Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1997
02/04/1997US5600177 Semiconductor device having an electrically conductive layer including a polycrystalline layer containing an impurity and a metallic silicide layer
02/04/1997US5600176 Integrated voltage divider
02/04/1997US5600171 Mask ROM device
02/04/1997US5600170 Interconnection structure of semiconductor device
02/04/1997US5600169 Minimum charge FET fabricated on an ultrathin silicon on sapphire wafer
02/04/1997US5600168 Semiconductor element and method for fabricating the same
02/04/1997US5600167 Semiconductor device having low contact resistance
02/04/1997US5600166 EPROM cell with a readily scalable interpoly dielectric
02/04/1997US5600165 Semiconductor device with antireflection film
02/04/1997US5600164 Non-volatile semiconductor memory device
02/04/1997US5600163 Semiconductor element and semiconductor memory device using the same
02/04/1997US5600162 DRAM-type memory cell arrangement on a substrate
02/04/1997US5600161 Sub-micron diffusion area isolation with Si-SEG for a DRAM array
02/04/1997US5600158 Semiconductor light emitting device with current spreading layer
02/04/1997US5600154 Thin film transistor with particular nitrogen concentration
02/04/1997US5600153 Conductive polysilicon lines and thin film transistors
02/04/1997US5600151 Ultraviolet radiation transparent
02/04/1997US5600150 Method for obtaining three-dimensional data from semiconductor devices in a row/column array and control of manufacturing of same with data to eliminate manufacturing errors
02/04/1997US5599748 Method of passivating group III-V surfaces
02/04/1997US5599746 Method to eliminate polycide peeling at wafer edge using extended scribe lines
02/04/1997US5599745 Method to provide a void between adjacent conducting lines in a semiconductor device
02/04/1997US5599744 Method of forming a microcircuit via interconnect
02/04/1997US5599743 Method of manufacturing a semiconductor device
02/04/1997US5599742 Interconnection forming method
02/04/1997US5599741 Method for making semiconductor device with metal deposited on electron donating surface of gate electrode
02/04/1997US5599740 Deposit-etch-deposit ozone/teos insulator layer method
02/04/1997US5599739 Barrier layer treatments for tungsten plug
02/04/1997US5599738 Methods of fabrication of submicron features in semiconductor devices
02/04/1997US5599737 Forming a blanket of conductive material over dielectric substrate, performing blanket etchback procedure to reduce thickness, and patterning
02/04/1997US5599736 Fabrication method for polysilicon contact plugs
02/04/1997US5599735 Exposure of semiconductor surface to dopant gas mixture containing a halide of a dopant, and a silicon halide etch suppressant
02/04/1997US5599734 Method for fabricating MOS transistor utilizing doped disposable layer
02/04/1997US5599733 Method using cadmium-rich CdTe for lowering the metal vacancy concentrations of HgCdTe surfaces
02/04/1997US5599731 Selectively doping exposed polysilicon film with nitrogen to form oxidation resistant areas at pattern edges prior to thermal oxidation
02/04/1997US5599730 Poly-buffered LOCOS
02/04/1997US5599729 Static random access memory cell and method of fabricating the same
02/04/1997US5599728 Method of fabricating a self-aligned high speed MOSFET device
02/04/1997US5599727 Method for producing a floating gate memory device including implanting ions through an oxidized portion of the silicon film from which the floating gate is formed
02/04/1997US5599726 Method of making a conductive spacer lightly doped drain (LDD) for hot carrier effect (HCE) control
02/04/1997US5599725 Method for fabricating a MOS transistor with two-layer inverse-T tungsten gate structure
02/04/1997US5599724 FET having part of active region formed in semiconductor layer in through hole formed in gate electrode and method for manufacturing the same
02/04/1997US5599723 Method for manufacturing bipolar transistor having reduced base-collector parasitic capacitance
02/04/1997US5599722 SOI semiconductor device and method of producing same wherein warpage is reduced in the semiconductor device
02/04/1997US5599655 Crosslinking by radiation a coated copolymer of 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane, 3,3',4,4'-tetracarboxy-benzophenone and 2,3,4,5-p-phenylenediamine;
02/04/1997US5599654 Process for forming patterned layer of fluorinated resin and devices containing same
02/04/1997US5599582 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
02/04/1997US5599465 Masking portion of magnesium oxide substrate, then immersion in aqueous solution of phosphoric and sulfuric acids (having controlled ratios) yields step at boundary between masked and unmasked regions
02/04/1997US5599464 Formation of atomic scale vertical features for topographic instrument calibration
02/04/1997US5599438 Controlling electricity
02/04/1997US5599425 Vapor cleaning, (rapid) thermal oxidation, polishing
02/04/1997US5599424 Method of manufacturing semiconductor devices
02/04/1997US5599414 Method of manufacturing multilayered ceramic structures
02/04/1997US5599413 Method of producing a ceramic electronic device
02/04/1997US5599397 Semiconductor wafer process chamber with suspector back coating
02/04/1997US5599394 Apparatus for delivering a silica film forming solution
02/04/1997US5599390 Apparatus for crystal pulling
02/04/1997US5599389 Epitaxial growth of semiinsulating single crystal layer on doped semiconductor substrate, forming isolated active elements in undoped layer
02/04/1997US5599159 Pellet conveying device
02/04/1997US5598775 Centering lid seal clip apparatus
02/04/1997CA2111367C Semiconductor integrated circuit device
02/04/1997CA2077359C X-ray mask and semiconductor device manufacturing method using the same
01/1997
01/30/1997WO1997003495A1 Electrostatic chuck assembly
01/30/1997WO1997003482A1 Separable electrical connector assembly having a planar array of conductive protrusions
01/30/1997WO1997003470A1 Process for self-aligned source for high density memory
01/30/1997WO1997003469A1 Electrically erasable programmable rom memory cell array and a method of producing the same
01/30/1997WO1997003468A1 Dielectric capacitor and process for preparing the same
01/30/1997WO1997003465A1 Semiconductor pellet, method of its packaging, and bump electrode
01/30/1997WO1997003464A1 Integrated circuit contacts with secured stringers
01/30/1997WO1997003463A1 Integrated circuit arrangement with at least two components insulated from one another and a process for producing the said circuit arrangement
01/30/1997WO1997003462A1 Process for manufacturing an integrated cmos circuit
01/30/1997WO1997003461A1 Semiconductor wafer processing adhesives and tapes
01/30/1997WO1997003460A1 Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip
01/30/1997WO1997003459A1 On-chip vacuum package technology for micromechanical devices
01/30/1997WO1997003458A1 Method of manufacturing semiconductor device
01/30/1997WO1997003457A1 Support for wafer-shaped objects, in particular silicon wafers
01/30/1997WO1997003456A1 Support for wafer-shaped objects, in particular silicon wafers
01/30/1997WO1997003236A2 System and method for thermal processing of a semiconductor substrate
01/30/1997WO1997003225A1 Programmable ultraclean electromagnetic substrate rotation apparatus and method for microelectronics manufacturing equipment
01/30/1997WO1997003224A1 A plasma enhanced chemical processing reactor and method
01/30/1997WO1997003222A1 Cassette support and rotation assembly
01/30/1997WO1997003197A1 Novel secretion factors for gram-positive microorganisms, genes encoding them and methods of using it
01/30/1997WO1997003175A1 Redox reagent-containing post-etch residue cleaning composition
01/30/1997WO1997003131A1 Composition for forming ceramic substances and process for producing ceramic substances
01/30/1997WO1997003005A1 Method and apparatus for vertical transfer of a semiconductor wafer cassette
01/30/1997WO1997003004A1 Straight line wafer transfer system
01/30/1997WO1997003003A1 Wafer transfer system having rotational capability
01/30/1997WO1997003001A1 Sealable, transportable container having a breather assembly
01/30/1997WO1997002958A1 Organic amine/hydrogen fluoride etchant composition and method
01/30/1997WO1997002917A1 Highly efficient processing method based on high density radical reaction and using rotary electrode, apparatus therefor and rotating electrode used therefor
01/30/1997WO1997002905A1 Method and apparatus for washing silicon ingot with water to remove particulate matter
01/30/1997WO1997002733A2 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
01/30/1997WO1996036176A3 Image display apparatus with line number conversion
01/30/1997WO1996036071A3 Method of manufacturing a semiconductor device suitable for surface mounting
01/30/1997DE19628702A1 Flußmittelfreie Kontaktierung von Bauelementen Flux-contacting devices
01/30/1997DE19540010A1 Anlage und Verfahren zur Halbleiterbauelementherstellung System and method for semiconductor device fabrication
01/30/1997DE19527146A1 Verfahren zur Herstellung eines selbstjustierten Kontaktes und eines dotierten Bereichs A method for producing a self-aligned contact and a doped region
01/30/1997CA2224774A1 Semiconductor wafer processing adhesives and tapes
01/29/1997EP0756332A2 MOS capacitor of a semiconductor device
01/29/1997EP0756330A2 Power semiconductor device with insulated trench gate and manufacturing method thereof
01/29/1997EP0756329A1 Vertical PNP transistor and relative fabrication method