Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/30/2014US8920560 Method for manufacturing epitaxial wafer
12/30/2014US8920107 Substrate support apparatus and vacuum processing apparatus
12/30/2014US8920103 Multi-cell rotary end effector mechanism with slip ring
12/30/2014US8920097 Wafer handling system for a loadlock
12/30/2014US8920027 Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems
12/30/2014US8919756 Substrate processing system, carrying device, and coating device
12/30/2014US8919755 Hi-fix board clamping apparatus for use in test handler
12/30/2014US8919563 Methods and apparatus for large diameter wafer handling
12/30/2014US8919528 Nozzled device to align a substrate on a surface
12/30/2014US8919412 Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
12/30/2014US8919358 Substrate processing apparatus
12/30/2014US8919279 Processing system having magnet keeper
12/30/2014US8919277 Coating applicator, coating application method and electronic device
12/30/2014US8918989 Device for aligning and pre-fixing a wafer
12/30/2014US8918988 Methods for controlling wafer curvature
12/30/2014US8918971 Method of manufacturing packages
12/25/2014US20140378804 Insulation of micro structures
12/25/2014US20140378032 Polishing pad
12/25/2014US20140378031 Polishing pad
12/25/2014US20140377966 Microwave plasma device
12/25/2014US20140377965 Directed self-assembly (dsa) formulations used to form dsa-based lithography films
12/25/2014US20140377964 Apparatus for oxidation and annealing processes and method for the same
12/25/2014US20140377963 Patterning for selective area deposition
12/25/2014US20140377962 Photo resist trimmed line end space
12/25/2014US20140377961 Thin film deposition apparatus with multi chamber design and film deposition methods
12/25/2014US20140377960 Plasma etching method
12/25/2014US20140377959 Methods for forming three dimensional nand structures atop a substrate
12/25/2014US20140377958 Plasma processing method and vacuum processing apparatus
12/25/2014US20140377957 Method for manufacturing semiconductor device using silicon-containing resist underlayer film forming composition for solvent development
12/25/2014US20140377956 Pattern forming method
12/25/2014US20140377955 Substrate preparation for selective area deposition
12/25/2014US20140377954 Method and apparatus for improving cmp planarity
12/25/2014US20140377953 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates
12/25/2014US20140377952 Wiring film and active matrix substrate using the same, and method for manufacturing wiring film
12/25/2014US20140377951 Apparatus and Method for Removing Challenging Polymer Films and Structures from Semiconductor Wafers
12/25/2014US20140377950 Method of manufacturing a semiconductor device
12/25/2014US20140377949 Method of depositing copper using physical vapor deposition
12/25/2014US20140377948 Method of depositing copper using physical vapor deposition
12/25/2014US20140377947 Method for manufacturing semiconductor device
12/25/2014US20140377946 Bonded Structures for Package and Substrate
12/25/2014US20140377945 Floating gate forming process
12/25/2014US20140377944 FinFETs with Multiple Threshold Voltages
12/25/2014US20140377943 Four terminal transistor fabrication
12/25/2014US20140377942 Method for manufacturing semiconductor device
12/25/2014US20140377941 Method of manufacturing semiconductor device
12/25/2014US20140377940 Transient voltage suppressor circuit, and diode device therefor and manufacturing method thereof
12/25/2014US20140377939 Carrier for flexible substrate, substrate processing apparatus including the carrier, and method of manufacturing flexible display apparatus
12/25/2014US20140377938 Method for producing semiconductor device
12/25/2014US20140377937 Method of coating water soluble mask for laser scribing and plasma etch
12/25/2014US20140377936 Method for Forming a Strained Semiconductor Structure
12/25/2014US20140377935 Selective Amorphization for Signal Isolation and Linearity
12/25/2014US20140377934 Method of Manufacturing Semiconductor Device Having Embedded Conductive Line
12/25/2014US20140377930 Method of forming electronic components with increased reliability
12/25/2014US20140377928 Method for finfet integrated with capacitor
12/25/2014US20140377927 Self-aligned contact structure for replacement metal gate
12/25/2014US20140377926 Method for fabricating semiconductor device
12/25/2014US20140377923 Method to form finfet/trigate devices on bulk semiconductor wafers
12/25/2014US20140377920 Method of manufacturing semiconductor device with offset sidewall structure
12/25/2014US20140377919 Cmos fabrication
12/25/2014US20140377916 Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures
12/25/2014US20140377914 Single Layer Coreless Substrate
12/25/2014US20140377912 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
12/25/2014US20140377911 Package configurations for low emi circuits
12/25/2014US20140377909 Semiconductor packages having through electrodes and methods for fabricating the same
12/25/2014US20140377908 Methods for the Formation of a Trap Rich Layer
12/25/2014US20140377907 Semiconductor device and method for manufacturing the same
12/25/2014US20140377906 Methods for manufacturing thin film transistors
12/25/2014US20140377904 Precursor composition of oxide semiconductor and thin film transistor substrate including oxide semiconductor
12/25/2014US20140377892 Method of forming an integrated inductor by dry etching and metal filling
12/25/2014US20140377891 Charged particle beam irradiation apparatus and methods related thereto
12/25/2014US20140377889 Semiconductor device manufacturing method
12/25/2014US20140377888 Method of detecting and measuring contact alignment shift relative to gate structures in a semicondcutor device
12/25/2014US20140377887 Method for planarizing semiconductor devices
12/25/2014US20140377886 Method of manufacturing semiconductor device including grinding semiconductor wafer
12/25/2014US20140377885 Process flow for replacement metal gate transistors
12/25/2014US20140377040 Elevator linear motor drive
12/25/2014US20140377039 Unit and method for cooling, and apparatus and method for treating substrate
12/25/2014US20140376898 Absorbing reflector for semiconductor processing chamber
12/25/2014US20140376897 Light pipe window structure for thermal chamber applications and processes
12/25/2014US20140376148 Electrostatic chuck device
12/25/2014US20140375972 Lithographic apparatus and device manufacturing method
12/25/2014US20140375971 Lithographic apparatus and device manufacturing method
12/25/2014US20140375370 Methods and apparatus for an isfet
12/25/2014US20140375367 Pseudo-cml latch and divider having reduced charge sharing between output nodes
12/25/2014US20140375341 Die Fracture Detection and Humidity Protection with Double Guard Ring Arrangement
12/25/2014US20140375299 Non-intrusive measurement of a wafer dc self-bias in semiconductor processing equipment
12/25/2014US20140374925 Component assembly using a temporary attach material
12/25/2014US20140374924 Heterogeneous Integration Process Incorporating Layer Transfer in Epitaxy Level Packaging
12/25/2014US20140374916 Tsv interconnect structure and manufacturing method thereof
12/25/2014US20140374915 Integration of optical components in integrated circuits
12/25/2014US20140374914 Stress compensation patterning
12/25/2014US20140374911 Device having reduced pad peeling during tensile stress testing and a method of forming thereof
12/25/2014US20140374910 Semiconductor device and manufacturing method thereof
12/25/2014US20140374909 Method for filling trench with metal layer and semiconductor structure formed by using the same
12/25/2014US20140374908 Semiconductor Device and Manufacturing Method Thereof
12/25/2014US20140374907 Ultra-thin copper seed layer for electroplating into small features
12/25/2014US20140374906 Method for processing a carrier and an electronic component
12/25/2014US20140374905 Formation of conductive circuit, conductive circuit, and conductive ink composition
12/25/2014US20140374904 Semiconductor device, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
12/25/2014US20140374899 Package with Solder Regions Aligned to Recesses
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