Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/30/2014US8922027 Electronic device having electrodes bonded with each other
12/30/2014US8922026 Chip package and fabrication method thereof
12/30/2014US8922024 Semiconductor packages including molding layers
12/30/2014US8922022 Electromigration resistant via-to-line interconnect
12/30/2014US8922021 Die up fully molded fan-out wafer level packaging
12/30/2014US8922020 Integrated circuit pattern and method
12/30/2014US8922019 Semiconductor device having a copper plug
12/30/2014US8922018 Semiconductor device and semiconductor device manufacturing method
12/30/2014US8922013 Through via package
12/30/2014US8922011 Mounting structure of electronic component with joining portions and method of manufacturing the same
12/30/2014US8922007 Semiconductor package
12/30/2014US8922003 Low OHMIC contacts
12/30/2014US8922002 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
12/30/2014US8921999 Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device
12/30/2014US8921996 Power module substrate, power module, and method for manufacturing power module substrate
12/30/2014US8921994 Thermally enhanced package with lid heat spreader
12/30/2014US8921992 Stacked wafer with coolant channels
12/30/2014US8921987 Semiconductor device and measurement device having an oscillator
12/30/2014US8921985 Semiconductor device and method for manufacturing the same
12/30/2014US8921984 Through silicon via in semiconductor device
12/30/2014US8921983 Semiconductor package and method of forming similar structure for top and bottom bonding pads
12/30/2014US8921979 Method for producing a semiconductor layer
12/30/2014US8921978 Dual DNW isolation structure for reducing RF noise on high voltage semiconductor devices
12/30/2014US8921975 System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme
12/30/2014US8921974 Semiconductor manufacturing and semiconductor device with semiconductor structure
12/30/2014US8921973 Semiconductor device
12/30/2014US8921972 High voltage metal-oxide-semiconductor transistor device
12/30/2014US8921971 Fibrous laminate interface for security coatings
12/30/2014US8921970 Semiconductor device and structure
12/30/2014US8921968 Selective emitter solar cells formed by a hybrid diffusion and ion implantation process
12/30/2014US8921962 Planar multiferroic/magnetostrictive nanostructures as memory elements, two-stage logic gates and four-state logic elements for information processing
12/30/2014US8921961 Storage element for STT MRAM applications
12/30/2014US8921959 MRAM device and fabrication method thereof
12/30/2014US8921957 Method of improving MEMS microphone mechanical stability
12/30/2014US8921954 Method of providing a semiconductor structure with forming a sacrificial structure
12/30/2014US8921952 Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof
12/30/2014US8921948 Semiconductor device and manufacturing method thereof
12/30/2014US8921947 Multi-metal gate semiconductor device having triple diameter metal opening
12/30/2014US8921946 Integrated circuit resistor
12/30/2014US8921944 Semiconductor device
12/30/2014US8921943 Methods and apparatus for ESD structures
12/30/2014US8921941 ESD protection device and method for fabricating the same
12/30/2014US8921940 Semiconductor device and a method for fabricating the same
12/30/2014US8921938 Laterally diffused metal oxide semiconductor (LDMOS) device with overlapping wells
12/30/2014US8921937 High voltage metal-oxide-semiconductor transistor device and method of fabricating the same
12/30/2014US8921932 Semiconductor device
12/30/2014US8921928 Semiconductor device with low on resistance
12/30/2014US8921925 Semiconductor device, method of manufacturing the same, and power module
12/30/2014US8921923 Method for manufacturing semiconductor memory device and semiconductor memory device
12/30/2014US8921921 Nonvolatile memory device and method for fabricating the same
12/30/2014US8921920 Semiconductor device
12/30/2014US8921917 Split gate flash cell and method for making the same
12/30/2014US8921916 Single poly electrically erasable programmable read only memory (single poly EEPROM) device
12/30/2014US8921914 Devices with nanocrystals and methods of formation
12/30/2014US8921913 Floating gate forming process
12/30/2014US8921906 Disposable pillars for contact formation
12/30/2014US8921904 Replacement gate fabrication methods
12/30/2014US8921903 Lateral junction field-effect transistor
12/30/2014US8921899 Double gated 4F2 dram CHC cell and methods of fabricating the same
12/30/2014US8921894 Field effect transistor, method for producing the same, and electronic device
12/30/2014US8921891 Vertical memory cell string with dielectric in a portion of the body
12/30/2014US8921888 Method of making semiconductor device
12/30/2014US8921867 Thin-film transistor, display panel, and method for producing a thin-film transistor
12/30/2014US8921863 Thin film transistor having oxide semiconductor layer as ohmic contact layer
12/30/2014US8921852 Thin film transistor array panel and method of manufacturing the same
12/30/2014US8921851 Non-polar plane of wurtzite structure material
12/30/2014US8921824 3-dimensional graphene structure and process for preparing and transferring the same
12/30/2014US8921823 Memory cell constructions, and methods for fabricating memory cell constructions
12/30/2014US8921822 Phase-change random access memory device and method of manufacturing the same
12/30/2014US8921821 Memory cells
12/30/2014US8921819 Resistive random access memory and fabrication method thereof
12/30/2014US8921812 Reticle protection member, reticle carrying device, exposure device and method for carrying reticle
12/30/2014US8921781 Measurement or inspecting apparatus
12/30/2014US8921740 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
12/30/2014US8921733 Methods and systems for trimming circuits
12/30/2014US8921708 Electronic-component mounted body, electronic component, and circuit board
12/30/2014US8921703 Circuit board, structural unit thereof and manufacturing method thereof
12/30/2014US8921686 Back-contact photovoltaic cell comprising a thin lamina having a superstrate receiver element
12/30/2014US8921240 Ion implantation method
12/30/2014US8921239 Process for recycling a substrate
12/30/2014US8921238 Method for processing high-k dielectric layer
12/30/2014US8921237 Method of depositing a film
12/30/2014US8921236 Patterning for selective area deposition
12/30/2014US8921235 Controlled air gap formation
12/30/2014US8921234 Selective titanium nitride etching
12/30/2014US8921233 Microelectronic fabrication methods using composite layers for double patterning
12/30/2014US8921232 Taper-etching method and method of manufacturing near-field light generator
12/30/2014US8921231 Group III nitride wafer and its production method
12/30/2014US8921230 Etchant composition, and method of manufacturing a display substrate using the same
12/30/2014US8921229 Method of polishing copper wiring surfaces in ultra large scale integrated circuits
12/30/2014US8921228 Method for selectively depositing noble metals on metal/metal nitride substrates
12/30/2014US8921227 Semiconductor device assembly and semiconductor device and method of manufacturing the same
12/30/2014US8921226 Method of forming semiconductor structure having contact plug
12/30/2014US8921225 Method for off-grid routing structures utilizing self aligned double patterning (SADP) technology
12/30/2014US8921224 Semiconductor device having through electrode and method for manufacturing the same
12/30/2014US8921223 Semiconductor device with damascene bit line and method for fabricating the same
12/30/2014US8921222 Pillar structure having a non-planar surface for semiconductor devices
12/30/2014US8921221 IMS (injection molded solder) with two resist layers forming solder bumps on substrates
12/30/2014US8921220 Selective low-temperature ohmic contact formation method for group III-nitride heterojunction structured device
12/30/2014US8921219 Process for fabricating a transistor comprising nanocrystals
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