanced charge neutralization and process control
01/06/2015US8926848 Through hole forming method
01/06/2015US8926812 Cell-based transparent sensor capable of real-time optical observation of cell behavior, method for manufacturing the same and multi-detection sensor chip using the same
01/06/2015US8926805 Method and apparatus for electroplating on SOI and bulk semiconductor wafers
01/06/2015US8926803 Porous silicon electro-etching system and method
01/06/2015US8926789 Apparatus for the removal of a fluorinated polymer from a substrate
01/06/2015US8926788 Closed chamber for wafer wet processing
01/06/2015US8926778 Manufacturing apparatus and method of organic light emitting diode display
01/06/2015US8926775 Method and device for bonding two wafers
01/06/2015US8926758 Composition and method for removing photoresist and bottom anti-reflective coating for a semiconductor substrate
01/06/2015US8926754 Epitaxial growth susceptor
01/06/2015US8926753 Vapor phase growth apparatus and method of fabricating epitaxial wafer
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