Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1998
06/16/1998US5766803 Mask generation technique for producing an integrated circuit with optimal metal interconnect layout for achieving global planarization
06/16/1998US5766785 Method and apparatus for manufacturing a semiconductor device
06/16/1998US5766765 Generally flat member having smooth surfaces and made of highly oriented graphite
06/16/1998US5766695 Method for reducing surface layer defects in semiconductor materials having a volatile species
06/16/1998US5766685 Treatment method and apparatus for printed circuit boards and the like
06/16/1998US5766684 Stainless steel acid treatment
06/16/1998US5766682 Process for chemical vapor deposition of a liquid raw material
06/16/1998US5766671 Method of an apparatus for forming film on substrate by sensing atmospheric pressure
06/16/1998US5766650 Moulding apparatus with compensation element
06/16/1998US5766649 Resin sealing mold die set with less resin remainder for semiconductor device
06/16/1998US5766535 Pressure-plate-operative system for one-side injection molding of substrate-mounted integrated circuits
06/16/1998US5766499 Deposition of metallic layer circuit pattern including element which precisely marks position of tool alignment hole and is sacrificed after formation of hole through substrate; simplification
06/16/1998US5766498 Anisotropic etching method and apparatus
06/16/1998US5766497 Etching of dielectrics
06/16/1998US5766496 Decapsulator and method for decapsulating plastic encapsulated device
06/16/1998US5766494 Etching method and apparatus
06/16/1998US5766492 Forming electric circuit on board, copper plating, forming resist coating on surface except for electrodes, subjecting electrodes to electrolytic plating, removing resist, removing copper from surface except on electric circuit
06/16/1998US5766405 Apparatus for producing a laminated strip of a metal foil and a plastic film
06/16/1998US5766404 Methods and apparatus for plasma treatment of workpieces
06/16/1998US5766402 Apparatus for applying tape to object by applying pressure thereto
06/16/1998US5766392 Method of manufacturing a multilayer ceramic electronic component
06/16/1998US5766379 Forming metal layer on face of microelectronic substrate, forming copper layer on the metal layer, annealing to form oxide of metal on copper layer by heating to diffuse some of metal layer through copper layer
06/16/1998US5766369 Striking device to cause particulates attached to working surface to fall free
06/16/1998US5766368 Integrated circuit chip module cleaning using a carbon dioxide jet spray
06/16/1998US5766365 Removable ring for controlling edge deposition in substrate processing apparatus
06/16/1998US5766364 Plasma processing apparatus
06/16/1998US5766363 Heater for CVD apparatus
06/16/1998US5766360 Substrate processing apparatus and substrate processing method
06/16/1998US5766347 Apparatus for fabricating a semiconductor single crystal
06/16/1998US5766345 Molecular beam epitaxy
06/16/1998US5766344 Method for forming a semiconductor
06/16/1998US5766343 Lower bandgap, lower resistivity, silicon carbide heteroepitaxial material, and method of making same
06/16/1998US5766341 Method for rotating a crucible of a crystal pulling machine
06/16/1998US5766305 Metal powder composition for metallization and a metallized substrate
06/16/1998US5766279 Mixed oxides
06/16/1998US5766065 Apparatus for polishing peripheral portion of wafer
06/16/1998US5766022 Electrical assembly
06/16/1998US5765983 Robot handling apparatus
06/16/1998US5765982 Automatic wafer boat loading system and method
06/16/1998US5765890 Device for transferring a semiconductor wafer
06/16/1998US5765889 Wafer transport robot arm for transporting a semiconductor wafer
06/16/1998US5765744 Production of small metal bumps
06/16/1998US5765692 Carrier tape with adhesive and protective walls
06/16/1998US5765280 Method for making a carrier based IC packaging arrangement
06/16/1998US5765279 For microelectronic devices
06/16/1998US5765277 Die bonding apparatus with a revolving pick-up tool
06/16/1998CA1339914C Method of creating a high flux of activated species for reaction with a remotely located substrate
06/16/1998CA1339909C Process for selective formation of iii -v group coumpound film
06/11/1998WO1998025308A1 Film-like composite structure and method of manufacture thereof
06/11/1998WO1998025307A1 Semiconductor device
06/11/1998WO1998025304A1 Semiconductor device
06/11/1998WO1998025303A1 Chip scale ball grid array for integrated circuit package
06/11/1998WO1998025301A1 Tab tape ball grid array package with vias laterally offset from solder ball bond sites
06/11/1998WO1998025300A1 Apparatus and methods for minimizing as-deposited stress in tungsten silicide films
06/11/1998WO1998025299A1 Method for manufacturing semiconductor silicon epitaxial wafer and semiconductor device
06/11/1998WO1998025298A1 Semiconductor device, method for manufacture thereof, circuit board, and electronic equipment
06/11/1998WO1998025297A1 Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
06/11/1998WO1998025293A2 Method of operating a particle-optical apparatus
06/11/1998WO1998025263A1 Lateral magneto-electronic device exploiting a quasi-two-dimensional electron gas
06/11/1998WO1998025182A1 Reticle that compensates for lens error in a photolithographic system
06/11/1998WO1998025131A1 Wafer inspection system for distinguishing pits and particles
06/11/1998WO1998025090A1 Spherical shaped semiconductor integrated circuit
06/11/1998WO1998024860A1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same
06/11/1998WO1998024544A1 Laminated assembly for active bioelectronic devices
06/11/1998CA2274047A1 Laminated assembly for active bioelectronic devices
06/11/1998CA2272436A1 Tab tape ball grid array package with vias laterally offset from solder ball bond sites
06/11/1998CA2272434A1 Chip scale ball grid array for integrated circuit package
06/10/1998EP0847233A2 IC leadframe processing system
06/10/1998EP0847232A2 Method for drying resin-used electronic parts
06/10/1998EP0847231A1 Apparatus and method for generation of a plasma torch
06/10/1998EP0847091A2 Low voltage eeprom/nvram transistors and making method
06/10/1998EP0847089A1 Method and device for suppressing parasitic effects in a junction-insulated integrated circuit
06/10/1998EP0847088A2 Semiconductor device, method for manufacturing the same, and method for mounting the same
06/10/1998EP0847085A2 Method and apparatus for both mechanically and electrostatically clamping a wafer
06/10/1998EP0847084A2 Electronic modules manufacturing
06/10/1998EP0847083A2 A method for manufacturing a capacitor for a semiconductor device
06/10/1998EP0847082A2 Process of treating a semiconductor substrate comprising a surface treatment step
06/10/1998EP0847081A1 Improvements in or relating to semiconductor devices
06/10/1998EP0847080A1 Improvements in or relating to semiconductor devices
06/10/1998EP0847079A2 Method of manufacturing an MIS electrode
06/10/1998EP0847078A1 Method for manufacturing semiconductor device
06/10/1998EP0847077A1 Method for gaseous substrate support
06/10/1998EP0847076A2 Manufacturing semiconductor devices
06/10/1998EP0847073A1 Ion source block cathode with labyrinth conductive path
06/10/1998EP0847059A2 Semiconductor memory
06/10/1998EP0847010A2 Row redundancy block architecture
06/10/1998EP0846998A2 Integrated circuit sensing and digitally biasing the threshold voltage of transistors and related methods
06/10/1998EP0846997A2 Integrated circuit actively biasing the threshold voltage of transistors and related methods
06/10/1998EP0846986A2 Position detector and microlithography apparatus comprising same
06/10/1998EP0846985A1 Metal rinsing process with controlled metal microcorrosion reduction
06/10/1998EP0846984A2 Prebaking process for facilitating removal of positive photoresist with stripping solutions
06/10/1998EP0846983A2 Reticle transfer
06/10/1998EP0846791A1 Method for growing nitride III-V compound semiconductor layers and method for fabricating a nitride III-V compound semiconductor substrate
06/10/1998EP0846790A2 Anodizing apparatus and apparatus and method associated with the same
06/10/1998EP0846786A2 Modified physoical vapor deposition chamber and method of depositing materials at low pressure
06/10/1998EP0846785A2 A method of metalizing ceramic members
06/10/1998EP0846742A2 Chemical mechanical polishing slurry useful for copper substrates
06/10/1998EP0846741A1 Polishing composition
06/10/1998EP0846740A1 Slurry compositions
06/10/1998EP0846667A2 Ceramic parts and a producing process thereof