Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/09/2013US20130113072 3D Capacitor and Method of Manufacturing Same
05/09/2013US20130113071 Semiconductor device with fuse
05/09/2013US20130113070 Interposers for Semiconductor Devices and Methods of Manufacture Thereof
05/09/2013US20130113068 Low-k dielectric protection spacer for patterning through substrate vias through a low-k wiring layer
05/09/2013US20130113067 Thermal warp compensation ic package
05/09/2013US20130113065 Pad design for circuit under pad in semiconductor devices
05/09/2013US20130113055 Sensor device manufacturing method and sensor device
05/09/2013US20130113054 Semiconductor sensor device and method of packaging same
05/09/2013US20130113053 Semiconductor structure and process thereof
05/09/2013US20130113050 Blanket short channel roll-up implant with non-angled long channel compensating implant through patterned opening
05/09/2013US20130113048 High voltage semiconductor device and fabricating method thereof
05/09/2013US20130113047 Mosfet structure with t-shaped epitaxial silicon channel
05/09/2013US20130113043 Radiation hardened memory cell and design structures
05/09/2013US20130113042 Multi-gate semiconductor devices and methods of forming the same
05/09/2013US20130113041 Semiconductor transistor device with optimized dopant profile
05/09/2013US20130113037 Method for manufacturing semiconductor device and semiconductor device
05/09/2013US20130113033 Nonvolatile memory device and method for fabricating the same
05/09/2013US20130113032 Semiconductor memory device and method for manufacturing same
05/09/2013US20130113031 Kink poly structure for improving random single bit failure
05/09/2013US20130113027 Metal Oxide Semiconductor Transistor and Manufacturing Method Thereof
05/09/2013US20130113026 Fin field effect transistor gate oxide
05/09/2013US20130113022 Sige hbt and manufacturing method thereof
05/09/2013US20130113021 Sige hbt having deep pseudo buried layer and manufacturing method thereof
05/09/2013US20130113020 Sige hbt and method of manufacturing the same
05/09/2013US20130112996 Semiconductor device and method for manufacturing same
05/09/2013US20130112995 Semiconductor wafer and method for manufacturing the same
05/09/2013US20130112994 Semiconductor module and method for manufacturing semiconductor module
05/09/2013US20130112991 Silicon carbide schottky-barrier diode device and method for manufacturing the same
05/09/2013US20130112990 Gallium Nitride Devices with Compositionally-Graded Transition Layer
05/09/2013US20130112986 Gallium Nitride Semiconductor Devices and Method Making Thereof
05/09/2013US20130112985 Monolithically integrated vertical jfet and schottky diode
05/09/2013US20130112981 Semiconductor Device, and Method of Forming the Same
05/09/2013US20130112980 Light-emitting device and method of manufacturing the same
05/09/2013US20130112976 Thin-film transistor array substrate, organic light-emitting display including the same, and method of manufacturing the same
05/09/2013US20130112974 Method for determining the local stress induced in a semiconductor material wafer by through vias
05/09/2013US20130112973 Precursor composition and method for forming amorphous conductive oxide film
05/09/2013US20130112971 Composite oxide sintered body and sputtering target comprising same
05/09/2013US20130112969 Method of manufacturing p-type zno nanowires and method of manufacturing energy conversion device
05/09/2013US20130112940 Semiconductor structure having nanocrystalline core and nanocrystalline shell
05/09/2013US20130112939 New iii-nitride growth method on silicon substrate
05/09/2013US20130112937 Nanowire Field Effect Transistor Device
05/09/2013US20130112264 Methods for forming a doped amorphous silicon oxide layer for solar cell devices
05/09/2013US20130112260 Method for preparing an n+pp+ or p+nn+ structure on silicon wafers
05/09/2013US20130112140 Apparatus for growth of dilute-nitride materials using an isotope for enhancing the sensitivity of resonant nuclear reaction analysis
05/09/2013US20130111992 Proof mass positioning features having tangential contact surfaces
05/09/2013US20130111678 Brush box module for chemical mechanical polishing cleaner
05/08/2013EP2590213A1 Power module and power converter using same
05/08/2013EP2590210A2 Heat dissipating device and manufacture method thereof
05/08/2013EP2590209A1 Gripper
05/08/2013EP2590208A2 Large panel leadframe
05/08/2013EP2590207A1 Dicing film
05/08/2013EP2589083A1 Bipolar junction transistor guard ring structures and method of fabricating thereof
05/08/2013EP2589075A2 Methods for in-situ passivation of silicon-on-insulator wafers
05/08/2013EP2589074A1 Semiconductor on glass substrate with stiffening layer and process of making the same
05/08/2013EP2589073A1 Method and apparatus for calibrating a wafer transport robot
05/08/2013EP2589072A2 Interposer and method for producing holes in an interposer
05/08/2013EP2589071A2 Thin films and methods of making them using cyclohexasilane
05/08/2013EP2589070A2 Ultrahigh density vertical nand memory device and method of making thereof
05/08/2013EP2589069A2 Method for finishing silicon on insulator substrates
05/08/2013EP2589068A2 System and method of semiconductor manufacturing with energy recovery
05/08/2013EP2589067A1 Oxygen plasma conversion process for preparing a surface for bonding
05/08/2013EP2589066A1 Preparation of semiconductor films
05/08/2013EP2588650A1 Selective epitaxy of si-containing materials and substitutionally doped crystalline si-containing materials
05/08/2013EP2588643A1 Modification of silicon layers formed from silane-containing formulations
05/08/2013EP2588533A2 Thermoformed ic trays of poly(phenylene ether) compositions
05/08/2013DE19934758B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
05/08/2013DE112011102595T5 Erfassungsverfahren für die Lichtmenge und Vorrichtung dafür Detection method for the amount of light and apparatus therefor
05/08/2013DE112010004241T5 Halbleiterbauelement und Verfahren zur Herstellung des Halbleiterbauelements A semiconductor device and method of manufacturing the semiconductor device
05/08/2013DE102012220161A1 Bearbeitungsverfahren für einen Wafer mit einem abgeschrägten Abschnitt entlang des äusseren Umfangs davon Processing method for a wafer having a chamfered portion along the outer periphery thereof
05/08/2013DE102012219171A1 Dreidimensionale (3D) integrierte Schaltung mit verbessertem Kupfer-Kupfer-Bonding Three-dimensional (3D) integrated circuit with improved copper-copper bonding
05/08/2013DE102012213825A1 Verhinderung eines ILD-Verlustes in Austauschgatetechnologien durch Oberflächenbehandlung Prevention of ILD loss in exchange gate technologies by surface treatment
05/08/2013DE102012110616A1 Verfahren zum Trennen einer Mehrzahl von Chips und Bearbeitungsvorrichtung zum Trennen einer Mehrzahl von Chips A method for separating a plurality of chips and machining apparatus for separating a plurality of chips
05/08/2013DE102012110606A1 Verfahren zum Trennen einer Mehrzahl von Chips und Bearbeitungsvorrichtung zum Trennen einer Mehrzahl von Chips A method for separating a plurality of chips and machining apparatus for separating a plurality of chips
05/08/2013DE102012110603A1 Verfahren zum Trennen von Halbleiter-Dies mittels einer Materialmodifikation A method for separating semiconductor die using a material modification
05/08/2013DE102012110494A1 Vorrichtung umfassend zwei Leistungshalbleiterchips und Herstellungsverfahren dafür A device comprising two power semiconductor chips and manufacturing method thereof
05/08/2013DE102012109868A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
05/08/2013DE102012108092A1 Verfahren zum Herstellen einer Halbleitervorrichtung unter Verwendung der Stress-Memorization-Technologie A method of manufacturing a semiconductor device using the stress-Memorization technology
05/08/2013DE102011117869A1 Device for drawing vacuum partly consisting of semiconductor material for thermal treatment of silicon substrate, has plate elements having sub apertures that are communicated with vacuum chamber and arranged for suction of substrate
05/08/2013DE102011088584B4 Halbleiterbauelement und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation
05/08/2013DE102011085833A1 Additiv zur Stabilisierung von Siliziumpartikeln in wässrigen Medien Additive to stabilize silicon particles in aqueous media
05/08/2013DE102011085799A1 Protection device for protecting heated substrate treatment plant before overheating, has thermal relay causing shutdown of heater during overheating and including temperature sensor that is arranged in process chamber to be supervised
05/08/2013DE102011085714A1 Verfahren und Vorrichtung zur Erzeugung einer lasergestützten elektrisch leitfähigen Kontaktierung einer Objektoberfläche Method and device for producing a laser-based electrically conductive contacting of an object surface
05/08/2013DE102011076695B4 Transistoren mit eingebettetem verformungsinduzierenden Material, das in durch einen Oxidationsätzprozess erzeugten Aussparungen ausgebildet ist Transistors with embedded strain-inducing material that is formed in cavities created by a Oxidationsätzprozess
05/08/2013DE102011055061A1 CVD-Reaktor bzw. Substrathalter für einen CVD-Reaktor CVD reactor or substrate holder for a CVD reactor
05/08/2013DE102010042971B4 Transistorbauelement mit einer Feldelektrode Transistor device having a field electrode
05/08/2013DE102009037281B4 Verfahren zur Herstellung einer polierten Halbleiterscheibe A process for producing a polished wafer
05/08/2013DE102009030296B4 Verfahren zur Herstellung einer epitaxierten Siliciumscheibe A process for producing an epitaxially coated silicon wafer
05/08/2013DE102009011233B4 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
05/08/2013DE102005059224B4 SiC-Halbleitervorrichtung und Herstellungsverfahren dafür SiC semiconductor device and manufacturing method thereof
05/08/2013DE102004048688B4 Leistungs-Halbleitervorrichtung Power semiconductor device
05/08/2013DE10050601B4 Haltevorrichtung für elektronische Bauteile und Halteverfahren für solche Bauteile Holding device for holding electronic components and procedures for such devices
05/08/2013CN202930370U Wafer pickup assembly
05/08/2013CN202930369U Nozzle used for sucking up MEMS chip
05/08/2013CN202930368U Bearing structure for grain pickup and placement and grain pickup and placement device
05/08/2013CN202930367U Six-wheel eccentric-connecting-rod central positioning mechanism
05/08/2013CN202930366U Wafer box base
05/08/2013CN202930365U Aluminum wire steel nozzle used for bonding machine
05/08/2013CN202930364U Aluminum strip steel nozzle used for automatic bonding machine
05/08/2013CN202930363U Anti-oxidation and blow-dry device for bonding copper wire after annealing
05/08/2013CN202930362U Semiconductor device