Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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02/26/1997 | EP0758941A1 Semiconductor wafer polishing apparatus and method |
02/26/1997 | EP0677183B1 Process for producing a developer having a low metal ion level |
02/26/1997 | CN1144016A Semiconductor package manufacturing method and semiconductor package |
02/26/1997 | CN1143833A Semiconductor device |
02/26/1997 | CN1143832A Method for measuring leakage current in junction region of semiconductor device |
02/26/1997 | CN1143831A Method for fabricating metal oxide silicon field effect transistors |
02/26/1997 | CN1143830A Method of making MOS transistor having LDD structure |
02/26/1997 | CN1143815A Flash EEPROM cell and manufacturing methods thereof |
02/26/1997 | CN1143814A Nonvolatile memory and emthod of programming the same |
02/26/1997 | CN1143747A Method and system for assessing operating condition of pressure regulator in corrosive gas distribution system |
02/26/1997 | CN1143690A Spattering filming device |
02/25/1997 | US5606524 Non-volatile semiconductor memory device capable of effecting high-speed operation with low voltage |
02/25/1997 | US5606521 Electrically erasable and programmable read only memory with non-uniform dielectric thickness |
02/25/1997 | US5606485 Electrostatic chuck having improved erosion resistance |
02/25/1997 | US5606484 Ceramic electrostatic chuck with built-in heater |
02/25/1997 | US5606278 Circuit for limiting the output voltage of a power transistor |
02/25/1997 | US5606251 Method and apparatus for detecting a substrate in a substrate processing system |
02/25/1997 | US5606204 Resin-sealed semiconductor device |
02/25/1997 | US5606203 Semiconductor device having Al-Cu wiring lines where Cu concentration is related to line width |
02/25/1997 | US5606202 Planarized gate conductor on substrates with above-surface isolation |
02/25/1997 | US5606199 Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame |
02/25/1997 | US5606198 Semiconductor chip with electrodes on side surface |
02/25/1997 | US5606196 High-frequency, high-density semiconductor chip package with screening bonding wires |
02/25/1997 | US5606195 High-voltage bipolar transistor utilizing field-terminated bond-pad electrodes |
02/25/1997 | US5606192 Semiconductor integrated circuits having bipolar transistors and LDD-structured MOSFET |
02/25/1997 | US5606191 Semiconductor device with lightly doped drain regions |
02/25/1997 | US5606190 Microelectronic circuit structure having improved structural fineness and method for manufacturing same |
02/25/1997 | US5606189 Dynamic RAM trench capacitor device with contact strap |
02/25/1997 | US5606186 Semiconductor integrated circuit including opposed substrates of different semiconductor materials and method of manufacturing the semiconductor integrated circuit |
02/25/1997 | US5606184 Semiconductor |
02/25/1997 | US5606179 Insulated gate field effect transistor having a crystalline channel region |
02/25/1997 | US5606177 Silicon oxide resonant tunneling diode structure |
02/25/1997 | US5606176 Strained quantum well structure having variable polarization dependence and optical device including the strained quantum well structure |
02/25/1997 | US5605867 Method of manufacturing insulating film of semiconductor device and apparatus for carrying out the same |
02/25/1997 | US5605866 Clamp with wafer release for semiconductor wafer processing equipment |
02/25/1997 | US5605865 Method for forming self-aligned silicide in a semiconductor device using vapor phase reaction |
02/25/1997 | US5605864 Forming transistor gates and word lines, depositing insulator layer, spacer layer, patterning, etching |
02/25/1997 | US5605862 Process for making low-leakage contacts |
02/25/1997 | US5605861 Thin polysilicon doping by diffusion from a doped silicon dioxide film |
02/25/1997 | US5605860 Method of fabricating semiconductor thin film and method of fabrication Hall-effect device |
02/25/1997 | US5605859 Multilayer dielectrics |
02/25/1997 | US5605858 Method of forming high-dielectric-constant material electrodes comprising conductive sidewall spacers of same material as electrodes |
02/25/1997 | US5605857 Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells |
02/25/1997 | US5605856 Method for designing an electronic integrated circuit with optical inputs and outputs |
02/25/1997 | US5605855 Process for fabricating a graded-channel MOS device |
02/25/1997 | US5605854 Integrated Ti-W polycide for deep submicron processing |
02/25/1997 | US5605852 Method for fabricating high voltage transistor having trenched termination |
02/25/1997 | US5605851 Method of forming semiconductor device with a buried junction |
02/25/1997 | US5605850 Method for making a low-noise bipolar transistor |
02/25/1997 | US5605849 Use of oblique implantation in forming base of bipolar transistor |
02/25/1997 | US5605848 Depositing polysilicon layer on gate oxide layer, implanting fluorine and nitrogen ions, annealing, patterning |
02/25/1997 | US5605847 Process for fabricating a TFT by selectively oxidizing or nitriding a light shielding layer |
02/25/1997 | US5605846 Method for manufacturing semiconductor device |
02/25/1997 | US5605845 Manufacture of electronic devices comprising thin-film transistors having self-aligned plural gates |
02/25/1997 | US5605844 Inspecting method for semiconductor devices |
02/25/1997 | US5605781 Containing cationic photoinitiator |
02/25/1997 | US5605776 Phase-shifting photomask blank, phase-shifting photomask, and method of manufacturing them |
02/25/1997 | US5605763 Electrically conductive bonding films |
02/25/1997 | US5605760 Solid transparent uniform polymer |
02/25/1997 | US5605724 Method of forming a metal conductor and diffusion layer |
02/25/1997 | US5605715 Securing electrically conductive masking element to portion of electrically conductive base, coating by electrophoresis other portions with fusible particles, heating to sintering temperature to fuse particles into dielectric layer |
02/25/1997 | US5605662 Used to carry out and control multistep, muliplex reactions such as, nucleic acid hybridization, antibody/antigen reactions, biopolymer synthesis |
02/25/1997 | US5605637 Adjustable dc bias control in a plasma reactor |
02/25/1997 | US5605610 Method of fabricating transparent conductive ito films |
02/25/1997 | US5605608 Electron emission microtips of flat display screen; vaporization of conductive material on a cathode |
02/25/1997 | US5605603 Deep trench process |
02/25/1997 | US5605602 Method and device for removing a thin film from a wafer backside surface |
02/25/1997 | US5605601 Method of manufacturing semiconductor device |
02/25/1997 | US5605600 Etch profile shaping through wafer temperature control |
02/25/1997 | US5605599 Method of generating plasma having high ion density for substrate processing operation |
02/25/1997 | US5605576 High frequency magnetron plasma apparatus |
02/25/1997 | US5605574 Semiconductor wafer support apparatus and method |
02/25/1997 | US5605547 Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor |
02/25/1997 | US5605499 Flattening method and flattening apparatus of a semiconductor device |
02/25/1997 | US5605489 Method of protecting micromechanical devices during wafer separation |
02/25/1997 | US5605488 Polishing apparatus of semiconductor wafer |
02/25/1997 | US5605487 Semiconductor wafer polishing appartus and method |
02/25/1997 | US5605428 Device for indexing magazine compartments and wafer-shaped objects in the compartments |
02/22/1997 | CA2156941A1 Method of making electrical connections to integrated circuit |
02/20/1997 | WO1997006566A1 Photodiode and process for manufacturing the same |
02/20/1997 | WO1997006565A1 Process for preparing thin-film transistor, process for preparing active matrix substrate, and liquid crystal display |
02/20/1997 | WO1997006563A1 Ccd charge splitter |
02/20/1997 | WO1997006562A1 Metal interconnect structure for an integrated circuit with improved electromigration reliability |
02/20/1997 | WO1997006560A1 Low cost local interconnect process |
02/20/1997 | WO1997006559A2 Process for producing a non-volatile memory cell |
02/20/1997 | WO1997006558A1 Process for rounding corners in trench isolation |
02/20/1997 | WO1997006557A1 Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way |
02/20/1997 | WO1997006556A1 Process for generating a spacer in a structure |
02/20/1997 | WO1997006555A1 A method for the low temperature cleaning of substrates containing indium or antimony |
02/20/1997 | WO1997006554A2 Semiconductor device provided with transparent switching element |
02/20/1997 | WO1997006548A2 Isotope separation method for preparing novel semiconductors, and semiconductor junctions containing the novel semiconductor |
02/20/1997 | WO1997006469A1 Lithography exposure mask derived from nanocrystal precursors and a method of manufacturing the same |
02/20/1997 | WO1997006444A1 Semiconductor wafer test and burn-in |
02/20/1997 | WO1997006288A1 Process chamber with inner support |
02/20/1997 | WO1997006287A1 A modular deposition system having batch processing and serial thin film deposition |
02/20/1997 | WO1997006013A1 Lithographic surface or thin layer modification |
02/20/1997 | WO1997001847A3 Electrically erasable and programmable read only memory with non-uniform dielectric thickness |
02/20/1997 | WO1997001238A3 Method of operating a ccd imager, and ccd imager suitable for the implementation of such a method |
02/20/1997 | DE19624916A1 LCD active matrix substrate manufacturing method |
02/20/1997 | DE19538398A1 Semiconductor chip to PCB electrical connection bonding method |