Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2014
12/31/2014CN104253164A 带有集成肖特基二极管的mosfet With integrated Schottky diode mosfet
12/31/2014CN104253162A 双向esd二极管结构及其形成方法 Esd bidirectional diode structure and method of forming
12/31/2014CN104253160A 一种具有凸面栅极结构的B4-Flash Gate structure having a convex B4-Flash
12/31/2014CN104253159A 薄膜晶体管及制备方法、阵列基板及制备方法和显示装置 Thin film transistor and method of preparation, array substrate preparation method and display device
12/31/2014CN104253158A 薄膜晶体管及其制造方法 A thin film transistor and manufacturing method thereof
12/31/2014CN104253157A 薄本体开关晶体管 Thin body switching transistor
12/31/2014CN104253156A 具有水平半导体元件和垂直半导体元件的半导体部件 Semiconductor component having a semiconductor element and the vertical level of the semiconductor element
12/31/2014CN104253155A 功率器件及其制造方法 Power device and manufacturing method thereof
12/31/2014CN104253154A 一种具有内置二极管的igbt及其制造方法 Igbt having a built-in diode and its manufacturing method
12/31/2014CN104253153A 场截止型反向导通绝缘栅双极型晶体管及其制造方法 Field cut-off reverse-conducting insulated gate bipolar transistor and its manufacturing method
12/31/2014CN104253152A 一种igbt及其制造方法 One kind igbt its manufacturing method
12/31/2014CN104253151A 场截止型反向导通绝缘栅双极型晶体管及其制造方法 Field cut-off reverse-conducting insulated gate bipolar transistor and its manufacturing method
12/31/2014CN104253150A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/31/2014CN104253141A 有机发光二极管显示装置及其制造方法 The organic light emitting diode display device and manufacturing method thereof
12/31/2014CN104253140A 电阻型随机存取存储器单元 Resistive random access memory unit
12/31/2014CN104253132A 具有金属氧化物半导体的薄膜晶体管基板及其制造方法 The thin film transistor substrate and manufacturing method of a metal oxide semiconductor
12/31/2014CN104253129A 硅-氧化物-氮化物-氧化物-硅组件及其制作方法 Silicon - oxide - nitride - oxide - silicon components and production methods
12/31/2014CN104253127A 具有降低衬底翘曲的背面结构的集成电路 Has reduced the back of the structure of the substrate warping integrated circuit
12/31/2014CN104253116A 用于嵌入式管芯的封装组件及相关联的技术和配置 For embedded die package assembly and associated technologies and configurations
12/31/2014CN104253114A 嵌入式封装结构及其制造方法 Embedded package structure and manufacturing method
12/31/2014CN104253111A 用于ic封装的硅空间转变器 Silicon space for ic package mutator
12/31/2014CN104253110A 衬底间通孔连接结构及其制造方法 Vias connecting structure between the substrate and its manufacturing method
12/31/2014CN104253109A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/31/2014CN104253108A 互连结构及其形成方法 Interconnect structure and method of forming
12/31/2014CN104253107A 具有自保护熔丝的半导体器件及其制造方法 A semiconductor device having self-protection fuse and its manufacturing method
12/31/2014CN104253105A 半导体器件和形成低廓形3d扇出封装的方法 Semiconductor devices and form a low profile shape 3d fan-out package method
12/31/2014CN104253103A 交错管脚的引线框架结构以及半导体器件制造方法 Staggered pin leadframe structure and a semiconductor device manufacturing method
12/31/2014CN104253102A 半导体器件和用于制造其的方法 The method of manufacturing a semiconductor device and means for its
12/31/2014CN104253099A 用于半导体器件的焊盘结构布局 Pad layout structure for semiconductor devices
12/31/2014CN104253097A 散热装置及通过注塑体接合形成的散热装置的制造方法 Method of manufacturing a heat sink and cooling means is formed by bonding of molded body
12/31/2014CN104253092A 分层衬底上有嵌入载盘的集成电路封装系统及其制造方法 There is an embedded integrated circuit package carrier disc system and method for manufacturing the layered substrate
12/31/2014CN104253091A 薄膜晶体管基板的制造方法 The method of manufacturing a thin film transistor substrate
12/31/2014CN104253090A Cmos晶体管的形成方法 The method of forming a transistor Cmos
12/31/2014CN104253089A 一种阵列基板的制备方法、阵列基板及显示装置 Method for preparing the array substrate, the array substrate and a display device
12/31/2014CN104253088A 防止铝尖楔的成膜工艺方法 Prevent the filming process for aluminum wedge tip
12/31/2014CN104253087A 铝金属工艺接触孔的填充方法 Aluminum craft filling method of contact holes
12/31/2014CN104253086A 用于金属氧化物还原的预处理方法和所形成的器件 Pretreatment method for reduction of the metal oxide and the device is formed
12/31/2014CN104253085A 一种消除顶层金属层结合区合金表面隆起的方法 Top metal layer of an alloy surface uplift method to eliminate binding region
12/31/2014CN104253084A 防止钨损失的半导体器件及相应的制造方法 To prevent the loss of the semiconductor device of tungsten and corresponding manufacturing method
12/31/2014CN104253083A 熔丝器件的制备方法 Preparation fuse device
12/31/2014CN104253082A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/31/2014CN104253081A 半导体器件的形成方法 The method of forming a semiconductor device
12/31/2014CN104253080A 浅沟槽隔离方法 Shallow trench isolation method
12/31/2014CN104253079A 浅沟槽隔离结构、包含其的晶体管及其制作方法 Shallow trench isolation structure, including its transistor and manufacturing method thereof
12/31/2014CN104253078A 具有微槽不粘表面的安装夹具 Stick micro slot with a mounting fixture surface
12/31/2014CN104253077A 一种用于扩散炉管的晶座 Crystal Block A diffusion furnace tube
12/31/2014CN104253076A 保管设备 Storage devices
12/31/2014CN104253075A 用于化学气相沉积的晶圆传输装置 Wafer transfer apparatus for chemical vapor deposition
12/31/2014CN104253074A 一种太阳能电池板转运工装 A solar panel transfer tooling
12/31/2014CN104253073A 衬底处理装置、半导体器件的制造方法及流量监视方法 The method of manufacturing a substrate processing apparatus, a semiconductor device and flow monitoring method
12/31/2014CN104253072A 基板处理装置 Substrate processing apparatus
12/31/2014CN104253071A 有集成工艺边缘成像和计量系统的电镀和电填充后系统 Edge technology with integrated imaging and measurement systems and electric plating after filling system
12/31/2014CN104253070A 使用成像设备以调整半导体元件的处理设备的装置和方法 Apparatus and method uses an imaging device to adjust the semiconductor element processing apparatus
12/31/2014CN104253069A 处理设备 Handling equipment
12/31/2014CN104253068A 惰性气体供给设备及惰性气体供给方法 An inert gas supply device and an inert gas supply method
12/31/2014CN104253067A 基板处理装置、沉积装置、基板处理方法及沉积方法 Substrate processing apparatus, the deposition apparatus, a substrate processing method and deposition method
12/31/2014CN104253066A 防静电热板结构 Anti-static hot plate structure
12/31/2014CN104253065A 半导体制程机台及其半导体制程 Semiconductor manufacturing machines and semiconductor manufacturing process
12/31/2014CN104253064A 一种半导体熔炉加热器固定装置 A semiconductor heater furnace fixtures
12/31/2014CN104253063A 一种用于防止晶片偏移掉落的装置 An apparatus for preventing falling of the wafer offset
12/31/2014CN104253062A 一种偶极环磁铁反应腔电弧的监测方法 Monitoring the reaction chamber of a dipole magnet ring arc
12/31/2014CN104253061A 一种检测源极多晶硅经化学机械研磨后表面异常的方法 A method of detecting extremely polysilicon surface after chemical mechanical polishing method abnormal source
12/31/2014CN104253060A 半导体工艺的温度测量和调节方法 Temperature measurement and adjustment method of a semiconductor process
12/31/2014CN104253059A 电迁移可靠性测试结构及其使用方法 Reliability test structures and methods of using electro-migration
12/31/2014CN104253058A 在扇出型wlcsp上堆叠半导体小片的方法及半导体装置 On the fan-out wlcsp stacked semiconductor die method and semiconductor device
12/31/2014CN104253057A 半导体管芯载体结构及其制造方法 The semiconductor die carrier structure and manufacturing method
12/31/2014CN104253056A 具有穿通电极的半导体封装及其制造方法 Having a semiconductor package and method of manufacturing the through electrodes
12/31/2014CN104253055A 焊接方法及半导体装置的制造方法 The method of manufacturing a semiconductor device and a method of welding
12/31/2014CN104253054A 半导体装置 Semiconductor device
12/31/2014CN104253053A 具有与凹槽相对准的焊料区的封装件 With a package aligned with the grooves of the solder area
12/31/2014CN104253052A 金属内连线结构及其制造方法 Metal wiring structure and its manufacturing method
12/31/2014CN104253051A 分裂栅存储器单元结构的方法及结构 Split-gate memory cell structure method and structure
12/31/2014CN104253050A 一种槽型横向mosfet器件的制造方法 A method of manufacturing a lateral groove mosfet devices
12/31/2014CN104253049A 半导体器件制造方法 The semiconductor device manufacturing method
12/31/2014CN104253048A 堆叠纳米线制造方法 Stacked nanowire fabrication method
12/31/2014CN104253047A 晶体管的形成方法 The method for forming a transistor
12/31/2014CN104253046A 鳍式场效应晶体管及其形成方法 Fin field-effect transistor and method of forming
12/31/2014CN104253045A Vdmos器件及其制造方法 Vdmos device and manufacturing method thereof
12/31/2014CN104253044A 晶体管及其形成方法 Transistor and method of forming
12/31/2014CN104253043A 制造场截止型绝缘栅双极晶体管的方法 Manufacturing a field-type insulated gate bipolar transistor cutoff method
12/31/2014CN104253042A 一种绝缘栅双极晶体管的制造方法 A method of manufacturing an insulated gate bipolar transistor
12/31/2014CN104253041A 非穿通型绝缘栅双极晶体管的制造方法 Non-punch-through method of manufacturing insulated gate bipolar transistor
12/31/2014CN104253040A Trench FS结构的绝缘栅双极型晶体管的制备方法 Preparation Trench FS structure insulated gate bipolar transistor
12/31/2014CN104253039A 一种降低晶圆破损率的薄晶圆背面金属溅射方法 A method for reducing wafer breakage rate of thin wafer backside metallization sputtering method
12/31/2014CN104253038A 一种改善半导体器件层间介质层隔离的方法 An inter-layer semiconductor device layer dielectric isolation method of improving
12/31/2014CN104253037A 一种改善刻蚀糊胶的方法 A method of improving the etching paste that
12/31/2014CN104253036A 等离子体蚀刻方法及等离子体蚀刻装置 The plasma etching method and a plasma etching apparatus
12/31/2014CN104253035A 基片刻蚀方法 Moment method based eclipse
12/31/2014CN104253034A 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/31/2014CN104253033A 半导体晶圆背面工艺和功率器件的形成方法 The method for forming a semiconductor wafer backside processes and power devices
12/31/2014CN104253032A 半导体器件制造方法 The semiconductor device manufacturing method
12/31/2014CN104253031A 进行再沉积制程时改善掺杂多晶硅片电阻阻值差异的方法 Improve the re-deposition process when doped polysilicon film resistor difference method
12/31/2014CN104253030A 制造半导体集成电路的方法 The method of manufacturing a semiconductor integrated circuit
12/31/2014CN104253029A 晶体管的形成方法 The method for forming a transistor
12/31/2014CN104253028A 一种半导体圆片背面注入时对正面的保护方法 When injected into the back of a semiconductor wafer frontal protection methods
12/31/2014CN104253027A 双重图形及其形成方法 Double patterning and forming method
12/31/2014CN104253026A 制备多晶硅层的方法 The method for preparing the polysilicon layer
12/31/2014CN104253025A 消隐装置、绘制装置和物品的制造方法 Blanking apparatus, device manufacturing method and articles of the drawing
12/31/2014CN104253024A 硬掩模组合物、使用其形成图案的方法以及包括该图案的半导体集成电路装置 Hardmask composition, use thereof and method for forming a pattern comprising the pattern of a semiconductor integrated circuit device
12/31/2014CN104253023A 基板处理装置 Substrate processing apparatus
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