Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2013
05/01/2013CN101632167B A semiconductor device comprising NMOS and PMOS transistors with embedded SI/GE material for creating tensile and compressive strain
05/01/2013CN101600994B Photosensitive resin composition, cured film, protective film, insulating film and semiconductor device using the same, and display device
05/01/2013CN101587885B Semiconductor device, semiconductor device module, and method for manufacturing the semiconductor device module
05/01/2013CN101578155B System and method for multi-pulse laser processing
05/01/2013CN101541905B Thermally strippable double faced adhesive sheet and method of working work piece
05/01/2013CN101533781B Thin film transistor, manufacturing method thereof, display device, and manufacturing method thereof
05/01/2013CN101523559B Nonvolatile memories with shaped floating gates
05/01/2013CN101522360B 激光加工装置 The laser processing apparatus
05/01/2013CN101464418B Flaw detection method and apparatus
05/01/2013CN101443892B High-throughput formation of semiconductor layer by use of chalcogen and inter-metallic material
05/01/2013CN101431854B Plasma processing apparatus
05/01/2013CN101430509B Immersion lithography fluids
05/01/2013CN101419946B Method for manufacturing display device
05/01/2013CN101418438B High quality silicon oxide films by remote plasma cvd from disilane precursors
05/01/2013CN101404263B Position sensor system for substrate transfer robot
05/01/2013CN101359585B Apparatus for manufacturing thin-film laminated member
05/01/2013CN101320748B Organic light emitting display device and method of manufacturing the same
05/01/2013CN101254561B Soldering method and method of manufacturing semiconductor device including soldering method
05/01/2013CN101225282B Low-dielectric material lapping liquid
05/01/2013CN101154032B Photo mask blank material, photo mask and manufacture method, photo mask midbody, pattern copy method of the same
05/01/2013CN101033057B Microstructure, semiconductor device, and manufacturing method of the microstructure
04/2013
04/30/2013US8433436 Substrate processing system, substrate placing position adjusting method and storage medium
04/30/2013US8432663 High permittivity low leakage capacitor and energy storing device and method for forming the same
04/30/2013US8432505 Display device and manufacturing method thereof
04/30/2013US8432254 Semiconductor device
04/30/2013US8432180 Process monitor for monitoring an integrated circuit chip
04/30/2013US8432035 Metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices
04/30/2013US8432034 Use of a local constraint to enhance attachment of an IC device to a mounting platform
04/30/2013US8432028 Integrated circuit packaging system with package-on-package and method of manufacture thereof
04/30/2013US8432024 Integrated circuit including bond wire directly bonded to pad
04/30/2013US8432022 Shielded embedded electronic component substrate fabrication method and structure
04/30/2013US8432021 Manufacturing method of SOI substrate
04/30/2013US8432020 Capacitors, systems, and methods
04/30/2013US8432019 Techniques for capacitively coupling signals with an integrated circuit
04/30/2013US8432014 Methods of fabricating semiconductor devices and structures thereof
04/30/2013US8432001 Electric field information reading head, electric field information writing/reading head and fabrication methods thereof and information storage device using the same
04/30/2013US8432000 Trench MOS barrier schottky rectifier with a planar surface using CMP techniques
04/30/2013US8431999 Low capacitance transient voltage suppressor
04/30/2013US8431981 Semiconductor memory device having vertical transistor and buried bit line and method for fabricating the same
04/30/2013US8431980 Random access memory device utilizing a vertically oriented select transistor
04/30/2013US8431971 Pitch multiplied mask patterns for isolated features
04/30/2013US8431966 Method of manufacturing a bipolar transistor semiconductor device and semiconductor devices obtained thereby
04/30/2013US8431950 Light emitting device package structure and fabricating method thereof
04/30/2013US8431945 Light emitting device, light emitting device package, and lighting system
04/30/2013US8431939 Semiconductor light-emitting device
04/30/2013US8431923 Semiconductor structure and semiconductor device including a diode structure and methods of forming same
04/30/2013US8431495 Stencil mask profile
04/30/2013US8431494 Film formation method and film formation apparatus
04/30/2013US8431493 Replaceable substrate masking on carrier and method for processing a substrate
04/30/2013US8431492 Memory cell that includes a sidewall collar for pillar isolation and methods of forming the same
04/30/2013US8431491 Method for membrane protection during reactive ion/plasma etching processing for via or cavity formation in semiconductor manufacture
04/30/2013US8431489 Chemical mechanical polishing pad having a low defect window
04/30/2013US8431488 Damascene process using cleaning solution
04/30/2013US8431487 Method for forming a plug structure
04/30/2013US8431486 Interconnect structure for improved time dependent dielectric breakdown
04/30/2013US8431485 Manufacturing method for a buried circuit structure
04/30/2013US8431484 Stable electroless fine pitch interconnect plating
04/30/2013US8431483 Methods of forming electrically conductive plugs and method of forming resistance variable elements
04/30/2013US8431482 Integrated circuits and methods for processing integrated circuits with embedded features
04/30/2013US8431481 IC device having low resistance TSV comprising ground connection
04/30/2013US8431480 Semiconductor device and manufacturing method thereof
04/30/2013US8431479 Semiconductor devices having redistribution structures and packages, and methods of forming the same
04/30/2013US8431478 Solder cap bump in semiconductor package and method of manufacturing the same
04/30/2013US8431477 Method for joining aligned discrete optical elements
04/30/2013US8431476 Method to prevent surface decomposition of III-V compound semiconductors
04/30/2013US8431474 Three dimensional multilayer circuit
04/30/2013US8431472 Semiconductor device fabrication using gate substitution
04/30/2013US8431471 Method for integrating a non-volatile memory (NVM)
04/30/2013US8431470 Approach to integrate Schottky in MOSFET
04/30/2013US8431469 Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
04/30/2013US8431468 Noise reduction in semiconductor devices
04/30/2013US8431467 Laser working method
04/30/2013US8431466 Method of forming finned semiconductor devices with trench isolation
04/30/2013US8431465 Semiconductor device and method for fabricating the same
04/30/2013US8431464 Process for producing silicic coating, silicic coating and semiconductor device
04/30/2013US8431463 Capacitor contact formed concurrently with bond pad metallization
04/30/2013US8431462 Methods of manufacturing semiconductor devices
04/30/2013US8431461 Silicon nitride dry trim without top pulldown
04/30/2013US8431460 Method for fabricating semiconductor device
04/30/2013US8431459 Semiconductor wafer, semiconductor device, and method of manufacturing a semiconductor device
04/30/2013US8431458 Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells
04/30/2013US8431457 Method for fabricating a shielded gate trench MOS with improved source pickup layout
04/30/2013US8431456 Methods of forming high density structures and low density structures with a single photomask
04/30/2013US8431455 Method of improving memory cell device by ion implantation
04/30/2013US8431454 Fabricating process of circuit substrate and circuit substrate structure
04/30/2013US8431453 Plasma doping to reduce dielectric loss during removal of dummy layers in a gate structure
04/30/2013US8431452 TFT-LCD array substrate and manufacturing method thereof
04/30/2013US8431451 Display device and method for manufacturing the same
04/30/2013US8431450 Methods and apparatus for LDMOS transistors
04/30/2013US8431449 Manufacturing method of semiconductor device
04/30/2013US8431448 Organic transistor element, and method of manufacturing the same by concurrently doping an organic semiconductor layer and wet etching an electrode provided on the organic semiconductor layer
04/30/2013US8431447 Method of manufacturing a semiconductor device with a front-end insulating layer interposed between a semiconductor layer and an insulating substrate
04/30/2013US8431446 Via formation for cross-point memory
04/30/2013US8431445 Multi-component power structures and methods for forming the same
04/30/2013US8431444 Epoxy encapsulating and lamination adhesive and method of making same
04/30/2013US8431443 Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
04/30/2013US8431442 Methods of manufacturing semiconductor chips
04/30/2013US8431441 Semiconductor package and method of manufacturing same
04/30/2013US8431440 Chip manufacturing method
04/30/2013US8431439 Thin film laminated body manufacturing apparatus and method