Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/1997
02/26/1997EP0758941A1 Semiconductor wafer polishing apparatus and method
02/26/1997EP0677183B1 Process for producing a developer having a low metal ion level
02/26/1997CN1144016A Semiconductor package manufacturing method and semiconductor package
02/26/1997CN1143833A Semiconductor device
02/26/1997CN1143832A Method for measuring leakage current in junction region of semiconductor device
02/26/1997CN1143831A Method for fabricating metal oxide silicon field effect transistors
02/26/1997CN1143830A Method of making MOS transistor having LDD structure
02/26/1997CN1143815A Flash EEPROM cell and manufacturing methods thereof
02/26/1997CN1143814A Nonvolatile memory and emthod of programming the same
02/26/1997CN1143747A Method and system for assessing operating condition of pressure regulator in corrosive gas distribution system
02/26/1997CN1143690A Spattering filming device
02/25/1997US5606524 Non-volatile semiconductor memory device capable of effecting high-speed operation with low voltage
02/25/1997US5606521 Electrically erasable and programmable read only memory with non-uniform dielectric thickness
02/25/1997US5606485 Electrostatic chuck having improved erosion resistance
02/25/1997US5606484 Ceramic electrostatic chuck with built-in heater
02/25/1997US5606278 Circuit for limiting the output voltage of a power transistor
02/25/1997US5606251 Method and apparatus for detecting a substrate in a substrate processing system
02/25/1997US5606204 Resin-sealed semiconductor device
02/25/1997US5606203 Semiconductor device having Al-Cu wiring lines where Cu concentration is related to line width
02/25/1997US5606202 Planarized gate conductor on substrates with above-surface isolation
02/25/1997US5606199 Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame
02/25/1997US5606198 Semiconductor chip with electrodes on side surface
02/25/1997US5606196 High-frequency, high-density semiconductor chip package with screening bonding wires
02/25/1997US5606195 High-voltage bipolar transistor utilizing field-terminated bond-pad electrodes
02/25/1997US5606192 Semiconductor integrated circuits having bipolar transistors and LDD-structured MOSFET
02/25/1997US5606191 Semiconductor device with lightly doped drain regions
02/25/1997US5606190 Microelectronic circuit structure having improved structural fineness and method for manufacturing same
02/25/1997US5606189 Dynamic RAM trench capacitor device with contact strap
02/25/1997US5606186 Semiconductor integrated circuit including opposed substrates of different semiconductor materials and method of manufacturing the semiconductor integrated circuit
02/25/1997US5606184 Semiconductor
02/25/1997US5606179 Insulated gate field effect transistor having a crystalline channel region
02/25/1997US5606177 Silicon oxide resonant tunneling diode structure
02/25/1997US5606176 Strained quantum well structure having variable polarization dependence and optical device including the strained quantum well structure
02/25/1997US5605867 Method of manufacturing insulating film of semiconductor device and apparatus for carrying out the same
02/25/1997US5605866 Clamp with wafer release for semiconductor wafer processing equipment
02/25/1997US5605865 Method for forming self-aligned silicide in a semiconductor device using vapor phase reaction
02/25/1997US5605864 Forming transistor gates and word lines, depositing insulator layer, spacer layer, patterning, etching
02/25/1997US5605862 Process for making low-leakage contacts
02/25/1997US5605861 Thin polysilicon doping by diffusion from a doped silicon dioxide film
02/25/1997US5605860 Method of fabricating semiconductor thin film and method of fabrication Hall-effect device
02/25/1997US5605859 Multilayer dielectrics
02/25/1997US5605858 Method of forming high-dielectric-constant material electrodes comprising conductive sidewall spacers of same material as electrodes
02/25/1997US5605857 Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells
02/25/1997US5605856 Method for designing an electronic integrated circuit with optical inputs and outputs
02/25/1997US5605855 Process for fabricating a graded-channel MOS device
02/25/1997US5605854 Integrated Ti-W polycide for deep submicron processing
02/25/1997US5605852 Method for fabricating high voltage transistor having trenched termination
02/25/1997US5605851 Method of forming semiconductor device with a buried junction
02/25/1997US5605850 Method for making a low-noise bipolar transistor
02/25/1997US5605849 Use of oblique implantation in forming base of bipolar transistor
02/25/1997US5605848 Depositing polysilicon layer on gate oxide layer, implanting fluorine and nitrogen ions, annealing, patterning
02/25/1997US5605847 Process for fabricating a TFT by selectively oxidizing or nitriding a light shielding layer
02/25/1997US5605846 Method for manufacturing semiconductor device
02/25/1997US5605845 Manufacture of electronic devices comprising thin-film transistors having self-aligned plural gates
02/25/1997US5605844 Inspecting method for semiconductor devices
02/25/1997US5605781 Containing cationic photoinitiator
02/25/1997US5605776 Phase-shifting photomask blank, phase-shifting photomask, and method of manufacturing them
02/25/1997US5605763 Electrically conductive bonding films
02/25/1997US5605760 Solid transparent uniform polymer
02/25/1997US5605724 Method of forming a metal conductor and diffusion layer
02/25/1997US5605715 Securing electrically conductive masking element to portion of electrically conductive base, coating by electrophoresis other portions with fusible particles, heating to sintering temperature to fuse particles into dielectric layer
02/25/1997US5605662 Used to carry out and control multistep, muliplex reactions such as, nucleic acid hybridization, antibody/antigen reactions, biopolymer synthesis
02/25/1997US5605637 Adjustable dc bias control in a plasma reactor
02/25/1997US5605610 Method of fabricating transparent conductive ito films
02/25/1997US5605608 Electron emission microtips of flat display screen; vaporization of conductive material on a cathode
02/25/1997US5605603 Deep trench process
02/25/1997US5605602 Method and device for removing a thin film from a wafer backside surface
02/25/1997US5605601 Method of manufacturing semiconductor device
02/25/1997US5605600 Etch profile shaping through wafer temperature control
02/25/1997US5605599 Method of generating plasma having high ion density for substrate processing operation
02/25/1997US5605576 High frequency magnetron plasma apparatus
02/25/1997US5605574 Semiconductor wafer support apparatus and method
02/25/1997US5605547 Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
02/25/1997US5605499 Flattening method and flattening apparatus of a semiconductor device
02/25/1997US5605489 Method of protecting micromechanical devices during wafer separation
02/25/1997US5605488 Polishing apparatus of semiconductor wafer
02/25/1997US5605487 Semiconductor wafer polishing appartus and method
02/25/1997US5605428 Device for indexing magazine compartments and wafer-shaped objects in the compartments
02/22/1997CA2156941A1 Method of making electrical connections to integrated circuit
02/20/1997WO1997006566A1 Photodiode and process for manufacturing the same
02/20/1997WO1997006565A1 Process for preparing thin-film transistor, process for preparing active matrix substrate, and liquid crystal display
02/20/1997WO1997006563A1 Ccd charge splitter
02/20/1997WO1997006562A1 Metal interconnect structure for an integrated circuit with improved electromigration reliability
02/20/1997WO1997006560A1 Low cost local interconnect process
02/20/1997WO1997006559A2 Process for producing a non-volatile memory cell
02/20/1997WO1997006558A1 Process for rounding corners in trench isolation
02/20/1997WO1997006557A1 Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way
02/20/1997WO1997006556A1 Process for generating a spacer in a structure
02/20/1997WO1997006555A1 A method for the low temperature cleaning of substrates containing indium or antimony
02/20/1997WO1997006554A2 Semiconductor device provided with transparent switching element
02/20/1997WO1997006548A2 Isotope separation method for preparing novel semiconductors, and semiconductor junctions containing the novel semiconductor
02/20/1997WO1997006469A1 Lithography exposure mask derived from nanocrystal precursors and a method of manufacturing the same
02/20/1997WO1997006444A1 Semiconductor wafer test and burn-in
02/20/1997WO1997006288A1 Process chamber with inner support
02/20/1997WO1997006287A1 A modular deposition system having batch processing and serial thin film deposition
02/20/1997WO1997006013A1 Lithographic surface or thin layer modification
02/20/1997WO1997001847A3 Electrically erasable and programmable read only memory with non-uniform dielectric thickness
02/20/1997WO1997001238A3 Method of operating a ccd imager, and ccd imager suitable for the implementation of such a method
02/20/1997DE19624916A1 LCD active matrix substrate manufacturing method
02/20/1997DE19538398A1 Semiconductor chip to PCB electrical connection bonding method