| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/07/2015 | CN102768969B 一种亮场缺陷扫描中的光斑抑制方法 One kind of bright spot in a field defect scanning method for inhibiting |
| 01/07/2015 | CN102760648B 平面高压晶体管的分压环的制造方法 Planar transistor manufacturing method of the partial pressure of high pressure ring |
| 01/07/2015 | CN102738079B 多晶硅激光退火装置及其方法 Polysilicon laser annealing apparatus and method |
| 01/07/2015 | CN102723358B 绝缘栅场效应晶体管及其制造方法 Insulated gate field effect transistor and manufacturing method thereof |
| 01/07/2015 | CN102723270B 一种使柔性材料层表面平坦化的方法 One kind of the flexible material layer surface planarization method |
| 01/07/2015 | CN102709265B 半导体光器件表面贴装封装结构及其封装方法 Semiconductor optical device surface mount package and packaging method |
| 01/07/2015 | CN102709212B 一种用于pecvd设备的自动上下料装置 Automatic loading and unloading device for pecvd equipment |
| 01/07/2015 | CN102709182B 两步退火辅助氯化镍诱导晶化非晶硅薄膜的方法 Two-step annealing assisted crystallization of amorphous silicon thin film of nickel chloride method of inducing |
| 01/07/2015 | CN102693904B 一种减小i/o mos器件hci效应的方法 A method of reducing i / o mos devices hci effect method |
| 01/07/2015 | CN102688867B 用于清洗衬底的方法 A method for cleaning a substrate |
| 01/07/2015 | CN102687247B Ⅲ族氮化物半导体的n型接触电极及其形成方法 N-type contact electrode Ⅲ nitride semiconductor and forming method |
| 01/07/2015 | CN102683400B 自对准抬升外基区锗硅异质结双极晶体管及其制备方法 Self-aligned SiGe uplift outer base heterojunction bipolar transistor and its preparation method |
| 01/07/2015 | CN102683258B 卡盘结构和使用卡盘结构处理半导体基板的装置 Device chuck chuck structure structure and use of a semiconductor substrate processing |
| 01/07/2015 | CN102683192B 用后期鳍片蚀刻形成于图案化sti区上的鳍式管 Etching with a late-fins formed on the patterned region of fin tube sti |
| 01/07/2015 | CN102673076B 带有保护薄膜的切割薄膜 Dicing film with a protective film |
| 01/07/2015 | CN102655156B 一种阵列基板及其制造方法 An arrayed substrate and manufacturing method |
| 01/07/2015 | CN102654703B 一种阵列基板及其制造方法、以及显示设备 An arrayed substrate and manufacturing method, and a display device |
| 01/07/2015 | CN102651430B 一种基板的化学处理方法 A substrate processing method of chemical |
| 01/07/2015 | CN102646589B 一种mosfet制造方法 One kind of mosfet manufacturing method |
| 01/07/2015 | CN102646587B 制造化合物半导体器件的方法和洗涤剂 The method of manufacturing a compound semiconductor device and a detergent |
| 01/07/2015 | CN102646579B 一种sonos结构及制造方法 One kind of structure and manufacturing method sonos |
| 01/07/2015 | CN102645799B 一种液晶显示器件、阵列基板和彩膜基板及其制造方法 A liquid crystal display device array substrate and color filter substrate and its manufacturing method |
| 01/07/2015 | CN102637738B 高压多栅极元件及其制造方法 High pressure multi-gate device and manufacturing method |
| 01/07/2015 | CN102637605B 基于SOI的后栅型积累模式Si-NWFET制备方法 SOI accumulation mode after the gate was prepared based on Si-NWFET |
| 01/07/2015 | CN102637603B 通过可移除侧墙集成工艺增强应力记忆效应的方法 The method can be removed through the side wall of the integrated technology to enhance the memory effect of stress |
| 01/07/2015 | CN102629664B 一种阵列基板及其制作方法和显示装置 One kind of array substrate and a display device and manufacturing method thereof |
| 01/07/2015 | CN102625772B 具有重叠壁结构的晶片容器 Wafer container having a wall structure overlapping |
| 01/07/2015 | CN102623459B 一种薄膜晶体管存储器及其制备方法 A thin film transistor memory and preparation method |
| 01/07/2015 | CN102623305B 金属-多层绝缘体-金属电容器及其制造方法、集成电路 Metals - multilayer insulator - metal capacitor and method for manufacturing integrated circuits |
| 01/07/2015 | CN102612253B 内连线结构及使用该结构的装置、线路结构与方法 Interconnection structure and use of the device, circuit structure and method of the structure |
| 01/07/2015 | CN102610646B 半导体器件侧墙空洞层结构及其制备方法 Side wall cavity semiconductor device layer structure and preparation method |
| 01/07/2015 | CN102598216B 化学气相沉积设备的温度控制方法 Temperature of the chemical vapor deposition apparatus control method |
| 01/07/2015 | CN102593025B 半导体晶片的多区域温度控制 Multi-zone temperature control of the semiconductor wafer |
| 01/07/2015 | CN102577005B 半导体集成电路和具备该半导体集成电路的电子设备及其控制方法 A semiconductor integrated circuit comprising an electronic device and its control method of the semiconductor integrated circuit |
| 01/07/2015 | CN102576726B 隧道场效应晶体管及其制造方法 Tunneling field effect transistor and manufacturing method thereof |
| 01/07/2015 | CN102576688B 载体移载促进装置 Facilitate carrier transfer device |
| 01/07/2015 | CN102576682B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 01/07/2015 | CN102569197B 提高使用反射性材料的伸展应力衬垫的紫外线固化 Using a reflective material to improve the stretch stress liner ultraviolet curable |
| 01/07/2015 | CN102566165B 阵列基板及其制造方法和液晶显示器 Array substrate and manufacturing method thereof, and a liquid crystal display |
| 01/07/2015 | CN102549729B 用于半导体衬底上的大面积的基于氮化镓或其它氮化物的结构的应力补偿 Stress Compensation for a large area on a semiconductor substrate of gallium nitride or other nitride structure based on the |
| 01/07/2015 | CN102544097B 半导体结构及其制造方法 Semiconductor structure and manufacturing method |
| 01/07/2015 | CN102543921B 焊垫结构及其制造方法 Pad structure and manufacturing method |
| 01/07/2015 | CN102484090B 基板处理设备 The substrate processing apparatus |
| 01/07/2015 | CN102468326B 接触电极制造方法和半导体器件 Contact electrode and the semiconductor device manufacturing method |
| 01/07/2015 | CN102446729B 用湿式化学方法形成受控底切而有优异完整性的高介电系数栅极堆栈 Forming a wet chemical method and has excellent controlled undercut the integrity of high dielectric constant gate stack |
| 01/07/2015 | CN102439523B 用于双重图案化的方法和材料 Methods and materials for double patterning |
| 01/07/2015 | CN102437075B 基板处理装置 Substrate processing apparatus |
| 01/07/2015 | CN102433546B 成膜方法和成膜装置 Film formation method and film forming apparatus |
| 01/07/2015 | CN102420228B 抑制gidl效应的后栅极工艺半导体器件及其制备方法 Gidl inhibition effect after gate process for preparing a semiconductor device and method |
| 01/07/2015 | CN102339774B 基板清洗装置、涂覆显影装置以及基板清洗方法 Substrate cleaning apparatus, a developing device and the coating substrate cleaning method |
| 01/07/2015 | CN102333623B 在电绝缘或半导电的基板中产生孔或孔阵列的方法及其阵列 Its array generating an array of holes or apertures in an electrically insulating or semi-conductive substrate |
| 01/07/2015 | CN102326240B 树脂涂覆设备和树脂涂覆用数据生成设备 Resin coating resin coating equipment and equipment used to generate data |
| 01/07/2015 | CN102324397B 衬底处理系统以及衬底搬送方法 A substrate processing system and a substrate transfer method |
| 01/07/2015 | CN102237399B 具有金属栅极的半导体元件及其制作方法 A semiconductor device and method of making the metal gate |
| 01/07/2015 | CN102157410B 衬底分析装置及衬底分析方法 Substrate analysis device and substrate analysis |
| 01/07/2015 | CN102132406B 包含应力松弛间隙以提升芯片封装交互作用的稳定性的半导体设备 Comprising stress relaxation interaction gap in order to enhance the stability of the chip package semiconductor device |
| 01/07/2015 | CN102117737B 减小半导体器件中ler的方法及半导体器件 Reducing the semiconductor device and method of a semiconductor device ler |
| 01/07/2015 | CN102110643B 电子混杂器件 Electronic hybrid devices |
| 01/07/2015 | CN102054681B 带扩张装置 With the expansion device |
| 01/07/2015 | CN101916723B 一种肖特基二极管的制备方法 One kind of the Schottky diode Preparation |
| 01/07/2015 | CN101878452B 剥离液组合物、使用了该剥离液组合物的树脂层的剥离方法 Stripping liquid composition, using a lift-off method of the stripping liquid composition of the resin layer |
| 01/07/2015 | CN101872783B 垂直超结双扩散金属氧化物半导体器件及制造方法 Vertical metal oxide semiconductor device and manufacturing method Superjunction double diffusion |
| 01/07/2015 | CN101866929B 共享字线的无触点氮化硅分栅式闪存及其制造方法 Non-contact silicon sub-gate flash memory and a manufacturing method for sharing the word lines |
| 01/07/2015 | CN101859789B 具有增加光取出效率的交流发光装置及其制造方法 Having increased light extraction efficiency AC light emitting device and manufacturing method thereof |
| 01/07/2015 | CN101773917B 硅片清洗装置及方法 Wafer cleaning apparatus and method |
| 01/06/2015 | US8930860 Layout decomposition method and method for manufacturing semiconductor device applying the same |
| 01/06/2015 | US8930782 Root cause distribution determination based on layout aware scan diagnosis results |
| 01/06/2015 | US8930717 Secure processing module and method for making the same |
| 01/06/2015 | US8930156 Metrology through use of feed forward feed sideways and measurement cell re-use |
| 01/06/2015 | US8930011 Method of measuring an overlay of an object |
| 01/06/2015 | US8929135 Non-volatile semiconductor memory device adapted to store a multi-valued data in a single memory cell |
| 01/06/2015 | US8929133 Complementary SOI lateral bipolar for SRAM in a CMOS platform |
| 01/06/2015 | US8929125 Apparatus and methods for forming a memory cell using charge monitoring |
| 01/06/2015 | US8929092 Circuit board, and semiconductor device having component mounted on circuit board |
| 01/06/2015 | US8929052 Methods of processing semiconductor substrates, electrostatic carriers for retaining substrates for processing, and assemblies comprising electrostatic carriers having substrates electrostatically bonded thereto |
| 01/06/2015 | US8929051 Apparatus and method for holding a wafer |
| 01/06/2015 | US8929035 Tunnel barrier sensor with multilayer structure |
| 01/06/2015 | US8928856 Exposure apparatus and device fabrication method |
| 01/06/2015 | US8928784 Solid-state imaging device, method of manufacturing the same, and electronic apparatus |
| 01/06/2015 | US8928410 Electronic circuits including a MOSFET and a dual-gate JFET |
| 01/06/2015 | US8928159 Alignment marks in substrate having through-substrate via (TSV) |
| 01/06/2015 | US8928157 Encapsulation techniques for leadless semiconductor packages |
| 01/06/2015 | US8928152 Semiconductor device including contact plug and method of manufacturing the same |
| 01/06/2015 | US8928150 Multi-chip package and method of manufacturing the same |
| 01/06/2015 | US8928149 Interlayer conductor and method for forming |
| 01/06/2015 | US8928143 Semiconductor device and method of manufacturing the same |
| 01/06/2015 | US8928141 Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained |
| 01/06/2015 | US8928136 Lead frame semiconductor device |
| 01/06/2015 | US8928134 Package on package bonding structure and method for forming the same |
| 01/06/2015 | US8928132 Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package |
| 01/06/2015 | US8928130 Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same |
| 01/06/2015 | US8928129 Semiconductor packaging for a memory device and a fabricating method thereof |
| 01/06/2015 | US8928126 Epitaxial layer |
| 01/06/2015 | US8928124 High aspect ratio and reduced undercut trench etch process for a semiconductor substrate |
| 01/06/2015 | US8928122 Wiring structure, thin film transistor array substrate including the same, and display device |
| 01/06/2015 | US8928121 Thermal stress reduction |
| 01/06/2015 | US8928120 Wafer edge protection structure |
| 01/06/2015 | US8928119 Three dimensional structure memory |
| 01/06/2015 | US8928117 Multi-chip package structure and method of forming same |
| 01/06/2015 | US8928114 Through-assembly via modules and methods for forming the same |