| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/07/1997 | US5591990 Active matrix assembly |
| 01/07/1997 | US5591989 Semiconductor device having first and second gate insulating films |
| 01/07/1997 | US5591988 Solid state imaging device with low trap density |
| 01/07/1997 | US5591987 Semiconductor MIS field effect transistor with semi-amorphous semiconductor material |
| 01/07/1997 | US5591985 Surface state inspecting system including a scanning optical system for scanning a surface to be inspected with a first light and for simultaneously scanning a diffraction grating with a second light |
| 01/07/1997 | US5591970 Charged beam apparatus |
| 01/07/1997 | US5591941 Solder ball interconnected assembly |
| 01/07/1997 | US5591920 Diagnostic wire bond pull tester |
| 01/07/1997 | US5591681 Method for achieving a highly reliable oxide film |
| 01/07/1997 | US5591679 Sealed cavity arrangement method |
| 01/07/1997 | US5591678 Process of manufacturing a microelectric device using a removable support substrate and etch-stop |
| 01/07/1997 | US5591677 Planarizeed multi-level interconnect scheme with embedded low-dielectric constant insulators |
| 01/07/1997 | US5591676 Applying fluoropolymer layers |
| 01/07/1997 | US5591675 Interconnecting method for semiconductor device |
| 01/07/1997 | US5591674 Integrated circuit with silicon contact to silicide |
| 01/07/1997 | US5591673 Tungsten stud process for stacked via applications |
| 01/07/1997 | US5591672 Annealing of titanium - titanium nitride in contact hole |
| 01/07/1997 | US5591671 Low resistance contact |
| 01/07/1997 | US5591670 Method of manufacturing a semiconductor device having self aligned contact hole |
| 01/07/1997 | US5591668 Laser annealing method for a semiconductor thin film |
| 01/07/1997 | US5591667 Method for fabricating MOS transistor utilizing doped disposable layer |
| 01/07/1997 | US5591666 Growing indium arsenide layer; crystallization |
| 01/07/1997 | US5591665 Process for producing a semiconductor structure including a plurality of vertical semiconductor devices and at least one lateral semiconductor device integrated in a semiconductor body |
| 01/07/1997 | US5591664 Method of increasing the capacitance area in DRAM stacked capacitors using a simplified process |
| 01/07/1997 | US5591663 Method of manufacturing ferroelectric capacitor with a hydrogen heat treatment |
| 01/07/1997 | US5591662 Method of manufacturing a power integrated circuit (PIC) structure |
| 01/07/1997 | US5591659 Process of producing a semiconductor device in which a height difference between a memory cell area and a peripheral area is eliminated |
| 01/07/1997 | US5591658 Method of fabricating integrated circuit chip containing EEPROM and capacitor |
| 01/07/1997 | US5591657 Semiconductor apparatus manufacturing method employing gate side wall self-aligning for masking |
| 01/07/1997 | US5591655 Process for manufacturing a vertical switched-emitter structure with improved lateral isolation |
| 01/07/1997 | US5591654 Quinonediazide-pyrogallol-acetone polymer |
| 01/07/1997 | US5591653 Crystallized silicon-germanium channel region |
| 01/07/1997 | US5591652 Method of manufacturing flash memory with inclined channel region |
| 01/07/1997 | US5591651 Method of making a bipolar stripe transistor structure |
| 01/07/1997 | US5591650 Method of making a body contacted SOI MOSFET |
| 01/07/1997 | US5591566 Method of forming a resist pattern by using a silicon carbide anti-reflective layer |
| 01/07/1997 | US5591550 Phase shift mask and method for forming phase shift mask |
| 01/07/1997 | US5591494 Nitriding from a silane, nitrogen-containing organosilane, and nitrogen containing gas |
| 01/07/1997 | US5591493 Structure and method for incorporating an inductively coupled plasma source in a plasma processing chamber |
| 01/07/1997 | US5591492 Process for forming and etching a film to effect specific crystal growth from activated species |
| 01/07/1997 | US5591486 Method for forming a film on a substrate by activating a reactive gas |
| 01/07/1997 | US5591480 Method for fabricating metallization patterns on an electronic substrate |
| 01/07/1997 | US5591302 Forming cupric nitrate to be sublimed; semiconductors |
| 01/07/1997 | US5591301 Resonating a radiofrequency currents in coils of silicon with chlorine precursor in vacuum |
| 01/07/1997 | US5591300 Single crystal silicon dry-etch endpoint based on dopant-dependent and thermally-assisted etch rates |
| 01/07/1997 | US5591299 Manufacture of integrated circuits |
| 01/07/1997 | US5591285 Fluorinated carbon polymer composites |
| 01/07/1997 | US5591262 Rotary chemical treater having stationary cleaning fluid nozzle |
| 01/07/1997 | US5591260 Method for crystal growth |
| 01/07/1997 | US5591037 Method for interconnecting an electronic device using a removable solder carrying medium |
| 01/07/1997 | US5591026 Baking oven having a minimized access opening |
| 01/07/1997 | US5590996 Wafer transfer apparatus |
| 01/07/1997 | US5590994 Chamber, at least for the transport of workpieces, a chamber combination, a vacuum treatment facility as well as a transport method |
| 01/07/1997 | US5590787 UV light sensitive die-pac for securing semiconductor dies during transport |
| 01/07/1997 | US5590712 Heat dissipating element |
| 01/07/1997 | US5590695 Manifold systems for high purity chemical delivery systems |
| 01/07/1997 | US5590672 Semiconductor cleaning apparatus and wafer cassette |
| 01/07/1997 | US5590461 Method of making multi-layer wiring board |
| 01/07/1997 | US5590456 Apparatus for precise alignment and placement of optoelectric components |
| 01/07/1997 | US5590445 Tape extension device for semiconductor producing apparatus and semiconductor producing apparatus with tape extension device |
| 01/07/1997 | CA2109275C Projection electron lithographic procedure |
| 01/07/1997 | CA2050247C Process gas distribution system and method |
| 01/03/1997 | WO1997000599A1 Ground plane routing |
| 01/03/1997 | WO1997000537A1 Flexible leads for tape ball grid array circuit |
| 01/03/1997 | WO1997000536A1 Semiconductor device fabrication |
| 01/03/1997 | WO1997000535A1 Electron-beam processed films for microelectronics structures |
| 01/03/1997 | WO1996036070A3 Method for curing spin-on-glass film utilizing electron beam radiation |
| 01/03/1997 | WO1996030935A3 Method of manufacturing an electronic multilayer component |
| 01/03/1997 | CA2221756A1 Ground plane routing |
| 01/03/1997 | CA2221750A1 Flexible leads for tape ball grid array circuit |
| 01/03/1997 | CA2220643A1 Semiconductor device fabrication |
| 01/02/1997 | EP0751574A2 Compression-type power semiconductor device |
| 01/02/1997 | EP0751573A1 Integrated power circuit and corresponding manufacturing process |
| 01/02/1997 | EP0751572A2 High voltage integrated circuit and level shift unit |
| 01/02/1997 | EP0751568A2 Light-emitting device assembly and method of fabricating same |
| 01/02/1997 | EP0751567A2 Copper alloys for chip and package interconnections and method of making |
| 01/02/1997 | EP0751566A2 A thin film metal barrier for electrical interconnections |
| 01/02/1997 | EP0751565A2 Film carrier for semiconductor device |
| 01/02/1997 | EP0751561A1 Semiconductor package manufacturing method and semiconductor package |
| 01/02/1997 | EP0751560A1 Process for forming an integrated circuit comprising non-volatile memory cells and side transistors of at least two different types, and corresponding IC |
| 01/02/1997 | EP0751559A1 Process for forming an integrated circuit comprising non-volatile memory cells and side transistors and corresponding IC |
| 01/02/1997 | EP0751558A1 A method of manufacturing integrated circuits |
| 01/02/1997 | EP0751557A2 Wiring circuit board for mounting of semiconductor chip and method for the preparation thereof |
| 01/02/1997 | EP0751556A1 Fabrication process for an interconnection substrate allowing to connect a die to a carrier substrate |
| 01/02/1997 | EP0751555A2 Method for making semiconductor devices having electroplated leads |
| 01/02/1997 | EP0751554A2 Method of in-situ cleaning of deposits from sputter clean chambers |
| 01/02/1997 | EP0751553A2 No coat backside wafer grinding process |
| 01/02/1997 | EP0751552A1 Sample processing apparatus |
| 01/02/1997 | EP0751551A2 Thin-plate supporting container |
| 01/02/1997 | EP0751417A1 Display device and production method thereof |
| 01/02/1997 | EP0751397A2 Test mode setting circuit of test circuit for semiconductor memory |
| 01/02/1997 | EP0751389A1 Semiconductor sensor device and method for forming a semiconductor sensor device |
| 01/02/1997 | EP0750968A1 Improvements in or relating to the processing of semiconductor devices |
| 01/02/1997 | EP0750967A2 Method for preshaping a semiconductor substrate for polishing and structure |
| 01/02/1997 | EP0750794A1 Co-implantation of arsenic and phosphorus in extended drain region for improved performance of high voltage nmos device |
| 01/02/1997 | EP0750791A1 Electric connections arranged in a high-density grid |
| 01/02/1997 | EP0750790A1 Method and apparatus for capping metallization layer |
| 01/02/1997 | EP0750789A1 Semiconductor device in silicon carbide |
| 01/02/1997 | EP0750597A1 Method of producing ceramic composite bodies |
| 01/02/1997 | EP0750530A1 Low-temperature oxidation at surfaces using ozone decomposition products formed by microwave discharge |