Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/02/2013US20130105798 Thin-film semiconductor device and method for fabricating thin-film semiconductor device
05/02/2013US20130105797 Thin-film semiconductor device and method of manufacturing the same
05/02/2013US20130105796 Semiconductor structures and fabrication method
05/02/2013US20130105790 Thin film transistor substrate and method fabricating the same
05/02/2013US20130105765 Graphene and Nanotube/Nanowire Transistor with a Self-Aligned Gate Structure on Transparent Substrates and Method of Making Same
05/02/2013US20130105764 Tunneling field effect transistor structure and method for forming the same
05/02/2013US20130105763 Semiconductor device and manufacturing method thereof
05/02/2013US20130105762 Nitride semiconductor light emitting device, method of fabricating nitride semiconductor light emitting device
05/02/2013US20130105757 Phase change memory devices and methods of manufacturing the same
05/02/2013US20130105755 Methods of forming semiconductor device structures, and related structures
05/02/2013US20130105559 Conductive sidewall for microbumps
05/02/2013US20130105539 Clamping apparatus for cleaving a bonded wafer structure
05/02/2013US20130105538 Methods for cleaving a bonded wafer structure
05/02/2013US20130105088 Thermal management of edge ring in semiconductor processing
05/02/2013US20130105085 Plasma reactor with chamber wall temperature control
05/02/2013US20130105083 Systems Comprising Silicon Coated Gas Supply Conduits And Methods For Applying Coatings
05/02/2013US20130104804 Batch-Type Remote Plasma Processing Apparatus
05/02/2013DE112011102297T5 Verfahren zum Polieren von Siliziumwafern und Beschreibung der entsprechenden Polierflüssigkeit A method for polishing of silicon wafers and description of the respective polishing liquid
05/02/2013DE112011102252T5 Verfahren zum Polieren von Siliziumwafern A method for polishing of silicon wafers
05/02/2013DE112011101956T5 Solarzellen-Herstellungsvorrichtung und Solarzellen-Herstellungsverfahren Solar cell manufacturing apparatus, and solar-cell manufacturing process
05/02/2013DE112010003248T5 Plasma-CVD-Vorrichtung, Plasma-Elektrode und Verfahren zum Herstellen einerHalbleiterschicht Plasma CVD apparatus, a plasma electrode and method for fabricating a semiconductor layer
05/02/2013DE112009004253T5 Trockenreinigung einer Siliziumoberfläche für Solarzellenanwendungen Dry cleaning a silicon surface for solar cell applications
05/02/2013DE102012219510A1 Halbleiterbauelement Semiconductor device
05/02/2013DE102012218492A1 Aufspannvorrichtung zur Verwendung im Halbleitertest und Verfahren für das Messen einer Durchschlagspannung unter Verwendung der Aufspannvorrichtung Jig for use in semiconductor test and method for measuring a breakdown voltage using the jig
05/02/2013DE102012214559A1 Graphen- und Nanoröhrchen-/Nanodraht-Transistor mit einer selbstausgerichteten Gate-Elektrodenstruktur auf transparenten Substraten und Verfahren zur Herstellung desselben Same graph and Nanoröhrchen- / nanowire transistor having a self-aligned gate electrode structure on transparent substrates and methods for making
05/02/2013DE102012211834A1 Transistoren mit einer Kanalhalbleiterlegierung, die in einer frühen Prozessphase auf Basis einer Hartmaske hergestellt wird Transistors with a channel semiconductor alloy which is produced at an early stage of the process on the basis of a hard mask
05/02/2013DE102012203055A1 Sputtering target useful for coating substrates with a transparent conductive layer, comprises a gallium-doped zinc-containing material, which is metallic and has a further doping of a further material made of elements of a third main group
05/02/2013DE102012110188A1 Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung Electronic device and method for manufacturing an electronic device
05/02/2013DE102012110000A1 3D-Chipaufbau mit abgeschirmten Strukturen 3D chip structure with shielded structures
05/02/2013DE102012109870A1 Verfahren zum Ätzen eines Substrats A method for etching a substrate
05/02/2013DE102012021534A1 Schottky-sperrschicht-halbleiterelement vom grabentyp und herstellungsverfahren dafür Schottky-barrier-layer-semiconductor element from the grave type and manufacturing processes for
05/02/2013DE102012021051A1 Verfahren zum Polieren eines Substrats A method for polishing a substrate
05/02/2013DE102012021050A1 Polierverfahren unter Verwendung einer abstimmbaren Polierformulierung A polishing method using a polishing tunable formulation
05/02/2013DE102012020978A1 Transistoranordnung mit hoher Elektronenbeweglichkeit und Verfahren High electron mobility transistor structure and method
05/02/2013DE102011117490A1 Vapor chamber radiator for cooling components in electronic device, has main body comprising two plates, and cavity exhibiting capillary structure, supporting structure and work fluid, where opening passes through plates and cavity
05/02/2013DE102011055006A1 Method for feeding saw wire in multi wire saw used for cutting silicon wafer, involves rotating secondary peripheral region of saw wire into abrasive zone when saw wire is partially rotated about longitudinal axis
05/02/2013DE102011054891A1 Verfahren zum Durchtrennen eines Halbleiterbauelementverbunds A method of separating a composite semiconductor component
05/01/2013EP2587900A1 Joint structure manufacturing method, heating and melting treatment method, and system for same
05/01/2013EP2587596A2 Advanced microelectronic connector assembly and method of manufacturing
05/01/2013EP2587556A1 Sapphire substrate, method for producing same, and nitride semiconductor light emitting element
05/01/2013EP2587545A1 High-voltage vertical FET and method of manufacturing the same
05/01/2013EP2587531A1 Current control semiconductor device and control apparatus using same
05/01/2013EP2587530A2 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method
05/01/2013EP2587529A1 Suction apparatus, semiconductor device observation device, and semiconductor device observation method
05/01/2013EP2587528A1 Semiconductor device
05/01/2013EP2587527A1 Silicon wafer and its manufacturing method
05/01/2013EP2587526A1 Composition for polishing silicon carbide substrate and method for polishing silicon carbide substrate
05/01/2013EP2587525A1 Method for manufacturing semiconductor device
05/01/2013EP2587524A1 Vapor deposition apparatus
05/01/2013EP2587523A1 Semiconductor device including group iii- v compound semiconductor layer, and method of manufacturing the semiconductor device
05/01/2013EP2587517A1 Electron lens and the electron beam device
05/01/2013EP2587515A1 Inspection system by charged particle beam and method of manufacturing devices using the system
05/01/2013EP2587472A1 Semiconductor device and process for production thereof
05/01/2013EP2587471A1 Display device
05/01/2013EP2586805A1 Curable composition and method for producing cured film
05/01/2013EP2586062A1 Substrate with buffer layer for oriented nanowire growth
05/01/2013EP2586060A2 Three dimensional memory and methods of forming the same
05/01/2013EP2586056A1 Chip elements mounted on wires having an incipient breaking point
05/01/2013EP2586055A1 Method for transferring a single-crystal silicon thin film
05/01/2013EP2586054A1 Method for preparing a substrate by implantation and irradiation
05/01/2013EP2586053A2 Customizable dispense system with smart controller
05/01/2013EP2585842A1 Integrated circuit for and method of testing die -to -die bonding
05/01/2013EP2585628A1 Inclusion of chip elements in a sheathed wire
05/01/2013CN202917529U Automatic holder changing converter of a thin-film solar battery conductive glass
05/01/2013CN202917467U Packaging cutting structure and packaging structure
05/01/2013CN202917463U Disk clamping device
05/01/2013CN202917462U Die bonding thimble for die bonder
05/01/2013CN202917461U 晶圆转移装置 Wafer transfer device
05/01/2013CN202917460U Membrane separation device of wafer mucous membrane group separation device
05/01/2013CN202917459U Semiconductor full-automatic turret-type testing, sorting, marking and braiding all-in-one machine
05/01/2013CN202917458U Direction arranging machine demoulding device
05/01/2013CN202917457U Epitaxial defect analytical structure
05/01/2013CN202917456U 晶圆检查装置 Wafer inspection device
05/01/2013CN202917455U Probe collision preventing device
05/01/2013CN202917454U Quick quality inspection combination tooling for surface mount diodes
05/01/2013CN202917453U Clamp and device ensuring plastic-sealed body thickness of fully encapsulated product
05/01/2013CN202917452U Improved CCD attached device
05/01/2013CN202917451U Packaging die for triode
05/01/2013CN202917450U Electronic element packaging device
05/01/2013CN202917449U Intelligent card packaging system
05/01/2013CN202917448U Semiconductor structure
05/01/2013CN202909890U Glug dispensing jig for semiconductor packaging
05/01/2013CN1910971B Packaging and manufacturing of an integrated circuit
05/01/2013CN1652339B Nonvolatile semiconductor memory and manufacturing method for the same
05/01/2013CN103081235A Anisotropic conductive film, connection structure body, and processes for production of these materials
05/01/2013CN103081149A Organic semiconductor particulate material, organic semiconductor thin-film, dispersion liquid for forming organic semiconductor film, method for producing organic semiconductor thin-film, and organic thin-film transistor
05/01/2013CN103081133A A light emitting apparatus
05/01/2013CN103081108A Thin-film transistor substrate, method for producing same, and display device
05/01/2013CN103081107A Porous and non-porous nanostructures
05/01/2013CN103081103A Manufacturing fixture for a ramp-stack chip package
05/01/2013CN103081093A Pillar structure for memory device and method
05/01/2013CN103081092A 存储器件及半导体器件 Memory device and a semiconductor device
05/01/2013CN103081091A Transistor with threshold voltage set notch and method of fabrication thereof
05/01/2013CN103081090A Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods
05/01/2013CN103081089A Method for manufacturing semiconductor device
05/01/2013CN103081088A Electrostatic chuck and methods of use thereof
05/01/2013CN103081087A Sheet attaching device and attaching method
05/01/2013CN103081086A Substrate support with symmetrical feed structure
05/01/2013CN103081085A Support substrate
05/01/2013CN103081084A Substrate heating device