Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/1996
12/24/1996US5586388 Method for producing multi-board electronic device
12/24/1996CA2011927C Microlithographic method for producing thick, vertically-walled photoresist patterns
12/23/1996CA2179765A1 Process for producing a plate and for said plate a cover protected by a semiconductor substrate
12/19/1996WO1996041506A1 Photolithographically patterned spring contact
12/19/1996WO1996041380A1 Memory array having a multi-state element and method for forming such array or cells thereof
12/19/1996WO1996041375A1 Integrated circuit comprising a substrate and a wiring layer with a buffer layer between the substrate and the wiring layer
12/19/1996WO1996041374A1 Double half via antifuse
12/19/1996WO1996041372A1 Method and apparatus for fabricating self-assembling microstructures
12/19/1996WO1996041371A1 Substrate transfer apparatus and heat treatment system using the same
12/19/1996WO1996041370A1 Removal of material by polarized radiation and back side application of radiation
12/19/1996WO1996041369A1 Method and apparatus for controlling a temperature of a wafer
12/19/1996WO1996041368A1 Multilayer high vertical aspect ratio thin film structures
12/19/1996WO1996041367A2 Method for shallow junction formation
12/19/1996WO1996041366A1 Plasma processing system with reduced particle contamination
12/19/1996WO1996041365A1 Plasma sputter etching system with reduced particle contamination
12/19/1996WO1996041347A1 Negative voltage switching circuit
12/19/1996WO1996041207A1 Performance driven bist technique
12/19/1996WO1996041204A1 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
12/19/1996WO1996041109A1 Passive gas substrate thermal conditioning apparatus and method
12/19/1996WO1996041105A1 Dual side passive gas substrate thermal conditioning
12/19/1996WO1996041030A1 Method for producing metal matrix composites incorporating partially sintered preforms
12/19/1996WO1996040690A1 Metal complex source reagents for chemical vapor deposition
12/19/1996WO1996040420A1 Micromachined porous membranes with bulksupport
12/19/1996WO1996033511A3 Method of manufacturing a progammable semiconductor device in the form of an anti-fuse
12/19/1996DE19622704A1 Epitaxial wafer for light-emitting diode
12/19/1996DE19605109A1 Hybrid Schottky injection FET on SOI substrate
12/19/1996DE19603447A1 Integrated semiconductor device with multiple integrated circuits for e.g. logic circuit
12/19/1996DE19600544A1 EEPROM with n=type source and p=type drain regions
12/19/1996DE19547284C1 Thinned semiconductor wafer processing method
12/19/1996DE19517964A1 Identification device for semiconductor wafers or compact discs during manufacturing processes
12/19/1996CA2570713A1 Removal of material by polarized radiation and back side application of radiation
12/19/1996CA2223677A1 Metal complex source reagents for chemical vapor deposition
12/19/1996CA2223106A1 Bottom electrode structure for integrated circuit capacitors and method of making the same
12/18/1996EP0749188A2 Rotary section current transmitting mechanism
12/18/1996EP0749167A1 Ferroelectric capacitor for semiconductor integrated circuit and method for manufacturing the same
12/18/1996EP0749166A1 Diode and method of manufacturing the same
12/18/1996EP0749165A2 Thin film transistor in insulated semiconductor substrate and manufacturing method thereof
12/18/1996EP0749163A2 MOS type semiconductor device
12/18/1996EP0749162A2 Vertical MISFET devices, CMOS process integration, RAM applications
12/18/1996EP0749158A1 Semiconductor device with auto-aligned polycide gate
12/18/1996EP0749157A2 Method of solder bonding
12/18/1996EP0749156A1 Semiconductor device with self-aligned contacts and method of fabrication
12/18/1996EP0749155A2 Composite electronic coatings
12/18/1996EP0749154A2 Method of fabricating a III-V compound semiconductor layer
12/18/1996EP0749153A1 Cleaning system and method
12/18/1996EP0749149A2 Plasma processing apparatus
12/18/1996EP0749148A2 Plasma processing apparatus
12/18/1996EP0749127A2 Data storage element and method for restoring data
12/18/1996EP0749058A2 Pressure type flow rate control apparatus
12/18/1996EP0749046A1 Positive-working photoresist composition
12/18/1996EP0749044A2 Positive-working photoresist composition
12/18/1996EP0749010A2 Apparatus and method for evaluating contamination caused by organic substances deposited on substrate surface
12/18/1996EP0748884A1 Process and apparatus for producing polycrystalline semiconductors
12/18/1996EP0748831A2 Snap-cure epoxy adhesives
12/18/1996EP0748521A1 Low voltage one transistor flash eeprom cell using fowler-nordheim programming and erase
12/18/1996EP0748520A1 Silicon carbide-based mis structure with high latch-up resistance
12/18/1996EP0748518A1 Method of etching conductive lines without undercutting
12/18/1996EP0748517A1 Providing a low resistance to integrated circuit devices
12/18/1996EP0748512A1 Method of manufacturing a thin, radiotransparent window
12/18/1996EP0748427A1 Apparatus and method for protecting chemical bath seals
12/18/1996EP0748261A1 Layered chip structure
12/18/1996EP0720521A4 Apparatus and method for dicing semiconductor wafers
12/18/1996EP0698128B1 Sputter coating collimator with integral reactive gas distribution
12/18/1996EP0644954B1 Semiconductor wafer processing cvd reactor
12/18/1996EP0637403A4 Micromachining process for making perfect exterior corner in an etchable substrate.
12/18/1996EP0591476B1 Monolithically integrated circuit
12/18/1996EP0549733B1 Apparatus and method for the transfer and delivery of high purity chemicals
12/18/1996EP0513273B1 Electrical connection for a power chip
12/18/1996EP0451286B1 Integrated circuit device
12/18/1996CN1138353A Material of chemical compounds with a metal in group IVA of the periodic system, nitrogen and oxygen and process for producing it
12/18/1996CN1138286A Wiring construction body, method of manufacturing same, and circuit board using wiring construction body
12/18/1996CN1138216A Semiconductor device with plastic packaged
12/18/1996CN1138214A Flash eeprom cell and method of making the same
12/18/1996CN1138213A Method of and apparatus for visually inspecting leads of semiconductor device
12/18/1996CN1138212A Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips
12/18/1996CN1138165A Device testing system with cable pivot and method of installation
12/18/1996CN1137948A Liquid supplying apparatus
12/17/1996USRE35405 Method of manufacturing semiconductor device utilizing an accumulation layer
12/17/1996US5586307 Method and apparatus supplying synchronous clock signals to circuit components
12/17/1996US5586159 Substrate holding system and exposure apparatus having the same
12/17/1996US5586078 Dynamic type memory
12/17/1996US5586073 Semiconductor device having a multi-layer channel structure
12/17/1996US5586007 Circuit board having improved thermal radiation
12/17/1996US5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together
12/17/1996US5585998 Isolated sidewall capacitor with dual dielectric
12/17/1996US5585991 Protective circuit for protecting load against excessive input voltage
12/17/1996US5585972 Arbitrarily wide lens array with an image field to span the width of a substrate
12/17/1996US5585925 Alignment method
12/17/1996US5585918 Foreign particle inspecting system
12/17/1996US5585766 Plasma processing system for use in fabricating electronic devices
12/17/1996US5585752 Fully integrated, ramp generator with relatively long time constant
12/17/1996US5585750 Logic LSI
12/17/1996US5585676 IC chip for different type IC packages
12/17/1996US5585674 Transverse diffusion barrier interconnect structure
12/17/1996US5585673 Refractory metal capped low resistivity metal conductor lines and vias
12/17/1996US5585666 Semiconductor device with chip layout having inner electrode configuration and liquid crystal display apparatus employing the semiconductor device
12/17/1996US5585664 Semiconductor integrated circuit device
12/17/1996US5585663 In an integrated circuit
12/17/1996US5585662 Semiconductor integrated circuit device with breakable fuse element covered with exactly controlled insulating film
12/17/1996US5585661 Sub-micron bonded SOI by trench planarization
1 ... 5925 5926 5927 5928 5929 5930 5931 5932 5933 5934 5935 5936 5937 5938 5939 5940 5941 5942 5943 5944 5945 ... 6590