| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/01/2015 | US20150001680 Method for manufacturing silicon single crystal wafer and electronic device |
| 01/01/2015 | US20150001672 Bi-directional esd diode structure with ultra-low capacitance that consumes a small amount of silicon real estate |
| 01/01/2015 | US20150001671 Electric field gap device and manufacturing method |
| 01/01/2015 | US20150001670 Semiconductor structure and method of forming a harmonic-effect-suppression structure |
| 01/01/2015 | US20150001669 Trench Liner Passivation for Dark Current Improvement |
| 01/01/2015 | US20150001644 Fermi-level unpinning structures for semiconductive devices, processes of forming same, and systems containing same |
| 01/01/2015 | US20150001643 Integrated circuits having improved high-k dielectric layers and methods for fabrication of same |
| 01/01/2015 | US20150001635 Methods of forming an e-fuse for an integrated circuit product and the resulting integrated circuit product |
| 01/01/2015 | US20150001634 Methods of forming bipolar devices and an integrated circuit product containing such bipolar devices |
| 01/01/2015 | US20150001631 Cmos technology integration |
| 01/01/2015 | US20150001628 Semiconductor structure with improved isolation and method of fabrication to enable fine pitch transistor arrays |
| 01/01/2015 | US20150001625 Structure and method of high-performance extremely thin silicon on insulator complementary metal-oxide-semiconductor transistors with dual stress buried insulators |
| 01/01/2015 | US20150001622 Thin body switch transistor |
| 01/01/2015 | US20150001620 Ldmos device with improved avalanche energy and associated fabricating method |
| 01/01/2015 | US20150001615 Optimization of manufacturing methodology: p-channel trench mos with low vth and n-type poly |
| 01/01/2015 | US20150001607 Nand string containing self-aligned control gate sidewall cladding |
| 01/01/2015 | US20150001605 Gate Constructions Of Recessed Access Devices And Methods Of Forming Gate Constructions Of Recessed Access Devices |
| 01/01/2015 | US20150001598 Divot-free planarization dielectric layer for replacement gate |
| 01/01/2015 | US20150001595 Finfet with multiple concentration percentages |
| 01/01/2015 | US20150001592 Semiconductor Device With Self-Protecting Fuse And Method Of Fabricating The Same |
| 01/01/2015 | US20150001591 Bulk finfet with partial dielectric isolation featuring a punch-through stopping layer under the oxide |
| 01/01/2015 | US20150001588 Semiconductor device and method for manufacturing same |
| 01/01/2015 | US20150001587 Methods of forming group iii-v semiconductor materials on group iv substrates and the resulting substrate structures |
| 01/01/2015 | US20150001585 Tucked active region without dummy poly for performance boost and variation reduction |
| 01/01/2015 | US20150001583 Novel embedded shape sige for nfet channel strain |
| 01/01/2015 | US20150001577 Design and manufacture of a tunnel diode memory |
| 01/01/2015 | US20150001551 Over-voltage protection of gallium nitride semiconductor devices |
| 01/01/2015 | US20150001547 Nitride semiconductor element, nitride semiconductor wafer, and method for forming nitride semiconductor layer |
| 01/01/2015 | US20150001545 Semiconductor display device |
| 01/01/2015 | US20150001538 Semiconductor device and a method of manufacturing the same |
| 01/01/2015 | US20150001536 Thin film transistor and method for fabricating thin film transistor |
| 01/01/2015 | US20150001528 Solution-processed sol-gel films, devices including same, and methods |
| 01/01/2015 | US20150001377 Photoelectric conversion device manufacturing method, photoelectric conversion device, and imaging system |
| 01/01/2015 | US20150001202 Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
| 01/01/2015 | US20150001087 Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems |
| 01/01/2015 | US20150000844 Multiple-mode plasma generation apparatus |
| 01/01/2015 | US20150000728 Titanium oxide laminated film, titanium oxide film, manufacturing method for same, precursor liquid for titanium oxide, and dye-sensitized agent type photoelectric conversion element |
| 01/01/2015 | US20150000711 Single use rinse in a linear marangoni drier |
| 01/01/2015 | US20150000697 Oxidizing aqueous cleaner for the removal of post-etch residues |
| 01/01/2015 | US20150000695 Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium |
| 01/01/2015 | US20150000599 Apparatus and System for Preventing Backside Peeling Defects on Semiconductor Wafers |
| 01/01/2015 | US20150000591 Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium |
| 01/01/2015 | US20150000376 Sensor component for a gas and/or liquid sensor, production method for a sensor component for a gas and/or liquid sensor, and method for detecting at least one material in a gaseous and/or liquid medium |
| 12/31/2014 | CN204067415U 复合晶片以及功能元件 Composite wafers and functional elements |
| 12/31/2014 | CN204067409U 一种太阳能电池放置模板 A solar cell is placed Templates |
| 12/31/2014 | CN204067400U 一种晶体硅电池板搁置架 A crystalline silicon solar panels shelves |
| 12/31/2014 | CN204067359U 一种肖特基势垒二极管芯片 One kind of Schottky barrier diode chip |
| 12/31/2014 | CN204067348U 晶片的正、背面间电性连接结构 N, electrically connected between the back surface of the wafer structure |
| 12/31/2014 | CN204067341U 具有凸块结构的基板 A substrate having a bump structure |
| 12/31/2014 | CN204067332U 基于基板的凸点倒装芯片csp封装件 Based bump flip chip package substrate csp |
| 12/31/2014 | CN204067330U 一种基板片式载体csp封装件 A substrate chip carrier package csp |
| 12/31/2014 | CN204067329U 一种导热硅胶片 One kind of thermal silica film |
| 12/31/2014 | CN204067328U 一种硅太阳能电池片吸盘 A silicone solar cell wafer chuck |
| 12/31/2014 | CN204067327U 引线键合夹具及引线键合设备 Wire bonding clamps and wire bonding equipment |
| 12/31/2014 | CN204067326U 一种peek晶片夹 One kind of peek wafer chuck |
| 12/31/2014 | CN204067325U 一种to-220或ito-220f封装产品治具 One kind of to-220 or ito-220f packages Fixture |
| 12/31/2014 | CN204067324U 二极管自动分离搬运系统 Diodes automatic separation handling systems |
| 12/31/2014 | CN204067323U 晶圆切割传送装置 Wafer cutting delivery device |
| 12/31/2014 | CN204067322U 晶片输送机系统 A wafer conveyor system |
| 12/31/2014 | CN204067321U 一种石英舟 A silica boat |
| 12/31/2014 | CN204067320U 一种编号贴片二极管清洗烘烤盘 A numbering SMD diode clean baking dish |
| 12/31/2014 | CN204067319U 一种芯片镀层装置 A chip coating device |
| 12/31/2014 | CN204067318U 便于提高引脚整形质量且适用于不同ic元件的整脚机 Improve the quality and ease-pin plastic apply to the entire foot ic different elements |
| 12/31/2014 | CN204067317U 金属氧化物半导体型场效应管自动折弯整形设备 Metal-oxide semiconductor field-effect plastic tube automatic bending equipment |
| 12/31/2014 | CN204067316U Sma产品检视工具 Sma products View tool |
| 12/31/2014 | CN204067315U 一种热工作台 A thermal bench |
| 12/31/2014 | CN204067314U 一种芯片或焊片自动装填机构 A chip or lug automatic loading mechanism |
| 12/31/2014 | CN204067313U 一种连续式真空紫外光臭氧表面清洗与氧化改性设备 A continuous vacuum ultraviolet light and ozone oxidation modified surface cleaning equipment |
| 12/31/2014 | CN204067312U 电子元件封装外壳烧结模具 The electronic component packaging enclosure sintering mold |
| 12/31/2014 | CN204067311U 装片机压模头结构 Loading machine die head structure |
| 12/31/2014 | CN204067310U 一种smt贴片封装结构 A patch package structure smt |
| 12/31/2014 | CN204067309U 一种层间介质层击穿的测试结构 An inter-layer dielectric breakdown test structure |
| 12/31/2014 | CN204067308U Bga芯片的植球工具 Bga chip bumping tool |
| 12/31/2014 | CN204067307U 去胶机 Go Melter |
| 12/31/2014 | CN204067306U 处理基板和半导体用复合晶片 Processing the composite substrate and the semiconductor wafer |
| 12/31/2014 | CN204054067U 一种机械手臂 A mechanical arm |
| 12/31/2014 | CN204053765U 抛光头 Polished head |
| 12/31/2014 | CN204053190U 焊线机气体保护装置及使用该焊线机气体保护装置的全自动焊线机 Bonders gas protection devices and the use of automatic wire bonders wire bonders gas protection device |
| 12/31/2014 | CN1998087B 非晶形氧化物和薄膜晶体管 Amorphous oxide and a thin film transistor |
| 12/31/2014 | CN1708832B 使用覆盖层的无定形材料相变方法 Using the overlay method amorphous phase change material |
| 12/31/2014 | CN1581439B 半导体器件以及用于制造半导体器件的方法 A semiconductor device and a method for manufacturing a semiconductor device |
| 12/31/2014 | CN104254927A 用于产生w-台面管芯间隔的方法和装置 Method and apparatus for generating w- spaced mesa die |
| 12/31/2014 | CN104254920A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device |
| 12/31/2014 | CN104254919A 非线性忆阻器 Nonlinear memristor |
| 12/31/2014 | CN104254917A 用于半导体封装的多层基底 A multilayer substrate for semiconductor package |
| 12/31/2014 | CN104254915A 高分辨率显示器的构造 Construct a high-resolution monitor |
| 12/31/2014 | CN104254914A 制造金属栅极的方法 The method of making a metal gate |
| 12/31/2014 | CN104254913A 冷却板、其制法以及半导体制造装置用部件 Cooling plate, their preparation and a semiconductor manufacturing apparatus member |
| 12/31/2014 | CN104254912A 移动平台 Mobile Platforms |
| 12/31/2014 | CN104254911A 芯片分类装置和芯片分类方法、控制程序、可读存储介质 Chip and chip classification classification means, a control program, a storage medium readable |
| 12/31/2014 | CN104254910A 重型回转体的驱动方法及回转装置 A driving method of heavy rotating body and the rotation means |
| 12/31/2014 | CN104254909A 半导体装置的制造方法、隔热负荷夹具及其设置方法 Method for manufacturing semiconductor devices, thermal load fixture and how to set |
| 12/31/2014 | CN104254908A Iii族氮化物半导体叠层衬底和iii族氮化物半导体场效应晶体管 Iii nitride semiconductor stacked substrate and iii nitride semiconductor field effect transistor |
| 12/31/2014 | CN104254907A 半导体接合保护用玻璃复合物、半导体装置的制造方法以及半导体装置 Bonding a semiconductor protective glass composite, a method of manufacturing a semiconductor device and a semiconductor device |
| 12/31/2014 | CN104254906A 半导体基板用清洗剂和半导体基板表面的处理方法 A semiconductor substrate with the cleaning agent and the semiconductor substrate surface treatment method |
| 12/31/2014 | CN104254905A 用于制造单晶金属-半导体-复合的方法 For the manufacture of single-crystal metal - semiconductor - complex method |
| 12/31/2014 | CN104254805A 化学增幅型正型感光性树脂组合物、硬化膜的制造方法、硬化膜、有机el显示装置及液晶显示装置 Chemically-amplified positive-type photosensitive resin composition, cured film, method of manufacturing, the hardened film, an organic el display device and liquid crystal display device |
| 12/31/2014 | CN104254781A 转移电子探针组件到空间变换器 Transferring electronic components to the space probe converter |
| 12/31/2014 | CN104254438A 微细图案转印用模具的制造方法以及使用该模具的具有凹凸结构的基板的制造方法、以及具备具有该凹凸结构的基板的有机电致发光元件的制造方法 Transferring a fine pattern using a mold manufacturing method and a manufacturing method using a mold having a concavo-convex structure of the substrate, and includes a substrate having the uneven structure of the organic light-emitting element caused by the manufacturing method |
| 12/31/2014 | CN104253180A 氮化物半导体元件、氮化物半导体晶片和形成氮化物半导体层的方法 Nitride semiconductor device, the nitride semiconductor wafer to form a nitride semiconductor layer and a method |