Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1998
06/04/1998DE19743554A1 Smooth surfaced x=ray lithography mask production
06/04/1998DE19740996A1 Two-fluid cleaning jet nozzle for cleaning semiconductor wafers during production
06/04/1998DE19732114A1 Clock driver circuitry with internal circuits in main plane of semiconductor substrate for gate array or embedded cell array
06/04/1998DE19731714A1 Integrated circuit for gate array, embedded cell array
06/04/1998DE19729601A1 Semiconductor DRAM component with resistance element having interference security
06/04/1998DE19724533A1 Semiconductor component mfg. method with protruding electrodes for ball grid array
06/04/1998DE19723264A1 Semiconductor device especially DRAM measurement
06/04/1998DE19719670A1 Semiconductor memory with MOS and bipolar transistors for SCRAM cells
06/04/1998DE19706072C1 Treatment of chemical reagents in fluid container
06/04/1998DE19651003A1 Large single crystal layer production
06/04/1998DE19602943A1 Two-part metallic heat sink manufacturing method for semiconductor device
06/04/1998CA2223539A1 Electromagnetic wave detector
06/03/1998EP0845864A2 Level converter and semiconductor device
06/03/1998EP0845847A1 Device for the protection of MOS integrated circuit terminals against electrostatic discharges
06/03/1998EP0845831A2 A millimeter waveguide and a circuit apparatus using the same
06/03/1998EP0845829A2 RF switching cells
06/03/1998EP0845814A2 Method of producing a GTO thyristor
06/03/1998EP0845813A1 Insulated gate bipolar transistor
06/03/1998EP0845811A2 A read only memory array and a method of manufacturing the array
06/03/1998EP0845810A1 Large-scale-integration circuit device and method of manufacturing same
06/03/1998EP0845808A2 Multilayer wiring structure including via holes
06/03/1998EP0845807A2 Method for producing electronic circuit device, jig for making solder residue uniform, jig for transferring solder paste, and apparatus for producing electronic circuit device
06/03/1998EP0845806A1 Improvements in or relating to integrated circuits
06/03/1998EP0845805A2 Method for fabricating semiconductor device
06/03/1998EP0845804A2 Pre-treatment of substrate before deposition of an insulating film
06/03/1998EP0845803A1 SiC ELEMENT AND PROCESS FOR ITS PRODUCTION
06/03/1998EP0845802A2 Substrate support member for uniform heating of a substrate
06/03/1998EP0845801A1 Process for manufacturing a plastic package for electronic devices having an heat dissipator
06/03/1998EP0845799A2 Semiconductor processing apparatus
06/03/1998EP0845680A1 Making and testing an integrated circuit using high density probe points
06/03/1998EP0845677A1 A method of using a temporary z-axis material
06/03/1998EP0845665A2 Sensor, bias circuit and method for shunting current therein
06/03/1998EP0845546A2 A warm wall reaction chamber and a method for forming a hemi-spherical grain layer using the same
06/03/1998EP0845545A1 Coated deposition chamber equipment
06/03/1998EP0845445A1 Photosensitive ceramic green sheet, ceramic package, and process for producing the same
06/03/1998EP0845430A2 Paper handling system having embedded control structures
06/03/1998EP0845329A2 Method and apparatus for polishing a thin plate
06/03/1998EP0845156A2 A thin-film electronic device and a method of manufacturing such device
06/03/1998EP0845155A1 Semiconductor processor with wafer face protection
06/03/1998EP0845151A1 Recessed coil for generating a plasma
06/03/1998EP0845122A1 Memory tester providing fast repair of memory chips
06/03/1998EP0815596A4 Improved non-destructively read ferroelectric memory cell
06/03/1998EP0813747A4 Thermal processing apparatus and process
06/03/1998EP0788729A4 Programmable high density electronic testing device
06/03/1998EP0788654B1 Inductively coupled plasma sputter chamber with conductive material sputtering capabilities
06/03/1998EP0654168A4 Fault-tolerant, high-speed bus system and bus interface for wafer-scale integration.
06/03/1998EP0642697B1 Device for handling wafer-shaped objects in a handling plane of a local clean room
06/03/1998EP0598795B1 High performance passivation for semiconductor devices
06/03/1998EP0561964B1 Optoelectronic device component package and method of making the same
06/03/1998CN1183854A Slip free vertical rack design
06/03/1998CN1183853A Plasma processor for large workpieces
06/03/1998CN1183706A Method and apparatus for producing electronic circuit device, and jig for making solder residue unifrom and transferring solder paste
06/03/1998CN1183649A Geometrical control of device corner threshold
06/03/1998CN1183648A Semi-conductor memory device and manufacturing method thereof
06/03/1998CN1183647A Acceleration test method of semiconductor memory
06/03/1998CN1183646A 电力控制器件 Power control device
06/03/1998CN1183645A Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same
06/03/1998CN1183644A Crushable bead on lead finger side surface to improve moldability
06/03/1998CN1183643A Semiconductor device and lead of frame used therefor
06/03/1998CN1183642A Semiconductor device fabrication method
06/03/1998CN1183641A Method of fabricating semiconductor device with cavity interposed between wirings
06/03/1998CN1183640A Semiconductor device and method of testing the same
06/03/1998CN1183639A Test structure for estimating defects at isolation edge of semiconductor element and test method using the same
06/03/1998CN1183638A Semiconductor device fabrication method
06/03/1998CN1183637A MOS device fabrication method
06/03/1998CN1183636A Capacitor for semiconductor device and method for manufacturing the same
06/03/1998CN1183635A Process for producing semiconductor article
06/03/1998CN1183634A Method for mfg. word line
06/03/1998CN1183580A Developing device for semiconductor device fabrication and its controlling method
06/03/1998CN1183579A Process of exactly patterning layer to target configuration by using photo-resist mask formed with dummy pattern
06/03/1998CN1183570A Liquid crystal display using organic insulating material and manufacturing methods thereof
06/03/1998CN1183322A Microwave-excitation cleaning and rinsing apparatus
06/03/1998CN1038625C Solution preventing from adhesion of impurity in liquid and method for corrosion by use of same
06/02/1998USH1733 Exposure method
06/02/1998US5761481 Semiconductor simulator tool for experimental N-channel transistor modeling
06/02/1998US5761337 Method and apparatus for inspection of the appearance of bumps
06/02/1998US5761214 Method for testing integrated circuit devices
06/02/1998US5761213 Method and apparatus to determine erroneous value in memory cells using data compression
06/02/1998US5761149 Dynamic RAM
06/02/1998US5761143 Using an output of a leak detector which detects leakage from a dummy memory cell to control a subtrate voltage in a semi conductor memory device
06/02/1998US5761142 Semiconductor memory device having sense amplifier drivers disposed on center portion of cell array block
06/02/1998US5761139 Semiconductor memory having redundancy memory cells
06/02/1998US5761127 Flash-erasable semiconductor memory device having an improved reliability
06/02/1998US5761124 Semiconductor nonvolatile memory device in which high capacitance bit lines are isolated from sense amplifier input/output nodes during amplifying operation of sense amplifier
06/02/1998US5761122 Semiconductor memory device with program/erase verification
06/02/1998US5761120 Floating gate FPGA cell with select device on drain
06/02/1998US5761119 Nonvolatile semiconductor memory with a plurality of erase decoders connected to erase gates
06/02/1998US5761115 Programmable metallization cell structure and method of making same
06/02/1998US5761109 Semiconductor memory device having folded bit line array and an open bit line array with imbalance correction
06/02/1998US5761107 Method and apparatus for improving the speed of a logic circuit
06/02/1998US5761082 Method for manufacturing an integrated circuit
06/02/1998US5761075 Apparatus for designing photomasks
06/02/1998US5761065 Arrangement and method for detecting sequential processing effects in manufacturing
06/02/1998US5761064 Defect management system for productivity and yield improvement
06/02/1998US5761048 Semiconductor die has a plurality of bond pads formed thereon which are electrically connected to conductive traces on package substrate
06/02/1998US5761023 Substrate support with pressure zones having reduced contact area and temperature feedback
06/02/1998US5760892 Method of analyzing failure of semiconductor device by using emission microscope and system for analyzing failure of semiconductor device
06/02/1998US5760881 Exposure apparatus with light shielding portion for plotosensitive elements
06/02/1998US5760879 Method of detecting coma of projection optical system
06/02/1998US5760854 Liquid crystal display apparatus