Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/08/2013CN103094146A Cleaning apparatus, measurement method and calibration method
05/08/2013CN103094145A End point detection in grinding
05/08/2013CN103094144A Method used for forecasting threshold voltage of metal oxide semiconductor (MOS) tube
05/08/2013CN103094143A Ion implantation monitoring method
05/08/2013CN103094142A Special wafer layout configuration method used for detecting probe card and manufacture of wafer
05/08/2013CN103094141A Judgment method of punchthrough of PN junction device
05/08/2013CN103094140A Semiconductor device assembly method and semiconductor device assembly jig
05/08/2013CN103094139A Flip chip bonding method
05/08/2013CN103094138A Three-dimensional (3d) integrated circuit with enhanced copper-to-copper bonding and forming method thereof
05/08/2013CN103094137A Methods of and semiconductor device with ball strength improvement
05/08/2013CN103094136A Forming method for semiconductor device
05/08/2013CN103094135A Encapsulation method for flip chip
05/08/2013CN103094134A Method and chip of increasing thickness of metal layer of chip bonding block area
05/08/2013CN103094133A Semiconductor device mounting substrate
05/08/2013CN103094132A Manufacture process using widened mould fake cavity to optimize secondary plastic package part
05/08/2013CN103094131A Stacked packages using laser direct structuring
05/08/2013CN103094130A Apparatus and methods for molded underfills in flip chip packaging
05/08/2013CN103094129A Packaging technology of semiconductor device
05/08/2013CN103094128A Fan-out Panel Level ball grid array (BGA) package part manufacture process
05/08/2013CN103094127A Pasting-mounted clamp of direct bonding copper base plate used for packing insulated gate bipolar transistor (IGBT) module
05/08/2013CN103094126A Preparation method of subtle stereoscopic conducting circuit of ceramic element
05/08/2013CN103094125A Integrated method of carbon nano tube heat dissipation structure and electronic device
05/08/2013CN103094124A Structure and manufacturing method of high pressure technotron
05/08/2013CN103094123A Thin film transistor manufacturing method
05/08/2013CN103094122A Preparation technology of low-pressure ZnO thin film transistor of bottom-gate structure
05/08/2013CN103094121A Method For Forming A Semiconductor Device
05/08/2013CN103094120A Manufacturing method of semiconductor structure
05/08/2013CN103094119A Manufacturing method of semiconductor device
05/08/2013CN103094118A Technique method of manufacturing double-layer gate groove metal oxide semiconductor (MOS)
05/08/2013CN103094117A Technique method of manufacturing bottom thick grate oxide layer groove metal oxide semiconductor (MOS)
05/08/2013CN103094116A Technique method of manufacturing groove metal oxide semiconductor (MOS)
05/08/2013CN103094115A Technique method of manufacturing double-layer gate groove metal oxide semiconductor (MOS)
05/08/2013CN103094114A Manufacturing method of transistor
05/08/2013CN103094113A Formation method of n-channel metal oxide semiconductor (NMOS) and formation method of complementary metal oxide semiconductor (CMOS)
05/08/2013CN103094112A Formation method of fin parts of fin type transistor
05/08/2013CN103094111A Double diffusion metal oxide semi-conductor (DMOS) device and manufacturing method thereof
05/08/2013CN103094110A Method of manufacturing semiconductor device
05/08/2013CN103094109A Method of manufacturing semiconductor device
05/08/2013CN103094108A Manufacturing method for semiconductor device
05/08/2013CN103094107A Filling method of silicon epitaxy for deep trench
05/08/2013CN103094106A Preparation method for alternant P-typed and N-typed thin semiconductor layer
05/08/2013CN103094105A A face normally closed type high electron mobility transistor (HEMT) manufacturing method through adoption of GaN self-imaging template
05/08/2013CN103094104A Bipolar horizontal plug and play (PNP) tube manufacture process using phosphorus buried layer and concentrated phosphorus buried technique
05/08/2013CN103094103A Preparation method of audion and prepared audion using method
05/08/2013CN103094102A Method of eliminating etching residue of emitting electrode polycrystalline silicon in duotriode type transistor technology
05/08/2013CN103094101A Manufacturing method of semiconductor device for ESD protection
05/08/2013CN103094100A Method of forming schottky diode
05/08/2013CN103094099A Method of wafer annealing after bonding
05/08/2013CN103094098A Method for solving problem of wafer breaking
05/08/2013CN103094097A Manufacturing method for semiconductor device
05/08/2013CN103094096A Peeling craft method used for forming semiconductor component metal graph
05/08/2013CN103094095A Method to manufacture semi-conductor device
05/08/2013CN103094094A Prepared method of ultrathin semiconductor chip
05/08/2013CN103094093A Method and device for photoresist coating
05/08/2013CN103094092A Method of solving residues after protection ring is etched
05/08/2013CN103094091A Etching method of semi-conductor device
05/08/2013CN103094090A Method making back of wafer flat
05/08/2013CN103094089A Fin field effect transistor gate oxide
05/08/2013CN103094088A Technique for improving radio frequency (RF) lateral double-diffused metal-oxide semiconductor (LDMOS) grid electrode metal silicide forming
05/08/2013CN103094087A Method of etching groove polycrystalline silicon gate
05/08/2013CN103094086A Formation method of complementary metal oxide semi-conductor transistor (CMOS)
05/08/2013CN103094085A Formation method of complementary metal oxide semi-conductor transistor (CMOS)
05/08/2013CN103094084A Method of eliminating silicon nitride side wall, formation transistor and semi-conductor device
05/08/2013CN103094083A Method of eliminating silicon nitride side wall, formation transistor and semi-conductor device
05/08/2013CN103094082A Method to manufacture semi-conductor device
05/08/2013CN103094081A Crystallization apparatus, crystallization method, organic light emitting display apparatus and method of manufacturing organic light emitting display apparatus
05/08/2013CN103094080A Ion layer preparation method and device of graphene semiconductor
05/08/2013CN103094079A Method for improving power metal oxide semiconductor (MOS) device unclamped inductive switching (UIS) performance
05/08/2013CN103094078A Gallium nitride extension preparation method for semiconductor device
05/08/2013CN103094077A Method of forming silicon oxide film
05/08/2013CN103094076A Method for improving 0.18mu m technology metal injection molding (MIM) capacitive performance
05/08/2013CN103094075A Method for forming long seamless filling amorphous silicon groove
05/08/2013CN103094074A Technique method of manufacturing bottom thick gate oxide layer groove Metal Oxide Semiconductor (MOS) through selective epitaxy
05/08/2013CN103094073A Preparation method of semi-insulating silicon carbide substrate titanium ohmic contact electrode
05/08/2013CN103094072A Method of improving uniformity of photoetching critical size of wafer upper gate electrode
05/08/2013CN103094071A Method for producing zinc oxide on gallium nitride and application thereof
05/08/2013CN103094070A Semiconductor device comprising pair of matched capacitors, method for form capacitors, and method for forming resistor
05/08/2013CN103094069A Pixel structure and manufacturing method thereof
05/08/2013CN103094068A High-density and embedded-type capacitor and manufacturing method of the same
05/08/2013CN103094067A Manufacture method of semi-conductor device
05/08/2013CN103094066A Cleaning method of wafer in production
05/08/2013CN103094037A Holding device and plasma processing device using the same
05/08/2013CN103094035A Method and device of broadband bundle uniformity controlling
05/08/2013CN103092009A Removing method of photoresist used as masking layer of plasma injection
05/08/2013CN103091998A Lithographic apparatus and substrate handling method
05/08/2013CN103091995A Method for reducing chip edge photoresistance slope region
05/08/2013CN103091987A Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
05/08/2013CN103091981A Method for manufacturing metal grid template for photolithography by utilizing self-assembling ball
05/08/2013CN103091971A Mask plate and manufacturing method thereof, and method for monitoring fog pollutions of mask plate
05/08/2013CN103091921A Array substrate, preparation method of array substrate and display device of array substrate
05/08/2013CN103091919A Array substrate, preparation method of array substrate and display device of array substrate
05/08/2013CN103091914A Fringe Field Switching Liquid Crystal Display Device And Method Of Fabricating The Same
05/08/2013CN103091912A Array Substrate, Liquid Crystal Display For The Same And Manufacturing Method Thereof
05/08/2013CN103091878A Repairing method of glass substrate
05/08/2013CN103091515A Jig For Use In Semiconductor Test And Method Of Measuring Breakdown Voltage By Using The Jig
05/08/2013CN103091326A Method for identifying defect type
05/08/2013CN103090931A System for monitoring needle cylinder remaining amount and chip mounting machine comprising same
05/08/2013CN103088431A Device for eliminating phosphorus oxychloride in phosphorus diffusion furnace
05/08/2013CN103088430A Improved structure of device for eliminating phosphorus oxychloride in phosphorus diffusion furnace
05/08/2013CN103088429A Method for eliminating phosphorus oxychloride in phosphorus diffusion furnace
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