Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/08/2013CN103094271A Static discharge protection circuit
05/08/2013CN103094262A Device Including Two Power Semiconductor Chips And Manufacturing Thereof
05/08/2013CN103094261A Electronic Assembly Apparatus And Associated Methods
05/08/2013CN103094260A Package On Package Devices And Methods Of Packaging Semiconductor Dies
05/08/2013CN103094258A Air cavity type encapsulation and manufacturing method thereof
05/08/2013CN103094257A 3D chip package with shielded structures
05/08/2013CN103094250A Trimming resistor and preparation method thereof
05/08/2013CN103094248A Metal fuse wire structure and manufacturing method thereof
05/08/2013CN103094247A Self-aligned epitaxial contact hole structure and preparation method
05/08/2013CN103094246A Post-passivation interconnect structure and method of forming the same
05/08/2013CN103094245A Integrated circuit device and method for establishing electrical conductor in integrated circuit device
05/08/2013CN103094244A Packaging substrate having embedded through-via interposer and method of fabricating the same
05/08/2013CN103094243A Packaging substrate structure and fabrication method thereof
05/08/2013CN103094242A Packaging substrate having embedded capacitors and fabrication method thereof
05/08/2013CN103094241A Re-wiring lead frame FCAAQFN package part and manufacture process thereof
05/08/2013CN103094240A High-density etched lead frame FCAAQFN package part and manufacture process thereof
05/08/2013CN103094239A Auxiliary paster pin added lead frame package part and manufacture process
05/08/2013CN103094236A Single-chip package part with wafer thinned after bottom fillers cures and manufacture process thereof
05/08/2013CN103094235A AAQFN package part using electroplating process and manufacture process thereof
05/08/2013CN103094234A Extension pin Fan-out Panel Level ball grid array (BGA) package part and manufacture process thereof
05/08/2013CN103094233A Semiconductor element and fabrication method thereof
05/08/2013CN103094231A Electronic device and method for fabricating electronic device
05/08/2013CN103094230A Contact and formation method
05/08/2013CN103094229A Buried layer extraction structure and manufacturing method thereof
05/08/2013CN103094227A Three-dimensional chip and combination structure and manufacture method of three-dimensional chip
05/08/2013CN103094223A Packaging Substrate And Fabrication Method Thereof
05/08/2013CN103094222A Semiconductor Package And Method For Manufacturing The Same And Semiconductor Package Module Having The Same
05/08/2013CN103094219A Integration method for three-dimensional high-density thick-film multi-chip assembly
05/08/2013CN103094218A System in package process flow
05/08/2013CN103094217A Transistor, manufacture method of transistor and semi-conductor device including transistor
05/08/2013CN103094216A Annealing technology of NOR flash memory device and NOR flash memory device
05/08/2013CN103094215A Data element of semiconductor device and method for fabricating the same
05/08/2013CN103094214A Manufacturing method for semiconductor device
05/08/2013CN103094213A Manufacturing method for metal gate electrode of complementary metal oxide semiconductor (CMOS) device
05/08/2013CN103094212A Complementary metal oxide semiconductor (CMOS) formation method
05/08/2013CN103094211A Manufacture method of semi-conductor device
05/08/2013CN103094210A Manufacture method of semi-conductor device
05/08/2013CN103094209A Manufacture method of semi-conductor device
05/08/2013CN103094208A Manufacturing method of transistor
05/08/2013CN103094207A Method of manufacturing semiconductor device using stress memorization technique
05/08/2013CN103094206A Method of separating semiconductor die by using material modification
05/08/2013CN103094205A Prepared method of thin film transistor and thin film transistor driving back panel and thin film transistor driving back panel
05/08/2013CN103094204A Method of fabricating array substrate for liquid crystal display device
05/08/2013CN103094203A Array substrate and method for manufacturing the same
05/08/2013CN103094202A Semiconductor part and tungsten filling method thereof
05/08/2013CN103094201A Memorizer device and manufacturing method thereof
05/08/2013CN103094200A Manufacturing method of semiconductor device
05/08/2013CN103094199A Manufacturing method of metal interconnection structure
05/08/2013CN103094198A Interconnection structure manufacturing method
05/08/2013CN103094197A Manufacturing method of interconnection structure
05/08/2013CN103094196A Interconnection structure and manufacturing method of the same
05/08/2013CN103094195A Method of forming metal return circuit
05/08/2013CN103094194A Forming method of metal inter-lamination dielectric layer and metal inter-lamination dielectric layer
05/08/2013CN103094193A Manufacturing method of copper interconnection structure
05/08/2013CN103094192A Forming method of semiconductor device
05/08/2013CN103094191A Method of reducing dielectric constant of inter-lamination dielectric layer
05/08/2013CN103094190A Forming method of air gap in interconnection layer
05/08/2013CN103094189A Forming method of silicon through hole
05/08/2013CN103094188A Method for manufacturing fuse wire window on core and fuse wire window
05/08/2013CN103094187A Forming method for silicon through hole
05/08/2013CN103094186A Semiconductor structure and forming method thereof
05/08/2013CN103094185A Forming method for contact hole
05/08/2013CN103094184A Manufacture method of copper interconnection structure
05/08/2013CN103094183A Manufacture method of semi-conductor device
05/08/2013CN103094182A Manufacturing method for semiconductor device
05/08/2013CN103094181A T-typed metal hard mask used for forming alignment through-hole automatically
05/08/2013CN103094180A Manufacturing method of semiconductor device
05/08/2013CN103094179A Connecting hole formation method
05/08/2013CN103094178A Preparation method for improving part of radio frequency performance of depletion type signal operation instruction (SOI) device
05/08/2013CN103094177A Silicon on insulator (SOI), metal oxide semiconductor (MOS) part based on SOI and manufacturing method thereof
05/08/2013CN103094176A Method and system for modifying doped region design layout during mask preparation to tune device performance
05/08/2013CN103094175A Three-clamp-head clamp special for wafer
05/08/2013CN103094174A Wafer clamp simple to operate
05/08/2013CN103094173A Multi-clamp-head wafer clamp
05/08/2013CN103094172A Semiconductor and high-temperature-resisting antiskid clamp in microelectronic industry
05/08/2013CN103094171A Magnetic levitation wafer rotary system
05/08/2013CN103094170A Method for separating a plurality of dies and a processing device for separating a plurality of dies
05/08/2013CN103094169A Method for separating a plurality of dies and a processing device for separating a plurality of dies
05/08/2013CN103094168A Pick-and-place Tool For Packaging Process
05/08/2013CN103094167A Device for picking up semiconductor parts
05/08/2013CN103094166A Wafer carrying device and semiconductor processing equipment comprising the same
05/08/2013CN103094165A Jacking component used for chip transferring equipment and corresponding chip transferring equipment
05/08/2013CN103094164A Substrate Treatment System And Substrate Transfer Method
05/08/2013CN103094163A Solar cell silicon wafer transmission system layout structure
05/08/2013CN103094162A Method for locating wafer circle center on mechanical arm
05/08/2013CN103094161A Tray for adapting to thermal gradient appears in processing period
05/08/2013CN103094160A Substrate Treatment System And Substrate Transfer Method
05/08/2013CN103094159A Substrate treating apparatus and substrate treating method
05/08/2013CN103094158A Substrate treating apparatus and chemical recycling method
05/08/2013CN103094157A Substrate treating apparatus and substrate treating method
05/08/2013CN103094156A Substrate processing equipment and cavity chamber device thereof and substrate heating method
05/08/2013CN103094155A Processing equipment of semiconductor device
05/08/2013CN103094154A Semiconductor packaging system
05/08/2013CN103094153A Wafer reception device and constant pressure chemical vapor deposition device
05/08/2013CN103094152A Semiconductor processing device and collection method for fluid to be processed
05/08/2013CN103094151A Chemical liquid recovery device
05/08/2013CN103094150A Washing device using wet method
05/08/2013CN103094149A Roasting device used for preventing chip from warping and roasting method thereof
05/08/2013CN103094148A Cleaning machine with twin-jet nozzle
05/08/2013CN103094147A Swirling eddy cooling hot plate
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