Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/18/2014US20140370634 Method for fabricating nitride semiconductor thin film and method for fabricating nitride semiconductor device using the same
12/18/2014US20140370628 Substrate processing apparatus, semiconductor device manufacturing method, substrate processing method, and recording medium
12/18/2014US20140370627 Monitoring laser processing of semiconductors by raman spectroscopy
12/18/2014US20140370626 Method of manufacturing organic light emitting display device using organic layer deposition apparatus
12/18/2014US20140370625 Stopping An Etch In A Planar Layer After Etching A 3D Structure
12/18/2014US20140370624 Wafer alignment and bonding tool for 3d integration
12/18/2014US20140370623 Evaporation apparatus and method
12/18/2014US20140370451 Heating apparatus and heating method
12/18/2014US20140370424 Substrate with multilayer reflective film, reflective mask blank for euv lithography, method of manufacturing reflective mask for euv lithography and method of manufacturing semiconductor device
12/18/2014US20140369920 Group III Nitride Crystal Substrates and Group III Nitride Crystal
12/18/2014US20140369793 Load port module
12/18/2014US20140369791 Substrate processing device
12/18/2014US20140369080 Compound semiconductor device and method of manufacturing the same
12/18/2014US20140368394 Packaged electronic device with integrated electronic circuits having transceiving antennas
12/18/2014US20140368227 In-line measurement of transistor device cut-off frequency
12/18/2014US20140368224 Test circuit and method for semiconductor device
12/18/2014US20140367868 Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same
12/18/2014US20140367867 Packaging Methods and Packaged Semiconductor Devices
12/18/2014US20140367864 Semiconductor device and method for producing same
12/18/2014US20140367862 Semiconductor device with internal substrate contact and method of production
12/18/2014US20140367861 Semiconductor device and semiconductor device fabrication method
12/18/2014US20140367858 Thin Film Devices and Low Temperature Process To Make Thin Film Devices
12/18/2014US20140367857 Method and Apparatus for Back End of Line Semiconductor Device Processing
12/18/2014US20140367855 Self-Aligned Via Interconnect Using Relaxed Patterning Exposure
12/18/2014US20140367848 Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
12/18/2014US20140367843 Forming in-situ micro-feature structures with coreless packages
12/18/2014US20140367838 Leadframe with lead of varying thickness
12/18/2014US20140367835 Die Seal Ring and Method of Forming the Same
12/18/2014US20140367834 Nanostructure and process of fabricating same
12/18/2014US20140367833 Low-Temperature Sidewall Image Transfer Process Using ALD Metals, Metal Oxides and Metal Nitrides
12/18/2014US20140367830 Esd protection device
12/18/2014US20140367828 Process for producing a through-silicon via and a through-silicon capacitor in a substrate, and corresponding device
12/18/2014US20140367826 Making an efuse
12/18/2014US20140367825 Semiconductor devices including empty spaces and methods of forming the same
12/18/2014US20140367822 Systems and methods for dry etching a photodetector array
12/18/2014US20140367804 Transistor gate and process for making transistor gate
12/18/2014US20140367803 Finfet gate with insulated vias and method of making same
12/18/2014US20140367800 Semiconductor device with strain technique
12/18/2014US20140367796 Mos device assembly
12/18/2014US20140367795 Methods of forming different finfet devices having different fin heights and an integrated circuit product containing such devices
12/18/2014US20140367791 Semiconductor device and manufacturing method thereof
12/18/2014US20140367790 Methods of forming gate structures for cmos based integrated circuit products and the resulting devices
12/18/2014US20140367788 Methods of forming gate structures for cmos based integrated circuit products and the resulting devices
12/18/2014US20140367787 Methods of forming transistors with retrograde wells in cmos applications and the resulting device structures
12/18/2014US20140367786 Flexible, stretchable electronic devices
12/18/2014US20140367784 Component, for example nmos transistor, with active region with relaxed compression stresses, and fabrication method
12/18/2014US20140367781 Lateral diode compatible with finfet and method to fabricate same
12/18/2014US20140367777 Double-side process silicon mos and passive devices for rf front-end modules
12/18/2014US20140367775 Semiconductor device and method for forming the same
12/18/2014US20140367768 Semiconductor device and fabrication method thereof
12/18/2014US20140367760 Method and apparatus for a diffusion bridged cell library
12/18/2014US20140367754 Method for manufacturing semiconductor device and semiconductor device
12/18/2014US20140367753 Cmos device with double-sided terminals and method of making the same
12/18/2014US20140367751 FINFET SPACER ETCH FOR eSiGe IMPROVEMENT
12/18/2014US20140367702 Semiconductor device and method of manufacturing the same
12/18/2014US20140367701 Semiconductor device and method of manufacturing semiconductor device
12/18/2014US20140367700 High-Voltage Cascaded Diode with HEMT and Monolithically Integrated Semiconductor Diode
12/18/2014US20140367699 Method for fabricating semiconductor device and the semiconductor device
12/18/2014US20140367698 Method of controlling stress in group-iii nitride films deposited on substrates
12/18/2014US20140367693 Light-emitting device and the manufacturing method thereof
12/18/2014US20140367687 Small-scale fabrication systems and methods
12/18/2014US20140367684 Methods for testing integrated circuits of wafer and testing structures for integrated circuits
12/18/2014US20140367677 Semiconductor device and method for producing same
12/18/2014US20140367676 Process for the production of electrically semiconducting or conducting metal-oxide layers having improved conductivity
12/18/2014US20140367674 Process for forming an amorphous conductive oxide film
12/18/2014US20140367642 Process for Preparing Graphene on a SiC Substrate Based on Metal Film-Assisted Annealing
12/18/2014US20140367638 Insulating Layer for Planarization and Definition of the Active Region of a Nanowire Device
12/18/2014US20140367588 Method and System for E-Beam Lithography with Multi-Exposure
12/18/2014US20140367473 Method for manufacturing smart cards
12/18/2014US20140367356 In-situ hardmask generation
12/18/2014US20140367307 Wafer storing container
12/18/2014US20140367046 Enhanced plasma source for a plasma reactor
12/18/2014US20140367045 Hammerhead TCP Coil Support for High RF Power Conductor Etch Systems
12/18/2014US20140367042 Systems for automatically characterizing a plasma
12/18/2014US20140367041 Wafer dicing using femtosecond-based laser and plasma etch
12/18/2014US20140367015 Method and apparatus for separating semiconductor devices from a wafer
12/18/2014US20140366968 Coating method for gas delivery system
12/18/2014US20140366803 Vapor phase growth apparatus
12/18/2014US20140366801 High-energy ion implanter
12/18/2014US20140366360 Installation fixture for elastomer bands and methods of using the same
12/18/2014US20140366358 Workpiece alignment device
12/17/2014CN204029838U 一种辅助硅片插片的装置 Silicon inserts an auxiliary device
12/17/2014CN204029834U 一种防止光伏组件隐裂的液压车转运托盘 A method of preventing PV modules cracked hydraulic car transporter tray
12/17/2014CN204029833U 硅片及太阳电池片上料装置 Feeding device on a silicon wafer and solar cell chip
12/17/2014CN204029814U 具有终端结构的场截止型igbt器件 Field cut-off device has a terminal structure igbt
12/17/2014CN204029812U 一种具有自补偿背封层的半导体衬底 A kind of self-compensation back sealing layer of the semiconductor substrate
12/17/2014CN204029807U 一种低温多晶硅薄膜晶体管阵列基板、显示装置 Low-temperature polysilicon thin film transistor array substrate, a display device
12/17/2014CN204029786U 适用于带有通孔的轻、薄零件的真空吸嘴 Suitable for light, thin parts with a hole in the vacuum nozzle
12/17/2014CN204029785U 装片机的吸嘴装置 Suction device loading machine
12/17/2014CN204029784U 一种传动定位机构 A motion transmitting positioning mechanism
12/17/2014CN204029783U 太阳能电池片传输台 Solar cells transfer station
12/17/2014CN204029782U 用于排纸源石英舟的底座 Paper Source for discharge quartz boat dock
12/17/2014CN204029781U 用于硅片扩散的石英舟 For silicon diffusion quartz boat
12/17/2014CN204029780U 一种壁板和反应腔室 One kind of siding and the reaction chamber
12/17/2014CN204029779U 一种半导体硅片蚀刻槽 A semiconductor wafers etched groove
12/17/2014CN204029778U 一种硅片的裂片装置 Silicon wafers lobes device
12/17/2014CN204029777U 用于晶圆切割道检测设备的除液装置 In addition to equipment for wafer cutting fluid channel detection equipment
12/17/2014CN204029776U 用于半导体芯片的加工装置 Processing apparatus for a semiconductor chip
12/17/2014CN204029775U 夹持式桂片涂布旋转机 Gui piece clamp-coated rotary machine
12/17/2014CN204029774U 硅片自动裂片机 Automatic Wafer lobes machine
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