Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/17/2014CN204029773U 一种线性台阶翻转轨道 A linear stage flip track
12/17/2014CN204029772U 晶圆切割道自动对焦检测系统 Wafer Cutting Road AF detection system
12/17/2014CN204029771U 半导体基板固定装置及所应用半导体封装设备 Semiconductor substrate fixtures and applied semiconductor packaging equipment
12/17/2014CN204029770U 粘片机 Die Bonder
12/17/2014CN204029769U 芯片扩片机 Chip expansion machine
12/17/2014CN204029768U 负压控制装置 Negative pressure control device
12/17/2014CN204029767U 晶圆封装机及其平行调整装置 Wafer packaging machines and their parallel alignment device
12/17/2014CN204029766U 晶圆级芯片用喷涂装置 Wafer-level chip by spraying device
12/17/2014CN204029765U 一种用于调整半导体设备的喷嘴位置的装置 An apparatus for adjusting the position of the semiconductor device of the nozzle
12/17/2014CN204028566U 硅片显影定影装置 Wafer developing fixing device
12/17/2014CN204018207U (54)硅片筛选装置 (54) Screening device wafer
12/17/2014CN104221480A 电子零件安装方法及电子零件安装线 Installation of electronic components and electronic component mounting line
12/17/2014CN104221180A 半导体发光元件用光提取体及发光元件 Body semiconductor light emitting element and light extraction
12/17/2014CN104221163A 用于光伏装置制造的设备和方法 Apparatus and method for manufacturing a photovoltaic device
12/17/2014CN104221154A 薄膜晶体管及薄膜晶体管的制造方法 The method of manufacturing a thin film transistor and the thin film transistor
12/17/2014CN104221153A 半导体装置 Semiconductor device
12/17/2014CN104221152A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/17/2014CN104221151A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104221147A 半导体集成电路装置 The semiconductor integrated circuit device
12/17/2014CN104221141A 用于制造器件的至少一个接触面的方法和用于接收定向的测量参量的方向分量的传感器 Method for manufacturing a sensor device and at least one contact surface for receiving a measurement parameter direction orientation of components
12/17/2014CN104221139A 片材粘贴装置及粘贴方法 Apparatus and paste method sheet pasted
12/17/2014CN104221138A 用于处理板片状工艺物品的装置及方法 Apparatus and method for processing plate-like craft items for
12/17/2014CN104221137A 基板搬送装置、曝光装置、基板支持装置及元件制造方法 Substrate transfer apparatus, exposure apparatus, a substrate support apparatus and device manufacturing method
12/17/2014CN104221136A 收纳容器、收纳容器的开闭器开闭单元、及使用它们的晶圆储料器 Storage container, the storage container shutter opening and closing means, and the use thereof wafer stocker
12/17/2014CN104221135A 双面电路板及其制备方法 Double-sided circuit board and its preparation method
12/17/2014CN104221134A 涂布扩散剂组合物、涂布扩散剂组合物的制造方法、太阳能电池及太阳能电池的制造方法 Diffusion method for producing a coating composition, method for producing a diffusion coating agent composition, a solar cell and a solar cell
12/17/2014CN104221133A 包含羟-锌-化合物的氨配制品 Contains hydroxyl - ammonia compound formulations - Zinc
12/17/2014CN104221132A 沉积锰和氮化锰的方法 Manganese and manganese nitride deposition method
12/17/2014CN104221131A 半导体元件的制造方法 The method of manufacturing a semiconductor device
12/17/2014CN104221130A 与化合物半导体的铜互连相关的改善的结构、装置和方法 Compound semiconductor with improved copper interconnects associated structures, devices and methods
12/17/2014CN104221129A 基于外延生长来制造半导体设备的方法 Methods based on epitaxial growth of semiconductor devices manufactured
12/17/2014CN104221128A 移动体装置、曝光装置、平面显示器的制造方法、及元件制造方法 Moving body apparatus, exposure apparatus, method for manufacturing flat panel displays, and device manufacturing method
12/17/2014CN104221127A 用于压印光刻的无缝大面积主模板的制造 Manufacture of seamless large area for imprint lithography master template
12/17/2014CN104221126A 径向结半导体纳米结构的低温制造方法、径向结器件以及包括径向结纳米结构的太阳能电池 Low temperature method of manufacturing a junction semiconductor nanostructures radial, radial junction device and a solar cell including a radial junction nanostructure
12/17/2014CN104221125A 包括直接管芯安装的发光二极管(led)阵列和相关组件 Comprise light emitting diodes mounted directly to the die (led) array and associated components
12/17/2014CN104221124A 用于清洁波峰焊设备的部件的装置和方法 Apparatus and method for wave soldering components of the cleaning apparatus for
12/17/2014CN104221122A 离子束照射装置 Ion beam irradiation means
12/17/2014CN104220857A 用于高亮度发光二极管的高吞吐量热测试方法及系统 High-throughput thermal testing method and system for high-brightness light-emitting diodes
12/17/2014CN104220651A 具有偏角的硅单晶和iii族氮化物单晶的层叠基板 Laminated substrate having a silicon single crystal and iii declination nitride single crystal of
12/17/2014CN104220637A 用于半导体器件应用的氮化硅膜 Application of the silicon nitride film for a semiconductor device
12/17/2014CN104220224A 压印用树脂模具材料组合物 Imprinting resin mold material composition
12/17/2014CN104220145A 用于处理排放流体的装置 Processing fluid discharge means for
12/17/2014CN104218182A 有机发光装置及其制造方法、以及包含其的影像显示系统 The organic light emitting device and a manufacturing method thereof and an image display system comprising
12/17/2014CN104218123A 基于离子注入工艺的n型IBC硅太阳能电池制作方法 Based on the ion implantation process of an n-type silicon solar cell manufacturing method IBC
12/17/2014CN104218100A 一种集成电路及其组合电容与实现方法 An integrated and combined capacitance and implementation
12/17/2014CN104218099A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104218098A 一种Ni0:Cu/Zn0异质pn结二极管 One kind Ni0: Cu / Zn0 heterojunction pn junction diode
12/17/2014CN104218097A 一种Si/NiO:Cu异质pn结二极管 One kind of Si / NiO: Cu pn heterojunction diode
12/17/2014CN104218095A 一种薄膜晶体管及其制备方法、阵列基板和显示装置 A thin film transistor and its preparation method, the array substrate and a display device
12/17/2014CN104218092A 一种薄膜晶体管及其制备方法、阵列基板和显示装置 A thin film transistor and its preparation method, the array substrate and a display device
12/17/2014CN104218090A 薄膜晶体管及其制造方法和具有该薄膜晶体管的显示装置 A thin film transistor and manufacturing method thereof and a display device having the thin film transistor
12/17/2014CN104218089A 阶梯栅介质双层石墨烯场效应晶体管及其制备方法 Ladder gate dielectric bilayer graphene field effect transistor and its preparation method
12/17/2014CN104218087A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104218086A 具有共面形貌的多高度finfet Morphology having coplanar multilevel finfet
12/17/2014CN104218085A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104218083A 调整半导体器件中的应变 Adjustment of the semiconductor device in strain
12/17/2014CN104218082A 高迁移率鳍型场效应晶体管及其制造方法 High mobility of fin-type field effect transistor and its manufacturing method
12/17/2014CN104218081A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104218080A 射频ldm0s器件及其制造方法 RF ldm0s device and manufacturing method thereof
12/17/2014CN104218079A 半导体器件以及制造半导体器件的方法 A semiconductor device and a method of manufacturing a semiconductor device
12/17/2014CN104218078A 具有漏极在顶部的功率晶体管及其形成方法 Having a drain at the top of the power transistor and method of forming
12/17/2014CN104218075A 半导体器件和半导体器件的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/17/2014CN104218074A 一种非晶半导体薄膜及其制备方法和应用 An amorphous semiconductor film and preparation method and application
12/17/2014CN104218067A 显示装置及其制造方法 Display device and manufacturing method
12/17/2014CN104218061A 有机发光显示设备及其制造方法 The organic light emitting display device and manufacturing method thereof
12/17/2014CN104218059A 显示装置和制造显示装置的方法 The method of manufacturing a display device and a display device
12/17/2014CN104218058A 有机发光显示装置 The organic light emitting display device
12/17/2014CN104218055A 有机发光显示装置及其制造方法 The organic light emitting display device and manufacturing method thereof
12/17/2014CN104218054A 有机发光显示设备及其制造方法 The organic light emitting display device and manufacturing method thereof
12/17/2014CN104218043A 阵列基板及其制作方法、显示装置 Array substrate and method of manufacturing the display device
12/17/2014CN104218041A 阵列基板及制备方法和显示装置 Array substrate preparation method and display device
12/17/2014CN104218040A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104218037A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104218036A 半导体元件及其制造方法 Semiconductor device and manufacturing method
12/17/2014CN104218031A 母排联接式高性能igbt模块及其制作方法 Busbar connection, high-performance igbt module and its manufacturing method
12/17/2014CN104218030A 堆叠式多封装模块及其制造方法 Stacked multi-package module and its manufacturing method
12/17/2014CN104218025A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/17/2014CN104218024A 具有分层互连结构的桥互连 Bridge interconnect has a hierarchical interconnect structure
12/17/2014CN104218023A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/17/2014CN104218022A 晶片封装体及其制造方法 Chip package and manufacturing method thereof
12/17/2014CN104218021A 电路结构及制造具有增强的接触通孔电性连接的方法 The method of manufacturing a circuit structure and enhanced contact electrically connected to the through hole
12/17/2014CN104218019A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and manufacturing method thereof
12/17/2014CN104218018A 一种射频功放模块及其组装方法、射频模块、基站 A radio frequency power amplifier module and assembly methods, RF modules, base station
12/17/2014CN104218017A 半导体装置 Semiconductor device
12/17/2014CN104218015A 封装结构及其制作方法 Package structure and manufacturing method thereof
12/17/2014CN104218013A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/17/2014CN104218009A 芯片卡模块和用于制造芯片卡模块的方法 Chip card module and a method for manufacturing a chip card module
12/17/2014CN104218007A 小脚印半导体封装 Small footprint semiconductor packaging
12/17/2014CN104218004A 提高锂电池保护芯片精度的芯片封装结构及其工艺方法 Improve the accuracy of lithium battery protection chip chip package structure and process methods
12/17/2014CN104218003A 具有缓冲材料和加强层的半导体器件 A semiconductor device having a buffer material and a reinforcing layer
12/17/2014CN104218002A 3dnand闪存的制作方法 3dnand flash memory production method
12/17/2014CN104218001A 闪存栅极的制造方法 Gate flash memory manufacturing method
12/17/2014CN104218000A 晶体管及其形成方法 Transistor and method of forming
12/17/2014CN104217999A Cmos器件的制造方法 Cmos device manufacturing method
12/17/2014CN104217998A 集成电路及制造具有包覆非平面晶体管结构的集成电路的方法 Integrated circuits and integrated circuit manufacturing a coated non-planar transistor structure methods
12/17/2014CN104217997A 3d封装件及其形成方法 3d package and method of forming
12/17/2014CN104217996A 半导体基板的高原结构成形方法 Plateau structure forming method of the semiconductor substrate
12/17/2014CN104217995A 阵列基板的制造方法及应用其制造的阵列基板 The method of manufacturing an array substrate and application of manufacturing an array substrate
12/17/2014CN104217994A 一种薄膜晶体管阵列基板及其制备方法、显示装置 A thin film transistor array substrate and its preparation method, the display device
12/17/2014CN104217993A 铜互连工艺 Copper interconnect process
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