Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/17/2014CN102768975B 片盒定位机构和具有该片盒定位机构的腔室装置 The cassette positioning mechanism and film cartridge chamber device having a positioning mechanism
12/17/2014CN102768952B 扩散后单晶硅片次品返工方法 After the diffusion of silicon chip rework defective method
12/17/2014CN102760750B 一种oled显示单元及其制造方法 One kind of a display unit and a manufacturing method oled
12/17/2014CN102751243B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN102751199B 一种槽型半导体功率器件的制造方法 A method of manufacturing a semiconductor power device Groove
12/17/2014CN102742160B 驱动非易失性逻辑电路的方法 Nonvolatile logic circuit driving method
12/17/2014CN102742013B 柔性半导体装置的制造方法 The method of manufacturing a flexible semiconductor device
12/17/2014CN102738293B 执行装置和机械手 Actuators and robots
12/17/2014CN102738041B 上部电极板以及基板处理装置 Upper electrode plate and the substrate processing apparatus
12/17/2014CN102738021B 半导体芯片悬臂封装的定位结构 Positioning the cantilever structure of the semiconductor chip package
12/17/2014CN102738001B 具有超级介面的功率晶体管的制作方法 Method of preparing a super interface of the power transistor
12/17/2014CN102737978B 晶片平坦化方法 A wafer planarization method
12/17/2014CN102736399B 形成标准光掩模的方法及装置与使用检测系统的方法 Standard methods and apparatus for photomask inspection system with the use of a method of forming
12/17/2014CN102714175B 半导体装置 Semiconductor device
12/17/2014CN102692771B 一种液晶显示器、薄膜晶体管阵列基板及其制造方法 A liquid crystal display, a thin film transistor array substrate and manufacturing method thereof
12/17/2014CN102683354B 顶栅型n-tft、阵列基板及其制备方法和显示装置 Top-gate n-tft, array substrate preparation method and display device
12/17/2014CN102683353B 用于显示设备的阵列基板及其制造方法 The array substrate and manufacturing method for a display apparatus
12/17/2014CN102683166B 封装芯片检测与分类装置 Packaged chip detection and classification system
12/17/2014CN102681277B 阵列基板及其制造方法和液晶显示面板 Array substrate and manufacturing method thereof, and a liquid crystal display panel
12/17/2014CN102664220B Led晶片的切割方法和该方法所用保护片 Led wafer cutting method and the method used in the protective sheet
12/17/2014CN102664190B 嵌入式外延外基区双极晶体管及其制备方法 Embedded epitaxial base bipolar transistor outside its preparation method
12/17/2014CN102651342B 阵列基板及其制造方法 Array substrate and manufacturing method thereof
12/17/2014CN102651311B 一种低温多晶硅薄膜的制备方法及低温多晶硅薄膜 A low-temperature polysilicon thin film preparation method and low-temperature polysilicon thin film
12/17/2014CN102629608B 一种阵列基板及其制造方法和显示装置 One kind of array substrate and a display device and manufacturing method thereof
12/17/2014CN102625741B 研磨垫、其制造方法及研磨加工方法 Polishing pad, its manufacturing method and grinding method
12/17/2014CN102610544B 生产包括半导体部分和非半导体部分的装置的系统和方法 Production, including a system and method of the semiconductor portion and the non-semiconductor portions of the device
12/17/2014CN102597873B 焦点测试光罩、焦点测量方法、曝光装置、及曝光方法 Focus test mask, the focus measuring method, an exposure apparatus, and exposure method
12/17/2014CN102593122B 半导体esd电路和方法 Esd semiconductor circuit and method
12/17/2014CN102576691B 具厚度不同的栅极介电质的高k栅极堆栈中的功函数调整 Function tuning with different thickness of the gate dielectric of high-k gate stack functions
12/17/2014CN102569275B 堆叠式半导体封装结构及其制造方法 Stacked semiconductor package structure and manufacturing method
12/17/2014CN102569061B 带有绝缘埋层的辐射加固材料及其制备方法 Radiation-hardened material with a buried insulating layer and its preparation method
12/17/2014CN102549713B 基板盒及其应用 Board box and its application
12/17/2014CN102543893B 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/17/2014CN102543696B 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
12/17/2014CN102498552B 使用脉冲序列退火方法将薄膜固相再结晶的方法 Methods using a pulse sequence annealed film solid phase recrystallization method
12/17/2014CN102486995B 动态晶圆对位方法及曝光扫瞄系统 Dynamic wafer alignment method and exposure scanning system
12/17/2014CN102484045B 等离子体光源系统 Plasma source system
12/17/2014CN102473651B 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/17/2014CN102446737B 基板处理方法和基板处理设备 Substrate processing method and substrate processing apparatus
12/17/2014CN102412241B 半导体芯片封装件及其制造方法 The semiconductor chip package and method of manufacturing
12/17/2014CN102349149B 利用电路层转移制造多层结构的方法 Layer was transferred by the method of manufacturing a multilayer circuit structure
12/17/2014CN102347329B 半导体元件及其制法 Semiconductor components Jiqizhifa
12/17/2014CN102326244B 用于在电子器件制造中传输基板的机械手系统、装置及方法 Manipulator system in an electronic device fabrication substrate transfer apparatus and method for
12/17/2014CN102317036B Cmp垫中的三维网状结构 Cmp pad three-dimensional network structure
12/17/2014CN102314081B 涂覆显影装置和涂覆显影方法 Coating the coating developing method and a developing device
12/17/2014CN102308388B 用于改善量子阱器件中的并行传导的设备和方法 Device and method for improving the quantum well devices for parallel conduction
12/17/2014CN102282666B 多深度浅沟槽隔离工艺 More depth shallow trench isolation process
12/17/2014CN102245723B 可湿蚀刻的抗反射涂层 Wet etching may be anti-reflective coating
12/17/2014CN102244082B 阵列基板制造方法 Array substrate manufacturing method
12/17/2014CN102244032B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN102233577B 水平关节型机器人和基板传送系统 Horizontal articulated robot and the substrate transfer system
12/17/2014CN102221780B 用于eb或euv平版印刷的化学放大负性抗蚀剂组合物和图案化方法 Chemical or euv for lithographic printing eb amplified negative resist composition and patterning method
12/17/2014CN102210012B 研磨剂、研磨方法和半导体集成电路装置的制造方法 Method for producing an abrasive, a polishing method and a semiconductor integrated circuit device
12/17/2014CN102208388B 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/17/2014CN102194822B 位元线结构、半导体元件及其形成方法 Bit line structure, and method of forming a semiconductor device
12/17/2014CN102148137B Mim电容器及其形成工艺 Mim capacitor and formation process
12/17/2014CN102130047B 半导体管芯切单方法 Semiconductor die singulation method
12/17/2014CN102096319B 光刻胶组合物和使用其制造显示基板的方法 Photoresist composition and method of use thereof for manufacturing a display substrate
12/17/2014CN102088822B 具有焊点自保护功能的pcb基板及其焊盘制作工艺 Pcb board and solder pads craftsmanship has self-protection function
12/17/2014CN102085470B 用于去除污染物质的等离子体反应器及其驱动方法 Removing pollutants plasma reactor and a driving method for
12/17/2014CN102062788B 拾放装置 Pick and place unit
12/17/2014CN102044568B 薄膜晶体管及其制造方法 A thin film transistor and manufacturing method thereof
12/17/2014CN101963756B 形成电子器件的方法 The method of forming an electronic device
12/17/2014CN101877306B 通过曝光工艺在晶片上制造图案的方法 The method of manufacturing process by exposure pattern on the wafer
12/17/2014CN101877303B 处理晶片的方法及使用该方法的半导体制造设备 Method of processing a wafer and a semiconductor manufacturing apparatus using the method
12/17/2014CN101859756B 交流式覆晶发光二极管结构及其制造方法 AC-type flip-chip light emitting diode structure and its manufacturing method
12/17/2014CN101826534B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN101820018B 一种CdS薄膜的制备方法 A thin film preparation method CdS
12/17/2014CN101719510B 量子干涉晶体管及其制造和操作方法 Quantum interference transistor and its manufacturing and operating methods
12/17/2014CN101641778B 半导体集成电路装置 The semiconductor integrated circuit device
12/17/2014CN101615626B 有机发光二极管显示器及其制造方法 The organic light emitting diode display and method of manufacturing
12/16/2014US8914766 Dose-data generating apparatus
12/16/2014US8913455 Dual port memory cell
12/16/2014US8913424 Magnetic enhancement layer in memory cell
12/16/2014US8913223 Lithographic apparatus and device manufacturing method
12/16/2014US8912881 Methods and apparatus for dynamically authenticated identification
12/16/2014US8912697 Vacuum actuator including a stator forming a part of a vacuum partition wall
12/16/2014US8912669 Sealing resin sheet, method for producing electronic component package and electronic component package
12/16/2014US8912667 Packaged integrated circuit using wire bonds
12/16/2014US8912666 Structure and manufacturing method of chip scale package
12/16/2014US8912665 Dicing tape-integrated film for semiconductor back surface
12/16/2014US8912663 Embedded package structure and method for manufacturing thereof
12/16/2014US8912662 Wafer-level package and method of manufacturing the same
12/16/2014US8912661 Stacked die assembly having reduced stress electrical interconnects
12/16/2014US8912659 Stacked semiconductor package and method for manufacturing the same
12/16/2014US8912658 Interconnect structure with enhanced reliability
12/16/2014US8912655 Semiconductor memory device, method of manufacturing the same and method of forming contact structure
12/16/2014US8912654 Semiconductor chip with integrated via
12/16/2014US8912653 Plasma treatment on semiconductor wafers
12/16/2014US8912649 Dummy flip chip bumps for reducing stress
12/16/2014US8912648 Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
12/16/2014US8912646 Integrated circuit assembly and method of making
12/16/2014US8912641 Low profile electronic package and associated methods
12/16/2014US8912638 Semiconductor device with hollow structure
12/16/2014US8912637 Self-adhesive die
12/16/2014US8912635 Semiconductor device package and method of making a semiconductor device package
12/16/2014US8912634 High frequency transition matching in an electronic package for millimeter wave semiconductor dies
12/16/2014US8912633 In-situ photoresist strip during plasma etching of active hard mask
12/16/2014US8912630 Integrated circuit including thermal gate, related method and design structure
12/16/2014US8912627 Electrical fuse structure and method of fabricating same
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