Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/24/2014CN102800805B 相变存储单元及其形成方法 Phase change memory cell and method of forming
12/24/2014CN102800644B Ddr信号布线封装基板以及ddr信号布线封装方法 Ddr signal wiring package substrate and signal routing encapsulation method ddr
12/24/2014CN102768973B 一种用于离子注入的激光辅助装置及其使用方法 A laser-assisted ion implantation apparatus and method of use for
12/24/2014CN102768968B 检测井区注入离子在不同浓度条件下扩散能力的方法 Wellblock injection method to detect ion diffusion capacity at different concentrations
12/24/2014CN102768953B 一种消除侧墙宽度负载效应的工艺 A process of elimination sidewall width of the load effect
12/24/2014CN102760688B 双镶嵌结构及其形成方法、半导体器件 Dual damascene structure and method of forming a semiconductor device
12/24/2014CN102760659B 普通电力整流二极管芯片的台面造型工艺 Mesa molding process ordinary power rectifier diode chips
12/24/2014CN102751211B 快速热退火设备中氧气浓度的监测方法 Rapid thermal annealing method for monitoring the concentration of oxygen
12/24/2014CN102751172B 集成无源器件及其制作方法 Integrated passive device and manufacturing method thereof
12/24/2014CN102725850B 具有减小的寄生电容的体接触晶体管 Body-contacted transistor with reduced parasitic capacitance
12/24/2014CN102723265B 一种硅片的铝掺杂方法 Aluminum-doped silicon wafers method
12/24/2014CN102696098B 安装方法和安装装置 Mounting method and apparatus
12/24/2014CN102687297B 磁阻元件的制造方法 The method of manufacturing the magnetoresistive element
12/24/2014CN102683385B 半导体结构及其形成方法 And method of forming a semiconductor structure
12/24/2014CN102668038B 在晶体衬底上执行图案化植入的方法 The method of patterning is performed on a crystal substrate implanted
12/24/2014CN102665999B 激光加工方法 The laser processing method
12/24/2014CN102664196B 阵列基板及多晶硅层的制作方法 The method of making the array substrate and the polycrystalline silicon layer
12/24/2014CN102655079B 多层金属-多层绝缘体-金属电容器的制作方法 Multilayer metal - multilayer insulator - metal capacitor production methods
12/24/2014CN102651343B 一种阵列基板的制作方法、阵列基板及显示装置 A method of manufacturing an array substrate, the array substrate and a display device
12/24/2014CN102651313B Pmos器件叠层结构的制备和栅功函数调节方法 Preparation and the work function of the gate stack structure Pmos device adjustment method
12/24/2014CN102651312B 栅极的形成方法 The method of forming a gate
12/24/2014CN102646606B Ic卡模块的封装方法 Ic card module encapsulation method
12/24/2014CN102637698B 一种阵列基板及其制备方法 One kind of array substrate and its preparation method
12/24/2014CN102637697B 薄膜晶体管基板及应用其的显示器及其制造方法 The thin film transistor substrate and the application of the display and manufacturing method thereof
12/24/2014CN102629583B 阵列基板制作方法、阵列基板及液晶显示器 Array substrate fabrication method, the array substrate and the liquid crystal display
12/24/2014CN102629038B Tft阵列基板及其制作方法和显示装置 Tft array substrate and a display device and manufacturing method thereof
12/24/2014CN102623587B Led芯片的制造方法 Led chip manufacturing method
12/24/2014CN102610709B 封装载板及其制作方法 Package carrier and its production method
12/24/2014CN102598275B 具有场板的半导体器件 A semiconductor device having a field plate
12/24/2014CN102593034B 电子部件定位用夹具 Electronic component positioning jig
12/24/2014CN102576675B 布线层、半导体装置、具有半导体装置的液晶显示装置 The liquid crystal wiring layer, a semiconductor device, a semiconductor device having a display device
12/24/2014CN102569122B Led侧面钝化层质量的测试结构及测试方法 Test structure and test methods Led side passivation layer quality
12/24/2014CN102569083B 具有高k金属栅极的金属氧化物半导体的形成方法 The method for forming a high-k metal gate metal oxide semiconductor
12/24/2014CN102569071B 氮化镓晶体管的制作方法 GaN transistor production methods
12/24/2014CN102569053B 一种形成高介电常数金属栅的方法 A method of forming a high dielectric constant metal gate
12/24/2014CN102569025B 磊晶基板、使用该磊晶基板之半导体发光元件及其制程 Epitaxial substrates using semiconductor light emitting device and method of fabricating the epitaxial substrate
12/24/2014CN102566156B Tft-lcd的阵列基板及其制造方法 Tft-lcd array substrate and manufacturing method
12/24/2014CN102544099B 隧穿场效应晶体管及其制造方法 Tunneling field effect transistor and manufacturing method thereof
12/24/2014CN102543905B 半导体封装件及其制造方法 Semiconductor package and its manufacturing method
12/24/2014CN102543874B 应变记忆作用的半导体器件的制造方法 Strain memory of the manufacturing method of a semiconductor device
12/24/2014CN102543826B 准soi结构的制造方法 Manufacturing method of quasi-soi structure
12/24/2014CN102543744B 晶体管及其制作方法 Transistor and its manufacturing method
12/24/2014CN102522369B 穿衬底互连件的形成方法 The method of forming interconnects through the substrate
12/24/2014CN102479755B Cmos器件及其制作方法 Cmos device and manufacturing method thereof
12/24/2014CN102456688B 具有不同器件外延层的集成电路技术 Integrated circuit technology has a different device epitaxial layer
12/24/2014CN102456618B 一种利用上掩膜实现高性能铜互连的方法 A use of the mask to achieve high performance copper interconnect methods
12/24/2014CN102446777B 半导体装置的制造方法 The method of manufacturing a semiconductor device
12/24/2014CN102414825B 功率用半导体装置 Power semiconductor device
12/24/2014CN102396071B 具有自对准垂直ldd和背面漏极的ldmos With a self-aligned vertical ldd and rear drain ldmos
12/24/2014CN102386221B 化合物半导体器件及其制造方法 A compound semiconductor device and manufacturing method thereof
12/24/2014CN102354695B 显示器及其制作方法 Display and production methods
12/24/2014CN102318053B 在用由配方控制的弯液面对晶片表面的处理中将空隙值关联于弯液面稳定性的方法和装置 In the face of the associated value in the voids in the wafer surface treatment method and the meniscus stability by means of the meniscus controlled by the formula
12/24/2014CN102312213B 制造半导体器件的方法 The method of manufacturing a semiconductor device
12/24/2014CN102301465B 贯穿衬底的通路 Through the passage of the substrate
12/24/2014CN102280492B 非易失性半导体存储器晶体管、非易失性半导体存储器及非易失性半导体存储器的制造方法 The method of manufacturing a nonvolatile semiconductor memory transistor, a nonvolatile semiconductor memory and the nonvolatile semiconductor memory
12/24/2014CN102272350B 等离子cvd装置 Plasma cvd means
12/24/2014CN102110573B 等离子体处理装置 Plasma processing apparatus
12/24/2014CN102054789B 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
12/24/2014CN101997004B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/24/2014CN101989023B 电泳显示设备及其制造方法 The electrophoretic display device and manufacturing method thereof
12/24/2014CN101908525B 半导体器件以及制造所述半导体器件的方法 Semiconductor device and method of manufacturing the semiconductor device
12/24/2014CN101905442B 晶圆的双面研磨装置、双面研磨方法及该装置的载体 Double-side polishing apparatus of the wafer carrier, double-side polishing method and the apparatus
12/24/2014CN101599470B 传感器组件和用于制造传感器组件的方法 The method of producing a sensor assembly and sensor assembly for
12/24/2014CN101405839B 移动体驱动系统及方法、图案形成装置及方法、曝光装置及方法、组件制造方法 Movable body drive system and method, the patterning device and a method, apparatus and method, an exposure device manufacturing method
12/23/2014US8918746 Cut mask aware contact enclosure rule for grating and cut patterning solution
12/23/2014US8918303 System and process for calibrating pyrometers in thermal processing chambers
12/23/2014US8918203 Substrate processing apparatus
12/23/2014US8918152 Parallel fabrication of nanogaps and devices thereof
12/23/2014US8917549 NOR flash memory array structure, mixed nonvolatile flash memory and memory system comprising the same
12/23/2014US8917547 Complementary SOI lateral bipolar for SRAM in a CMOS platform
12/23/2014US8917539 Solid, multi-state molecular random access memory
12/23/2014US8917521 Etch-back type semiconductor package, substrate and manufacturing method thereof
12/23/2014US8917489 Apparatus and method for holding a wafer
12/23/2014US8917342 Solid-state imaging element, method for producing solid-state imaging element, and electronic device
12/23/2014US8917338 Solid-state imaging device, manufacturing method thereof, and electronic apparatus
12/23/2014US8917107 Circuit board having bypass pad
12/23/2014US8917083 Structures and methods for RF de-embedding
12/23/2014US8917016 Display device and electronic apparatus
12/23/2014US8916979 Through-vias and methods of forming the same
12/23/2014US8916978 Interconnect structure and method of fabricating
12/23/2014US8916977 Semiconductor device and method for fabricating the same
12/23/2014US8916972 Adhesion between post-passivation interconnect structure and polymer
12/23/2014US8916970 Method for welding gold-silicon eutectic chip, and transistor
12/23/2014US8916969 Semiconductor devices, packaging methods and structures
12/23/2014US8916964 Semiconductor device and method of producing same
12/23/2014US8916962 III-nitride transistor with source-connected heat spreading plate
12/23/2014US8916952 Self-aligned emitter-base in advanced BiCMOS technology
12/23/2014US8916951 Lateral PNP bipolar transistor formed with multiple epitaxial layers
12/23/2014US8916950 Shallow trench isolation structure having a nitride plug
12/23/2014US8916941 Semiconductor device having silicide on gate sidewalls in isolation regions
12/23/2014US8916940 Method of forming a nanocluster-comprising dielectric layer and device comprising such a layer
12/23/2014US8916939 Reliable contacts
12/23/2014US8916938 Three-dimensional writable printed memory
12/23/2014US8916937 Multiple transistor types formed in a common epitaxial layer by differential out-diffusion from a doped underlayer
12/23/2014US8916933 Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure
12/23/2014US8916930 Trenched power semiconductor device and fabrication method thereof
12/23/2014US8916928 Threshold voltage adjustment in a fin transistor by corner implantation
12/23/2014US8916927 Vertical tunnel field effect transistor (FET)
12/23/2014US8916923 Nonvolatile semiconductor memory
12/23/2014US8916916 Imaging device, method of manufacturing the same, and electronic apparatus
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