| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/06/2015 | US8926745 Method for preparing low K material and film thereof |
| 01/06/2015 | US8926321 Heating method for maintaining a stable thermal budget |
| 01/06/2015 | US8926259 Pick and place apparatus for electronic device inspection equipment |
| 01/06/2015 | US8926255 Component transfer apparatus and method |
| 01/06/2015 | US8926251 Container storage facility |
| 01/06/2015 | US8925608 Bonding head with a heatable and coolable suction member |
| 01/06/2015 | US8925562 Substrate processing apparatus and method of manufacturing semiconductor device |
| 01/06/2015 | US8925479 System and method of dosage profile control |
| 01/06/2015 | US8925396 Method and system for particles analysis in microstructure devices by isolating particles |
| 01/06/2015 | US8925186 System and method for picking and placement of chip dies |
| 01/06/2015 | CA2457919C Silicon carbide metal-oxide semiconductor field effect transistors and fabicating methods therefor |
| 01/02/2015 | CA2855325A1 Metal-oxide-semiconductor (mos) devices with increased channel periphery and methods of manufacture |
| 01/02/2015 | CA2855324A1 Metal-oxide-semiconductor (mos) devices with increased channel periphery and methods of manufacture |
| 01/02/2015 | CA2855304A1 Semiconductor devices and methods of manufacture |
| 01/01/2015 | US20150006108 Process condition sensing wafer and data analysis system |
| 01/01/2015 | US20150006097 Calculated Electrical Performance Metrics For Process Monitoring And Yield Management |
| 01/01/2015 | US20150005928 Substrate processing system and substrate position correction method |
| 01/01/2015 | US20150004888 Polishing pad with two-section window having recess |
| 01/01/2015 | US20150004808 Systems and methods for processing thin films |
| 01/01/2015 | US20150004807 Drawing apparatus, and method of manufacturing article |
| 01/01/2015 | US20150004806 Low-k oxide deposition by hydrolysis and condensation |
| 01/01/2015 | US20150004805 Methods of forming silicon-containing dielectric materials and semiconductor device structures, and related semiconductor device structures |
| 01/01/2015 | US20150004804 Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Non-transitory Computer-readable Recording Medium |
| 01/01/2015 | US20150004803 METHOD FOR FORMING TiN AND STORAGE MEDIUM |
| 01/01/2015 | US20150004802 Methods and Structures for Protecting One Area While Processing Another Area on a Chip |
| 01/01/2015 | US20150004801 Spin-on compositions of soluble metal oxide carboxylates and methods of their use |
| 01/01/2015 | US20150004800 Self-aligned patterning technique for semiconductor device features |
| 01/01/2015 | US20150004799 Machining process for semiconductor wafer |
| 01/01/2015 | US20150004798 Chemical deposition chamber having gas seal |
| 01/01/2015 | US20150004797 Method of stripping organic mask with reduced damage to low-k film |
| 01/01/2015 | US20150004796 Methods for forming three dimensional nand structures atop a substrate |
| 01/01/2015 | US20150004795 Plasma etching method and plasma etching apparatus |
| 01/01/2015 | US20150004794 Method of controlling temperature and plasma processing apparatus |
| 01/01/2015 | US20150004793 Plasma Processing Chamber with Dual Axial Gas Injection and Exhaust |
| 01/01/2015 | US20150004792 Method for treating wafer |
| 01/01/2015 | US20150004791 Composition for forming a coating type bpsg film, substrate formed a film by said composition, and patterning process using said composition |
| 01/01/2015 | US20150004790 Photocured product and method for producing the same |
| 01/01/2015 | US20150004789 Semiconductor manufacturing apparatus and method |
| 01/01/2015 | US20150004788 Chemical Mechanical Polishing Slurry Compositions and Method Using the Same for Copper and Through-Silicon Via Applications |
| 01/01/2015 | US20150004787 Sapphire Pad Conditioner |
| 01/01/2015 | US20150004786 Integrated circuit fabrication |
| 01/01/2015 | US20150004785 Self-aligned patterning technique for semiconductor device features |
| 01/01/2015 | US20150004784 Copper Wiring Forming Method |
| 01/01/2015 | US20150004783 Method for fabricating semiconductor device |
| 01/01/2015 | US20150004780 Metal gate structure and fabrication method thereof |
| 01/01/2015 | US20150004779 Structure and method for nfet with high k metal gate |
| 01/01/2015 | US20150004778 High linearity soi wafer for low-distortion circuit applications |
| 01/01/2015 | US20150004777 Methods of forming vertical cell semiconductor devices with single-crystalline channel structures |
| 01/01/2015 | US20150004776 Polysilicon layer preparing method |
| 01/01/2015 | US20150004775 Semiconductor nanocrystals, methods for preparing semiconductor nanocrystals, and products including same |
| 01/01/2015 | US20150004774 Methods of fabricating a semiconductor device including fine patterns |
| 01/01/2015 | US20150004773 Method for forming shallow trench isolation |
| 01/01/2015 | US20150004772 FinFET Fin Bending Reduction |
| 01/01/2015 | US20150004770 Method of fabricating a vertically oriented inductor within interconnect structures and capacitor structure thereof |
| 01/01/2015 | US20150004769 Method of Semiconductor Integrated Circuit Fabrication |
| 01/01/2015 | US20150004767 Method of forming nickel salicide on a silicon-germanium layer |
| 01/01/2015 | US20150004765 Carbon-doped cap for a raised active semiconductor region |
| 01/01/2015 | US20150004762 Method for producing functional device and apparatus for producing functional device |
| 01/01/2015 | US20150004761 Method of fabricating thin film transistor array substrate |
| 01/01/2015 | US20150004759 Thin-Film-Transistor Array Substrate and Manufacturing Method Thereof |
| 01/01/2015 | US20150004758 Etchant, method of manufacturing metal wiring and thin film transistor substrate using the etchant |
| 01/01/2015 | US20150004757 Semiconductor device and method for manufacturing same |
| 01/01/2015 | US20150004755 Method of Manufacturing a Semiconductor Device |
| 01/01/2015 | US20150004754 Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same |
| 01/01/2015 | US20150004753 Semiconductor package and manufacturing method thereof |
| 01/01/2015 | US20150004752 Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereof |
| 01/01/2015 | US20150004751 Dummy Flip Chip Bumps for Reducing Stress |
| 01/01/2015 | US20150004741 Wafer separation method, wafer separation and transfer method, and solar cell wafer separation and transfer method |
| 01/01/2015 | US20150004727 LED Package and Method of the Same |
| 01/01/2015 | US20150004723 Method of Inspecting Misalignment of Polysilicon Gate |
| 01/01/2015 | US20150004722 Method for Fabricating Light-Emitting Element and Light-Emitting Element |
| 01/01/2015 | US20150004721 Plasma processing apparatus and plasma processing method |
| 01/01/2015 | US20150004720 System and method for dispensing liquid spin-on glass (sog) onto semiconductor wafers |
| 01/01/2015 | US20150004400 Support assembly for use in semiconductor manufacturing tools with a fusible bond |
| 01/01/2015 | US20150004317 Organosilane precursors for ald/cvd silicon-containing film applications |
| 01/01/2015 | US20150003000 Methods of forming molded panel embedded die structures |
| 01/01/2015 | US20150002983 Multi-Resistivity Johnsen-Rahbek Electrostatic Clamp |
| 01/01/2015 | US20150002017 Gas diffuser unit, process chamber and wafer processing method |
| 01/01/2015 | US20150001741 Semiconductor Device and Method of Forming an Interposer Including a Beveled Edge |
| 01/01/2015 | US20150001740 Solution to deal with die warpage during 3d die-to-die stacking |
| 01/01/2015 | US20150001739 Wire tail connector for a semiconductor device |
| 01/01/2015 | US20150001736 Die connections using different underfill types for different regions |
| 01/01/2015 | US20150001735 Multipatterning via shrink method using ald spacer |
| 01/01/2015 | US20150001734 Conductive line patterning |
| 01/01/2015 | US20150001729 Semiconductor Device and Method of Forming Trench and Disposing Semiconductor Die Over Substrate to Control Outward Flow of Underfill Material |
| 01/01/2015 | US20150001728 Pre-treatment method for metal-oxide reduction and device formed |
| 01/01/2015 | US20150001724 Method of creating a maskless air gap in back end interconnects with double self-aligned vias |
| 01/01/2015 | US20150001720 Interconnect Structure and Method for Forming Interconnect Structure |
| 01/01/2015 | US20150001719 Semiconductor Device and Method for Producing the Same |
| 01/01/2015 | US20150001705 Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof |
| 01/01/2015 | US20150001700 Power Modules with Parylene Coating |
| 01/01/2015 | US20150001698 Leadless packages and method of manufacturing same |
| 01/01/2015 | US20150001696 Semiconductor die carrier structure and method of manufacturing the same |
| 01/01/2015 | US20150001691 Packaged semiconductor device |
| 01/01/2015 | US20150001687 Double patterning methods and structures |
| 01/01/2015 | US20150001685 Semiconductor packages having through electrodes and methods of fabricating the same |
| 01/01/2015 | US20150001684 Electroplating using dielectric bridges |
| 01/01/2015 | US20150001683 Dice before grind with backside metal |
| 01/01/2015 | US20150001682 Wafer edge protection structure |
| 01/01/2015 | US20150001681 Bonded Wafer Edge Protection Scheme |