Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/24/2014CN104241157A 一种对图形结构刻蚀能力的检测方法 Etching ability kind of graphical structure detection method
12/24/2014CN104241156A 一种缺陷分析方法 An analysis of defect
12/24/2014CN104241155A 半导体装置的检查方法 Check method of a semiconductor device
12/24/2014CN104241154A 倒装芯片焊点润湿性的判定方法及其芯片的焊接方法 Flip chip method for determining the wettability of solder and chip soldering method
12/24/2014CN104241153A 板级扇出型结构的封装方法 Board-level packaging method fan-out structure
12/24/2014CN104241152A 基于铜球预压平的芯片封装方法 Copper ball preloading method is based on the level of chip packaging
12/24/2014CN104241151A 用于制造半导体模块的方法 The method for manufacturing a semiconductor module
12/24/2014CN104241150A 倒装芯片贴装机以及利用该贴装机的贴装方法 And the use of flip chip mounter mounter mounting method
12/24/2014CN104241149A 一种半导体芯片的焊接方法 A semiconductor chip welding method
12/24/2014CN104241148A 一种在cpi测试中防止衬垫剥离的方法以及产生的器件 A method for preventing the liner and the resulting test device in cpi
12/24/2014CN104241147A 一种基于铝锗共晶的低温键合方法 Aluminum based cryogenic germanium eutectic bonding method
12/24/2014CN104241146A 金属垫的形成方法及半导体结构 Forming a metal pad and the semiconductor structure
12/24/2014CN104241145A 用于在使用附着载体的情况下制造半导体模块的方法 In the case of using a method of manufacturing a semiconductor module is attached to the carrier
12/24/2014CN104241144A 一种芯片塑封结构的制造方法 A method for producing plastic chip structure
12/24/2014CN104241143A 切削装置 Cutting device
12/24/2014CN104241142A 制造半导体器件的方法 The method of manufacturing a semiconductor device
12/24/2014CN104241141A 一种用于制作嵌入式硅锗应变pmos器件的方法 A method of making embedded SiGe strain method for pmos device
12/24/2014CN104241140A 形成多晶硅薄膜的方法及薄膜晶体管制造方法 A method of forming polysilicon thin film transistor and method of manufacturing
12/24/2014CN104241139A 制作薄膜晶体管的方法及薄膜晶体管 The method of fabricating a thin film transistor and a thin film transistor
12/24/2014CN104241138A 纳米线晶体管 Nanowire transistors
12/24/2014CN104241137A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
12/24/2014CN104241136A 用于嵌入式SiGe改良的鳍型场效晶体管间隔物蚀刻 Fin-type field effect transistor for embedded SiGe spacer etch improved
12/24/2014CN104241135A 在硅化物形成之前在触点蚀刻之后添加的电介质衬里 Before silicide contacts are formed after etching the dielectric liner added
12/24/2014CN104241134A 具有替代鳍的非平面晶体管及其制造方法 Alternative fin having non-planar transistor and manufacturing method thereof
12/24/2014CN104241133A 带有沟槽式源极结构的功率mos场效应管制造方法 Mos power source structure with a trench FET manufacturing method
12/24/2014CN104241132A Ldmos及其制造方法 Ldmos and manufacturing method thereof
12/24/2014CN104241131A 金属栅极晶体管的形成方法 The method of forming a metal gate transistor
12/24/2014CN104241130A Pmos晶体管及其形成方法、半导体器件及其形成方法 Pmos transistor and method of forming a semiconductor device and method of forming
12/24/2014CN104241129A 金属栅极晶体管的形成方法 The method of forming a metal gate transistor
12/24/2014CN104241128A 一种垂直SiGe FinFET的制备方法 A production method of a vertical SiGe FinFET
12/24/2014CN104241127A 沟道式栅极金氧半场效晶体管及其制造方法 A trench gate metal oxide half-effect transistor and manufacturing method thereof
12/24/2014CN104241126A 沟槽型igbt及制备方法 Igbt trench and preparation methods
12/24/2014CN104241125A 压接式igbt的正面金属工艺 Positive metal craft crimp igbt of
12/24/2014CN104241124A 非穿通型反向导通绝缘栅双极型晶体管的制造方法 Non-punch-through method of manufacturing a reverse-conducting insulated gate bipolar transistor
12/24/2014CN104241123A 非穿通型反向导通绝缘栅双极型晶体管的制造方法 Non-punch-through method of manufacturing a reverse-conducting insulated gate bipolar transistor
12/24/2014CN104241122A 一种片状硅粒子整流二极管的生产方法 A chip of silicon rectifier diode particle production methods
12/24/2014CN104241121A 制造二极管的方法 Method of manufacturing a diode
12/24/2014CN104241120A 防止硅片边缘黏附层脱落的方法 Prevent adhesion layer off the edge of the wafer method
12/24/2014CN104241119A 双接触孔刻蚀停止层的制备方法 Double contact hole etch stop layer preparation
12/24/2014CN104241118A 去除附着于金属零件表面硅化物薄膜的清洗方法 Attached to the cleaning method of removing the metal parts of the surface of the silicide film
12/24/2014CN104241117A 图形化方法 Graphical Method
12/24/2014CN104241116A 一种锗材料表面稳定钝化的方法 One kind of stable germanium surface passivation methods
12/24/2014CN104241115A 减少深沟槽硅蚀刻针状缺陷的处理方法 Reduce processing method needle deep trench silicon etch defects
12/24/2014CN104241114A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/24/2014CN104241113A 电子器件用的收容工具、其制造方法及单片化装置 Asylum tool for electronic devices, and its manufacturing method and singulation apparatus
12/24/2014CN104241112A 非晶半导体材料的形成方法及金属硅化物的形成方法 The method of forming a metal silicide forming method and the amorphous semiconductor material
12/24/2014CN104241111A Ono介质层的制备方法 Preparation Ono dielectric layer
12/24/2014CN104241110A 利用氟掺杂形成半导体设备结构的方法及半导体设备结构 The method of forming a semiconductor device using a fluorine-doped semiconductor device structures and structure
12/24/2014CN104241109A 一种制作半导体器件的方法 A method of fabricating a semiconductor device
12/24/2014CN104241108A 半导体器件形成方法 The method of forming a semiconductor device
12/24/2014CN104241107A 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method
12/24/2014CN104241106A 一种pmos源漏区离子注入方法及pmos器件制造方法 One kind of pmos source and drain region ion implantation method and device manufacturing method pmos
12/24/2014CN104241105A 控制pmos器件源漏区氟析出缺陷的方法 Methods to control pmos device fluorine emission source and drain regions of defects
12/24/2014CN104241104A 太阳能电池用基板及其制造方法 Solar cell substrate and manufacturing method
12/24/2014CN104241103A 一种wsi复合栅的制造方法 Method for producing a composite gate wsi
12/24/2014CN104241102A 凸点下金属层溅射方法 Bump metal layer sputtering
12/24/2014CN104241101A p型氮化镓为主的三族氮化物半导体薄膜的薄膜溅镀过程 a thin film p-type gallium nitride-based Group III nitride semiconductor thin film sputtering process
12/24/2014CN104241100A 小尺寸图形的制作方法 Small graphic production methods
12/24/2014CN104241099A 自对准双图形工艺 Self-aligned double patterning process
12/24/2014CN104241098A 一种小电流高压硅堆清洗工艺 A small-current high-voltage silicon stack cleaning process
12/24/2014CN104241097A 改善半导体器件一体化刻蚀残留缺陷的方法 Ways to improve the residual defect etch semiconductor integrated device
12/24/2014CN104241096A 一种用于4μm NiCr合金薄膜的离子束干法刻蚀方法 Ion beam dry etching method for 4μm NiCr alloy film
12/24/2014CN104241095A 清洗水枪 Cleaning gun
12/24/2014CN104241094A 一种避免超薄硅片边缘破损的加工方法 One way to avoid breakage thin edge of the wafer processing method
12/24/2014CN104241093A 用于处理载体的方法和电子部件 The method for processing the carrier and the electronic component
12/24/2014CN104241092A 用于从晶片分离半导体器件的方法和设备 Method and apparatus for separating from the wafer of semiconductor devices
12/24/2014CN104241091A 处理衬底的方法 Processing a substrate
12/24/2014CN104241090A 光学底板镜 Optical backplane mirror
12/24/2014CN104241089A 半导体鳍状结构及其形成方法 Semiconductor fin structure and method of forming
12/24/2014CN104241088A 条形结构的形成方法 The method for forming the structure of the strip
12/24/2014CN104241087A 基板处理方法和基板处理装置 Substrate processing method and substrate processing apparatus
12/24/2014CN104241073A 基板支撑装置及具备其的基板处理装置 A substrate supporting device and a substrate processing apparatus which includes
12/24/2014CN104241072A 用于高射频功率导体蚀刻系统的锤头tcp线圈支架 For high RF power conductor etch hammerhead tcp coil support system
12/24/2014CN104240790A 用于氮化铝衬底的厚膜印刷铜浆料 Copper thick film printing paste for aluminum nitride substrates
12/24/2014CN104238262A 一种用半导体晶圆片来制备的掩模版 A semiconductor wafer reticle prepared
12/24/2014CN104237766A 芯片测试方法和装置 Chip testing method and apparatus
12/24/2014CN104237577A 晶圆测试的方法和装置 Method and apparatus for wafer testing of
12/24/2014CN104237357A 传感元件及其制备方法和传感器 Sensing element and its preparation method and sensor
12/24/2014CN104235386A 气阀结构及应用该气阀结构的充气座 Inflatable seat valve structure and the application of the valve structure
12/24/2014CN104233457A 制造第III族氮化物半导体晶体的方法及制造GaN衬底的方法 The method of manufacturing a group III nitride semiconductor crystal and a method of manufacturing a GaN substrate
12/24/2014CN104233451A 利用场与特征对比的tsv 浴评估 Tsv bath assessment using field and feature comparison
12/24/2014CN104233410A 在衬底上电化学沉积金属的装置 Electrochemical deposition on the substrate metal device
12/24/2014CN104233299A 蚀刻液组合物和蚀刻方法 Etchant compositions and etching method
12/24/2014CN104231542A 用于晶圆/光罩载具的塑料组合物及应用其的光罩传送盒 Plastic composition for wafer / reticle carrier and apply its mask feeder
12/24/2014CN104228324A 用于在平坦绝缘基底上形成导电图案的设备、方法、具有该导电图案的平坦绝缘基底和形成在该平坦绝缘基底上的芯片组 Device on a planar insulating substrate for forming a conductive pattern, the method, having a planar insulating substrate and the conductive pattern formed on the planar insulating substrate chipset
12/24/2014CN104227897A 电子元件的压缩树脂封装方法及压缩树脂封装装置 Electronic components and compressing the resin encapsulation method of compressing the resin encapsulation apparatus
12/24/2014CN104227854A 晶管切割装置 Crystal tube cutting device
12/24/2014CN104227246A 激光器装置和使用其照射激光束的方法 The method of irradiating a laser apparatus and a laser beam using its
12/24/2014CN103165516B 互连结构的制造方法 The method of producing an interconnect structure
12/24/2014CN103137565B 衬底材料及其制备方法 Substrate material and its preparation method
12/24/2014CN103038889B 具有氧化物半导体薄膜层的层叠结构以及薄膜晶体管 A laminated structure having an oxide semiconductor thin film layer and a thin film transistor
12/24/2014CN103038385B 溅射成膜装置及防附着部件 Sputter deposition apparatus and antiadhesive member
12/24/2014CN103000585B 掩模型只读存储器的制造方法 The method of manufacturing a mask read only memory
12/24/2014CN102947359B 固化性组合物和固化膜的制造方法 Method for producing a curable composition and a cured film
12/24/2014CN102944959B 阵列基板、其制作方法、其测试方法及显示装置 Array substrate, its production method, the test method and display device
12/24/2014CN102933374B 表面具有微细凹凸结构的物品的制造方法、模具的脱模处理方法及用于模具表面脱模处理的活性能量射线固化性树脂组合物 The method of producing a surface having a fine concavo-convex structure of the article, a mold release treatment method and an active energy ray curable resin composition for a mold surface release treatment of
12/24/2014CN102916055B 一种沟槽肖特基势垒二极管及其制造方法 A Schottky barrier diode and its manufacturing method trench
12/24/2014CN102904028B 基于半导体的超材料制备方法和基于半导体的超材料 Based on the meta-material preparation method of the semiconductor and semiconductor-based metamaterial
12/24/2014CN102903647B 芯片焊接装置 Chip welding equipment
12/24/2014CN102832150B 一种检测镍金属硅化物在平面内生长长度的方法 A method for the growth of the length of the nickel metal silicide in the detection plane
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