| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 03/04/1997 | US5608249 Reduced area storage node junction |
| 03/04/1997 | US5608248 Semiconductor memory device with planarization structure |
| 03/04/1997 | US5608247 Storage capacitor structures using CVD tin on hemispherical grain silicon |
| 03/04/1997 | US5608246 Integration of high value capacitor with ferroelectric memory |
| 03/04/1997 | US5608244 Semiconductor diode with reduced recovery current |
| 03/04/1997 | US5608241 Semiconductor device having a memory cell portion and a logic portion |
| 03/04/1997 | US5608240 Semiconductor integrated circuit having at least one asymmetrical CMOS transistor |
| 03/04/1997 | US5608239 Field effect transistor |
| 03/04/1997 | US5608232 Silicon film containing at least one compound of nickel, iron, cobalt, platinum, and palladium; thin film transistors |
| 03/04/1997 | US5608231 Field effect transistor having channel with plural quantum boxes arranged in a common plane |
| 03/04/1997 | US5608229 Quantum box semiconductor device |
| 03/04/1997 | US5608226 Electron-beam exposure method and system |
| 03/04/1997 | US5608223 Ion implantation device |
| 03/04/1997 | US5608172 Die bond touch down detector |
| 03/04/1997 | US5608155 Method and apparatus for detecting particles on a substrate |
| 03/04/1997 | US5607899 Method of forming single-crystalline thin film |
| 03/04/1997 | US5607884 Method for fabricating MOS transistor having source/drain region of shallow junction and silicide film |
| 03/04/1997 | US5607881 Overetching a trench in exposed semiconductor substrate; implantation |
| 03/04/1997 | US5607880 Method of fabricating multilevel interconnections in a semiconductor integrated circuit |
| 03/04/1997 | US5607879 Method for forming buried plug contacts on semiconductor integrated circuits |
| 03/04/1997 | US5607878 Contact plug forming method |
| 03/04/1997 | US5607877 Projection-electrode fabrication method |
| 03/04/1997 | US5607875 Method of separating a semiconductor wafer with dielectrics |
| 03/04/1997 | US5607874 Semiconductors |
| 03/04/1997 | US5607873 Method for forming contact openings in a multi-layer structure that reduces overetching of the top conductive structure |
| 03/04/1997 | US5607872 Method of fabricating charge coupled device |
| 03/04/1997 | US5607871 Method of manufacturing a flash EEPROM cell using the select gates as a mask |
| 03/04/1997 | US5607869 Method for manufacturing asymmetrical LDD type MIS device |
| 03/04/1997 | US5607868 Method of fabricating semiconductor device with channel ion implantation through a conductive layer |
| 03/04/1997 | US5607866 Method of fabricating a semiconductor device having silicide layers for electrodes |
| 03/04/1997 | US5607865 Semiconductors |
| 03/04/1997 | US5607824 Antireflective coating for microlithography |
| 03/04/1997 | US5607818 Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
| 03/04/1997 | US5607817 Photopolymerizable composition |
| 03/04/1997 | US5607801 Direct patterning method of resist film using electron beam |
| 03/04/1997 | US5607800 E. g., irradiating arrangement so patterned layer reflects more radiation than underlying layer, which absorbs more radiation than patterned layer, measuring zeroth order reflected radiation, expressing as reflectance, comparing |
| 03/04/1997 | US5607773 Method of forming a multilevel dielectric |
| 03/04/1997 | US5607724 Low temperature high pressure silicon deposition method |
| 03/04/1997 | US5607718 Polishing method and polishing apparatus |
| 03/04/1997 | US5607602 High-rate dry-etch of indium and tin oxides by hydrogen and halogen radicals such as derived from HCl gas |
| 03/04/1997 | US5607601 Method for patterning and etching film layers of semiconductor devices |
| 03/04/1997 | US5607599 Boron trichloride and chlorine |
| 03/04/1997 | US5607569 Method of fabricating ceramic package body for holding semiconductor devices |
| 03/04/1997 | US5607564 Method of producing a microporous, gas permeable electrode structure and a microporous, gas permeable electrode structure |
| 03/04/1997 | US5607543 Integrated circuit etching |
| 03/04/1997 | US5607542 Generation of plasma for reactive ion etching |
| 03/04/1997 | US5607541 Electrostatic chuck |
| 03/04/1997 | US5607515 Method of cleaning CVD apparatus |
| 03/04/1997 | US5607511 Method and apparatus for low temperature, low pressure chemical vapor deposition of epitaxial silicon layers |
| 03/04/1997 | US5607510 Vacuum processing apparatus |
| 03/04/1997 | US5607509 High impedance plasma ion implantation apparatus |
| 03/04/1997 | US5607276 Batchloader for substrate carrier on load lock |
| 03/04/1997 | US5607099 Solder bump transfer device for flip chip integrated circuit devices |
| 03/04/1997 | US5607059 Surface package type semiconductor package and method of producing semiconductor memory |
| 03/04/1997 | US5607009 Method of heating and cooling large area substrates and apparatus therefor |
| 03/04/1997 | US5607002 Chemical refill system for high purity chemicals |
| 03/04/1997 | US5606793 Multiple component assembly alignment tool |
| 03/04/1997 | CA2076334C Ambient-free processing system |
| 02/27/1997 | WO1997007547A1 High density trenched dmos transistor |
| 02/27/1997 | WO1997007546A1 Metal insulator semiconductor structure with polarization-compatible buffer layer |
| 02/27/1997 | WO1997007545A1 Method of manufacturing semiconductor integrated circuit |
| 02/27/1997 | WO1997007544A1 Cmos circuit esd protection using well resistor |
| 02/27/1997 | WO1997007542A1 Epoxy resin based solder paste |
| 02/27/1997 | WO1997007541A1 Encapsulant with fluxing properties and method of use |
| 02/27/1997 | WO1997007540A1 Housing for microelectronics components and modules and process for producing it |
| 02/27/1997 | WO1997007539A1 Laser surface treatment device and method |
| 02/27/1997 | WO1997007538A1 Method of making electrical connections to integrated circuit |
| 02/27/1997 | WO1997007537A1 Method of producing semiconductor device |
| 02/27/1997 | WO1997007536A2 Ridge-shaped laser in a channel |
| 02/27/1997 | WO1997007534A1 A process for fabricating semiconductor devices with shallowly doped regions using dopant compounds containing elements of high solid solubility |
| 02/27/1997 | WO1997007533A1 Trenched dmos transistor with buried layer for reduced on-resistance and ruggedness |
| 02/27/1997 | WO1997007532A1 Semiconductor processor with wafer face protection |
| 02/27/1997 | WO1997007459A1 Memory tester providing fast repair of memory chips |
| 02/27/1997 | WO1997007429A1 Self-assembled monolayer directed patterning of surfaces |
| 02/27/1997 | WO1997007407A1 Probe card having vertical type needles and the method thereof |
| 02/27/1997 | WO1997006953A1 Method and apparatus for bonding microelectronic chips |
| 02/27/1997 | WO1997006947A1 Packing material, base material for adhesive tape, or separator |
| 02/27/1997 | WO1997006921A1 Polishing pads |
| 02/27/1997 | DE19633689A1 Semiconductor device e.g. DRAM prodn. |
| 02/27/1997 | DE19632110A1 Power semiconductor device with isolating trench |
| 02/27/1997 | DE19630342A1 Manufacturing method for semiconductor device |
| 02/27/1997 | DE19610272A1 Semiconductor device with contact hole manufacturing method for e.g. MOS transistor of memory |
| 02/27/1997 | DE19531158A1 Diffusion soldering method esp. for semiconductor components |
| 02/27/1997 | DE19531068A1 Mask prodn. on semiconductor substrate |
| 02/27/1997 | DE19531031A1 Verfahren zum Trocknen von Silizium A method for drying of silicon |
| 02/27/1997 | DE19530900A1 Fusible link adjusting appts. for integrated circuit |
| 02/27/1997 | CA2228608A1 Metal insulator semiconductor structure with polarization-compatible buffer layer |
| 02/26/1997 | EP0759661A2 High speed customizable logic array device |
| 02/26/1997 | EP0759639A2 Source/drain structure of high voltage MOSFET and method of fabricating the same |
| 02/26/1997 | EP0759638A2 High withstand voltage semiconductor device and manufacturing method thereof |
| 02/26/1997 | EP0759637A2 Semiconductor package and mounting method |
| 02/26/1997 | EP0759635A2 Planarized final passivation for semiconductor devices |
| 02/26/1997 | EP0759634A1 SOI wafer and method for the preparation thereof |
| 02/26/1997 | EP0759631A1 Process and apparatus for the fabrication of holes in a layer of photosensitive material, especially for the fabrication of electron sources |
| 02/26/1997 | EP0759622A2 Nonvolatile memory and method of programming the same |
| 02/26/1997 | EP0759618A2 Semiconductor memory device including divisional decoder circuit composed of nmos transistors |
| 02/26/1997 | EP0759578A1 Apparatus for the exposure of micropattern in a photosensitive layer and process for creating a pattern therein |
| 02/26/1997 | EP0759576A2 Method for making an optical pellicle |
| 02/26/1997 | EP0759481A1 Method of depositing a stable fluorinated TEOS film |
| 02/26/1997 | EP0759416A2 Vessel of pyrolytic boron nitride |