Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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12/31/2014 | CN104253022A 电场间隙器件及其制造方法 Field gap device and its manufacturing method |
12/31/2014 | CN104253021A 电场间隙器件与制造方法 Device and method for producing the electric field gap |
12/31/2014 | CN104253020A 相变材料可变电容器 Phase change material of the variable capacitor |
12/31/2014 | CN104253019A 深沟槽电容器 Deep trench capacitor |
12/31/2014 | CN104253018A 半导体装置的制造方法 The method of manufacturing a semiconductor device |
12/31/2014 | CN104253017A 基片刻蚀方法 Moment method based eclipse |
12/31/2014 | CN104253016A 提高高阻产能的方法 Improve productivity high impedance method |
12/31/2014 | CN104253015A 降低二维晶体材料接触电阻的方法 Method of reducing the contact resistance of the two-dimensional crystalline material |
12/31/2014 | CN104252103A 光刻返工后残留光刻胶的去除方法 After lithography rework the residual photoresist removal method |
12/31/2014 | CN104252078A 阵列基板的制造方法,阵列基板及显示装置 The method of manufacturing an array substrate, an array substrate and a display device |
12/31/2014 | CN104252075A 液晶显示器的阵列基板及其制造方法 Array substrate and manufacturing method of a liquid crystal display |
12/31/2014 | CN104251758A 半导体压力传感器装置及其制造方法 The semiconductor pressure sensor device and manufacturing method thereof |
12/31/2014 | CN104250228A 用于硬掩膜组合物的单体和包括该单体的硬掩膜组合物以及使用其形成图案的方法 Monomer for the hard mask composition, and comprises the monomer composition and the hard mask pattern is formed using the method of |
12/31/2014 | CN104249933A 脆性材料基板的搬送方法及搬送装置 The method of conveyance of a brittle material substrate and conveying means |
12/31/2014 | CN104249899A 物品保管设备 The article storage facility |
12/31/2014 | CN104249898A 物品保管设备的检查装置 Check the device storage equipment items |
12/31/2014 | CN104249070A 清洁方法、制造半导体器件的方法和基材加工设备 Cleaning method, a method of manufacturing a semiconductor device and a substrate processing equipment |
12/31/2014 | CN103333617B 塑性软金属材料专用抛光液及其制备方法 Special polishing liquid plastic soft metal material and method |
12/31/2014 | CN103165537B 一种cmos管的掺杂方法 Doping method cmos tube |
12/31/2014 | CN103052492B 纳米压印用树脂制模具 A resin mold for nanoimprinting |
12/31/2014 | CN103035568B 一种tft阵列基板及制作方法、显示装置 One kind tft array substrate and manufacturing method, a display device |
12/31/2014 | CN103025629B 物品运送设备 Goods transport equipment |
12/31/2014 | CN103021842B 薄膜的背封工艺 Film back sealing process |
12/31/2014 | CN102983081B 一种由集成电路组成的半导体器件的制造方法 A method for manufacturing a semiconductor device by an integrated circuit composed of |
12/31/2014 | CN102969253B 一种引线键合机基座 A lead bonder base |
12/31/2014 | CN102938388B 一种热机轨道透明式盖板 A heat engine rail Transparent cover |
12/31/2014 | CN102916015B 一种基于SOI SiGe HBT的应变Si BiCMOS集成器件及制备方法 Strained Si BiCMOS integrated device and preparation method based on SOI SiGe HBT's |
12/31/2014 | CN102915974B 一种双极与p沟自对准jfet管兼容工艺 A bipolar and p-channel self-aligned jfet tube compatible process |
12/31/2014 | CN102911614B 用于制造半导体器件的胶粘带和使用该胶粘带制造半导体器件的方法 The method of using the adhesive tape and adhesive tape for manufacturing a semiconductor device for manufacturing a semiconductor device |
12/31/2014 | CN102869587B 物品输送设备 Transportation equipment items |
12/31/2014 | CN102856174B 氮化硅的膜制备方法、具有氮化硅膜的太阳能电池片及其制备方法 Preparation of silicon nitride membrane with solar cells and silicon nitride membrane preparation |
12/31/2014 | CN102832217B 一种基于自对准工艺的应变SiGe垂直沟道Si基BiCMOS集成器件及制备方法 A strained SiGe process based on self-aligned vertical channel Si-based BiCMOS integrated device and preparation method |
12/31/2014 | CN102820306B 一种三多晶应变SiGe BiCMOS集成器件及制备方法 One kind of over three crystal strained SiGe BiCMOS integrated device and preparation method |
12/31/2014 | CN102820295B 一种双应变平面BiCMOS集成器件及制备方法 A dual plane strain BiCMOS integrated device and preparation method |
12/31/2014 | CN102810568B 一种应变Si垂直沟道PMOS集成器件及制备方法 An integrated Si vertical channel PMOS devices and methods for preparing contingency |
12/31/2014 | CN102809859B 液晶显示装置、阵列基板及其制作方法 Device array substrate and method of making LCD |
12/31/2014 | CN102789977B 直立式金属氧化物半导体整流二极管及其制作方法 Vertical metal oxide semiconductor rectifier diode and manufacturing method thereof |
12/31/2014 | CN102779756B 半导体功率装置的制作方法 Fabrication of a semiconductor power device |
12/31/2014 | CN102768995B 具有芯片外控制器的存储器装置及其制造方法 A memory device and manufacturing method of the controller chip |
12/31/2014 | CN102768960B 封装结构及其制作方法 Package structure and manufacturing method thereof |
12/31/2014 | CN102762763B SiCOH低K膜的气相沉积法 Vapor deposition film of low-K SiCOH |
12/31/2014 | CN102760662B 半导体功率装置的制作方法 Fabrication of a semiconductor power device |
12/31/2014 | CN102751202B Bga封装器件芯片级失效定位夹具与方法 Bga chip-level packaged devices fail positioning fixture and method |
12/31/2014 | CN102741011B 激光加工系统 Laser Processing System |
12/31/2014 | CN102738049B 基板输送方法、基板输送装置和涂敷显影装置 Substrate transfer method, the substrate transfer means and the coating and developing apparatus |
12/31/2014 | CN102738034B 包含处理流体泄漏回收结构的半导体处理装置 The semiconductor processing apparatus for processing a fluid containing the leakage of recovered Structure |
12/31/2014 | CN102738032B 可校正工作面平整性的半导体处理装置 Face can be corrected flatness of semiconductor processing equipment |
12/31/2014 | CN102737979B 切片装置及切片方法 Slicing device and method for slicing |
12/31/2014 | CN102737962B 外延结构体及其制备方法 Epitaxial structure and preparation method |
12/31/2014 | CN102723299B 一种压电陶瓷抑振的xy精密运动平台 A piezoelectric ceramic vibration suppression xy precision motion platform |
12/31/2014 | CN102713758B 抗蚀剂底层组合物以及利用其制造半导体集成电路器件的方法 The resist layer composition and the use thereof a method for manufacturing a semiconductor integrated circuit device |
12/31/2014 | CN102712436B 基板盒及基板收容装置 The substrate and the substrate storage device box |
12/31/2014 | CN102709181B 提高硅晶体电池片转换效率的方法 Crystal silicon solar cells to improve the conversion efficiency of the method |
12/31/2014 | CN102709155B 一种金属电感的制备方法 The production method of a metal inductor |
12/31/2014 | CN102683179B 一种基于SLiM-Cut技术制备超薄硅片的方法 One technique for preparing ultra-thin silicon-based method SLiM-Cut |
12/31/2014 | CN102662092B 晶圆测试装置及方法 The wafer testing apparatus and method |
12/31/2014 | CN102598252B 安装结构体及其制造方法和安装结构体的修理方法 The method of installation and repair of structures and manufacturing method and mounting structure |
12/31/2014 | CN102595770B 电子装置、插入件以及制造电子装置的方法 Electronic device, the insert and a method of manufacturing an electronic device |
12/31/2014 | CN102593270B 发光二极管管芯及其制法 Light-emitting diode die Jiqizhifa |
12/31/2014 | CN102593111B Igbt模块及其制作方法 Igbt module and its manufacturing method |
12/31/2014 | CN102592972B 太阳能电池硅片的清洗方法 The cleaning method of silicon solar cells |
12/31/2014 | CN102581494B 加工对象物切断方法 Working object cutting method |
12/31/2014 | CN102569160B 半导体器件制作方法 The semiconductor device fabrication method |
12/31/2014 | CN102569130B 基板处理装置及基板处理方法 Substrate processing apparatus and substrate processing method |
12/31/2014 | CN102549731B 超声波焊接用铝带 Ultrasonic welding aluminum |
12/31/2014 | CN102543861B 阵列基板的形成方法 The method of forming an array substrate |
12/31/2014 | CN102479674B 一种晶圆制造方法 One kind of wafer fabrication method |
12/31/2014 | CN102477578B 图案化金属层的方法以及利用其的半导体器件制造方法 Patterned metal layer and the use of their method of a semiconductor device manufacturing method |
12/31/2014 | CN102473624B 双面抛光装置及其托架 Double-sided polishing apparatus and bracket |
12/31/2014 | CN102460684B 经囊封相变单元结构及方法 After sealing the capsule unit structure and method for a phase change |
12/31/2014 | CN102449771B 烷基硅烷层叠体及其制造方法、以及薄膜晶体管 Alkylsilane laminate and manufacturing method thereof, and a thin film transistor |
12/31/2014 | CN102365396B 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 Inhibitor containing submicron structure without voids filled with the metal plating composition |
12/31/2014 | CN102295894B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
12/31/2014 | CN102295893B 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method |
12/31/2014 | CN102263042B 晶片级回焊设备和焊料球体与倒装芯片组装体的制造 Wafer-level manufacturing equipment and reflow solder ball and flip chip assembly of |
12/31/2014 | CN102254896B 电子器件及其制造方法 Electronic device and manufacturing method thereof |
12/31/2014 | CN102231368B 半导体衬底的制造方法 The method of manufacturing a semiconductor substrate |
12/31/2014 | CN102138201B 用可变形束光刻的光学邻近校正、设计和制造光刻板方法 Deformable beam lithography using an optical proximity correction, design and manufacturing method of the reticle |
12/31/2014 | CN102136497B 集成的共源极功率mosfet器件及其制造方法 The integrated common source power mosfet device and manufacturing method thereof |
12/31/2014 | CN102074497B 半导体芯片和晶片堆叠封装件的制造方法 Semiconductor chips and chip stack manufacturing method of the package |
12/31/2014 | CN102054839B 一种mos场效应晶体管结构及其制备方法 One kind of mos field effect transistor structure and its preparation method |
12/31/2014 | CN101996980B 功率半导体模块和用于装配功率半导体模块的方法 The power semiconductor module and a method for assembling a power semiconductor module |
12/31/2014 | CN101989619B 薄膜晶体管基底和用于薄膜晶体管基底的薄膜晶体管 A thin film transistor substrate and a thin film transistor for a thin film transistor substrate |
12/31/2014 | CN101989558B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
12/31/2014 | CN101747842B 一种化学机械抛光液 A chemical mechanical polishing solution |
12/31/2014 | CN101653971B 切削装置 Cutting device |
12/30/2014 | US8924897 Mask pattern design method and semiconductor manufacturing method and semiconductor design program |
12/30/2014 | US8924118 Transfer system |
12/30/2014 | US8924014 Dual scanning stage |
12/30/2014 | US8923782 Switching device with diode-biased field-effect transistor (FET) |
12/30/2014 | US8923354 Nitride semiconductor laser, epitaxial substrate |
12/30/2014 | US8923050 3D memory with vertical bit lines and staircase word lines and vertical switches and methods thereof |
12/30/2014 | US8923048 3D non-volatile storage with transistor decoding structure |
12/30/2014 | US8923035 Junctionless semiconductor device having buried gate, apparatus including the same, and method for manufacturing the semiconductor device |
12/30/2014 | US8923008 Circuit board and method for manufacturing circuit board |
12/30/2014 | US8923005 Electrical component having an electrical connection arrangement and method for the manufacture thereof |
12/30/2014 | US8923004 Microelectronic packages with small footprints and associated methods of manufacturing |
12/30/2014 | US8922774 Method of manufacturing device, and substrate |
12/30/2014 | US8922756 Position measurement system, lithographic apparatus and device manufacturing method |
12/30/2014 | US8922755 Support structure, inspection apparatus, lithographic apparatus and methods for loading and unloading substrates |