| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/01/2013 | CN103081083A Pickup method and pickup device |
| 05/01/2013 | CN103081082A Non-contact determination of joint integrity between a TSV die and a package substrate |
| 05/01/2013 | CN103081081A Bonding sheet and method for mounting semiconductor chip |
| 05/01/2013 | CN103081080A Epitaxial substrate for semiconductor element, semiconductor element, method for fabricating epitaxial substrate for semiconductor element, and method for fabricating semiconductor element |
| 05/01/2013 | CN103081079A Semiconductor device and process for production thereof |
| 05/01/2013 | CN103081078A Thin-film transistor, method of manufacturing thereof, and display apparatus |
| 05/01/2013 | CN103081077A Method of manufacturing semiconductor device and semiconductor device |
| 05/01/2013 | CN103081076A Semiconductor device production method and rinse |
| 05/01/2013 | CN103081075A Silicon etchant and method for producing transistor by using same |
| 05/01/2013 | CN103081074A Etching method, substrate processing method, pattern forming method, method for manufacturing semiconductor element, and semiconductor element |
| 05/01/2013 | CN103081073A Plasma processing device |
| 05/01/2013 | CN103081072A Method for preventing the collapse of high aspect ratio structures during drying |
| 05/01/2013 | CN103081071A Substrate processing method and substrate processing device |
| 05/01/2013 | CN103081070A Adhesive sheet for dicing, and semiconductor device manufacturing method using adhesive sheet for dicing |
| 05/01/2013 | CN103081069A Film for semiconductor device and semiconductor device |
| 05/01/2013 | CN103081068A Film for semiconductor device and semiconductor device |
| 05/01/2013 | CN103081067A Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes |
| 05/01/2013 | CN103081066A Semiconductor constructions, and method for providing electricity conductive material within openings |
| 05/01/2013 | CN103081065A Laser annealing device and laser annealing method |
| 05/01/2013 | CN103081064A Production method for a semiconductor element |
| 05/01/2013 | CN103081063A Method for manufacturing a semiconductor device |
| 05/01/2013 | CN103081062A Method for manufacturing compound semiconductor |
| 05/01/2013 | CN103081061A Deposition apparatus and methods to reduce deposition asymmetry |
| 05/01/2013 | CN103081060A Exposure apparatus using microlens array therein, and optical member |
| 05/01/2013 | CN103081059A Device manufacturing apparatus and method therefor |
| 05/01/2013 | CN103080863A Semiconductor element for current control, and control device using same |
| 05/01/2013 | CN103080845A Photoresist residue and polymer residue removing liquid composition |
| 05/01/2013 | CN103080731A Photoluminescence measurement tool and associated method |
| 05/01/2013 | CN103080730A Method and device for measuring carrier lifetime |
| 05/01/2013 | CN103080392A Inclusion of chip elements in a sheathed wire |
| 05/01/2013 | CN103080273A Aqueous acidic solution and etching solution and method for texturizing surface of single crystal and polycrystal silicon substrates |
| 05/01/2013 | CN103080260A Double-sided multi-layer adhesive |
| 05/01/2013 | CN103080160A Resin composition, and semiconductor device produced using resin composition |
| 05/01/2013 | CN103080068A Leaving substituent-containing compound, organic semiconductor material formed therefrom, organic electronic device, organic thin-film transistor and display device using the organic semiconductor material, method for producing film-like product, pi-electron conjugated compound and method for producing the pi-electron conjugated compound |
| 05/01/2013 | CN103079992A Method for the purification of fluorine |
| 05/01/2013 | CN103079788A Resin mold, production method thereof, and use thereof |
| 05/01/2013 | CN103079762A Wire saw |
| 05/01/2013 | CN103079359A Rapid element adhering method |
| 05/01/2013 | CN103078028A Substrate and manufacturing method and application method thereof |
| 05/01/2013 | CN103078015A Light emitting diode grinding and wax pastingcharging method |
| 05/01/2013 | CN103078011A Method for treating polycrystalline silicon 156 unfilled corner chips |
| 05/01/2013 | CN103077973A Thin film transistor |
| 05/01/2013 | CN103077970A Super junction device and manufacturing method thereof |
| 05/01/2013 | CN103077969A MOS (metal oxide semiconductor) device and manufacturing method thereof |
| 05/01/2013 | CN103077964A Material structure for improving ohmic contact of p-GaN film and preparation method thereof |
| 05/01/2013 | CN103077963A Ohmic contact electrode, preparation method of ohmic contact electrode and semiconductor element comprising ohmic contact electrode |
| 05/01/2013 | CN103077961A Amorphous oxide semiconductor and thin film transistor using the same |
| 05/01/2013 | CN103077960A Groove-power device structure and manufacturing method thereof |
| 05/01/2013 | CN103077959A Strained silicon channel semiconductor structure and manufacture method thereof |
| 05/01/2013 | CN103077958A Semiconductor power device with air gap structure and manufacturing method for semiconductor power device |
| 05/01/2013 | CN103077957A Active matrix type organic light emitting diode display device and manufacturing method thereof |
| 05/01/2013 | CN103077950A Silicon radio frequency device on insulator and manufacturing method thereof |
| 05/01/2013 | CN103077949A SOI (Silicon on Insulator) RF (Radio Frequency) device and manufacture method thereof |
| 05/01/2013 | CN103077948A 记忆体结构及其制造方法 Memory structure and its manufacturing method |
| 05/01/2013 | CN103077947A Complementary metal oxide semiconductor (CMOS) device with double metal gates and manufacturing method thereof |
| 05/01/2013 | CN103077944A Display device, array substrate and manufacture method of array substrate |
| 05/01/2013 | CN103077943A Array substrate and manufacturing method thereof and display device |
| 05/01/2013 | CN103077941A Vertical mosfet electrostatic discharge device |
| 05/01/2013 | CN103077937A Method for processing single-circuit ESD (Electro-Static Discharge) protection device |
| 05/01/2013 | CN103077936A Wiring substrate and manufacturing method of the same |
| 05/01/2013 | CN103077935A Pre-plated lead frame for copper wire bonding |
| 05/01/2013 | CN103077934A Joined structural body of members, joining method of members, and package |
| 05/01/2013 | CN103077933A Three-dimensional chip-to-wafer integration |
| 05/01/2013 | CN103077932A High-depth-to-width-ratio via interconnecting structure and production method |
| 05/01/2013 | CN103077931A Package structure and preparing method thereof |
| 05/01/2013 | CN103077927A Annealing process of not or (NOR) flash memory device and NOR flash memory device |
| 05/01/2013 | CN103077926A Formation method for semiconductor device |
| 05/01/2013 | CN103077925A Manufacturing method for memory |
| 05/01/2013 | CN103077924A Upside-down immersion type wafer-evening method |
| 05/01/2013 | CN103077923A Copper electroplating method capable of avoiding holes |
| 05/01/2013 | CN103077922A Method for manufacturing silicon-intermediary layer |
| 05/01/2013 | CN103077921A Interconnection line structure and forming method thereof |
| 05/01/2013 | CN103077920A Dry etching method of improving horizontal opening of through silicon hole |
| 05/01/2013 | CN103077919A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 05/01/2013 | CN103077918A Ejector pin device of die grading equipment |
| 05/01/2013 | CN103077917A Substrate supporting seat and semiconductor processing equipment applying same |
| 05/01/2013 | CN103077916A Method for automatically positioning position of wafer by image detection |
| 05/01/2013 | CN103077915A Adjustable double swing arm system three-core alignment method of chip grading equipment |
| 05/01/2013 | CN103077914A Fully automatic crystal grain sorting equipment and fully automatic crystal grain sorting method |
| 05/01/2013 | CN103077913A Lead-out device for aging bare chips and aging method |
| 05/01/2013 | CN103077912A Graphite die for sintering multichip |
| 05/01/2013 | CN103077911A 涂敷装置 The coating apparatus |
| 05/01/2013 | CN103077910A Dynamic isolation module for semiconductor integration and manufacture production line |
| 05/01/2013 | CN103077909A Conveying device and conveying method of furnace tube equipment |
| 05/01/2013 | CN103077908A Wafer cleaning device and process thereof |
| 05/01/2013 | CN103077907A Substrate processing apparatus and substrate processing method |
| 05/01/2013 | CN103077906A Eutectic bonding detection method for silicon wafers |
| 05/01/2013 | CN103077905A Lead arcuation method and lead arcuation device |
| 05/01/2013 | CN103077904A Bonding machine device and bonding alignment method |
| 05/01/2013 | CN103077903A Automatic wire tail adjustment system for wire bonders |
| 05/01/2013 | CN103077902A Ablation processing method of die attach film |
| 05/01/2013 | CN103077901A Packaging method of semiconductor packaging member and semiconductor packaging member formed by applying packaging method |
| 05/01/2013 | CN103077900A FPC (Flexible Printed Circuit Board) packaging mold |
| 05/01/2013 | CN103077899A Complex method for chip support plate and chip support plate prepared thereby |
| 05/01/2013 | CN103077898A Mould for synchronously covering upper and lower cavities of dual-chamber CQFP (Ceramic Quad Flat Package) ceramic shell |
| 05/01/2013 | CN103077897A Method of forming bump structures that include a protection layer |
| 05/01/2013 | CN103077896A Solder ball printing apparatus |
| 05/01/2013 | CN103077895A Laterally diffused metal oxide semiconductor (LDMOS) transistor and formation method thereof |
| 05/01/2013 | CN103077894A Semiconductor manufacturing process |
| 05/01/2013 | CN103077893A Preparation method based on Ni membrane annealing for SiC substrate side grid graphene transistor |