Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1998
05/19/1998US5753945 Dielectric layer sandwiched between a perovskite ferroelectric material and other material; high crystallization temperature
05/19/1998US5753944 Layout of butting contacts of a semiconductor device
05/19/1998US5753943 Insulated gate type field effect transistor and method of manufacturing the same
05/19/1998US5753939 Light-emitting semiconductor device using a Group III nitride compound and having a contact layer upon which an electrode is formed
05/19/1998US5753934 Semiconductor single crystal substrate bearing epitaxial zirconium oxide thin film, dielectric oriented thin film of perovskite or tungsten bronze
05/19/1998US5753926 Scan type exposure apparatus and method having a reference plate with marks for image detection
05/19/1998US5753923 Ion injection device and method therefor
05/19/1998US5753922 Electromagnetic deflector
05/19/1998US5753891 Treatment apparatus
05/19/1998US5753886 Plasma treatment apparatus and method
05/19/1998US5753857 Charge coupled device (CCD) semiconductor chip package
05/19/1998US5753566 Method of spin-on-glass etchback using hot backside helium
05/19/1998US5753565 Method of reducing overetch during the formation of a semiconductor device
05/19/1998US5753563 Pressing soft adhesive layer onto wafer to remove dust
05/19/1998US5753562 Methods of forming semiconductor devices in substrates having inverted-trench isolation regions therein
05/19/1998US5753561 Method for making shallow trench isolation structure having rounded corners
05/19/1998US5753560 Method for fabricating a semiconductor device using lateral gettering
05/19/1998US5753559 Method for growing hemispherical grain silicon
05/19/1998US5753558 Method of forming a capacitor
05/19/1998US5753557 Longer leakage path decreases leakage currents and improves yields
05/19/1998US5753556 Miniaturization, reduced junction capacitance, suppression of short channel effect on threshold voltage
05/19/1998US5753555 Method for forming semiconductor device
05/19/1998US5753554 Semiconductor device and method of forming the same
05/19/1998US5753553 Method of fabricating ROMs by selectively forming sidewalls on wordlines
05/19/1998US5753552 Anisotropical selective vapor deposition
05/19/1998US5753551 Memory cell array with a self-aligned, buried bit line
05/19/1998US5753550 Semiconductor integrated circuit device having switching MISFET and capacitor element and method of producing the same, including wiring therefor and method of producing such wiring
05/19/1998US5753549 Method for fabricating capacitor of semiconductor device
05/19/1998US5753548 Forming block-out photoresist mask to eliminate the implantation of boron difluoride in p-channel field effective transistor gate electrodes during formation of self-aligned p+ source/drain regions, thus preventing void formation
05/19/1998US5753547 Polysilicon stacked capacitor with smooth top and uniform height, multistep process of coating, patterning, planarizing, and etching
05/19/1998US5753546 Method for fabricating metal oxide field effect transistors
05/19/1998US5753545 Effective constant doping in a graded compositional alloy
05/19/1998US5753544 Crystallization process and method of manufacturing thin film transistor using same
05/19/1998US5753543 Method of forming a thin film transistor
05/19/1998US5753542 Method for crystallizing semiconductor material without exposing it to air
05/19/1998US5753541 Method of fabricating polycrystalline silicon-germanium thin film transistor
05/19/1998US5753539 Method of making an integrated circuit with windowed fuse element and contact pad
05/19/1998US5753538 Method of sealing electronic parts with molded resin and mold employed therefor
05/19/1998US5753537 Photolithography, etching, and sudivision of slice into indivisual slices with package leads
05/19/1998US5753536 Semiconductor device and associated fabrication method
05/19/1998US5753535 Leadframe and resin-sealed semiconductor device
05/19/1998US5753534 Semiconductor connecting device and method for making the same
05/19/1998US5753533 Method for etching a tungsten film
05/19/1998US5753532 Method of manufacturing semiconductor chip package
05/19/1998US5753531 Method for continuously making a semiconductor device
05/19/1998US5753530 Introducing hydrogen gas to chamber to clean heated silicon surface, forming boron film thereon, heating to form boron silicide, removing boron film with nitric acid, heating to diffuse boron into silicon
05/19/1998US5753528 Method of fabricating metal-to-metal antifuse with improved diffusion barrier layer
05/19/1998US5753526 Manufacturing process of a semiconductor memory device including a trench capacitor and a surrounding gate transistor
05/19/1998US5753525 Method of making EEPROM cell with improved coupling ratio
05/19/1998US5753524 Method of forming a plateau and a cover on the plateau in particular on a semiconductor substrate
05/19/1998US5753420 Rough dielectric film by etchback of residue
05/19/1998US5753419 Increase dram node capacitance by etching rough surface
05/19/1998US5753418 0.3 Micron aperture width patterning process
05/19/1998US5753417 Photolithography
05/19/1998US5753416 Process for fabricating semiconductor integrated circuit device, and exposing system and mask inspecting method to be used in the process
05/19/1998US5753412 Photoresist having increased sensitivity and use thereof
05/19/1998US5753375 Microelectronic device having dark mirror coating with vias therethrough
05/19/1998US5753372 Wiring structures and method of manufacturing the same
05/19/1998US5753353 Doped silicon with dielectric coverings; gettering ability
05/19/1998US5753320 Process for forming deposited film
05/19/1998US5753311 Method for forming oxide layer
05/19/1998US5753305 Rapid aging technique for aerogel thin films
05/19/1998US5753303 Process for the elimination of tungsten oxidation with inert gas stabilization in chemical vapor deposition processes
05/19/1998US5753137 Dry cleaning of semiconductor processing chambers using non-metallic, carbon-comprising material
05/19/1998US5753135 Apparatus and method for recovering photoresist developers and strippers
05/19/1998US5753134 Method for producing a layer with reduced mechanical stresses
05/19/1998US5753133 Method and apparatus for etching film layers on large substrates
05/19/1998US5753132 Method of making electrostatic chuck with conformal insulator film
05/19/1998US5753090 Small size sputtering target and high vacuum sputtering apparatus using the same
05/19/1998US5753073 High selectivity nitride to oxide etch process
05/19/1998US5753070 Vacuum chuck tool for a making a plastic-package ball-grid array integrated circuit, and combination
05/19/1998US5753046 Vertical diffusion furnace and cap therefor
05/19/1998US5753044 RF plasma reactor with hybrid conductor and multi-radius dome ceiling
05/19/1998US5753040 Molecular beam epitaxial deposition of calcium fluoride and aluminum layers on silicon substrate
05/19/1998US5753039 Irradiating a nitrogen gas beam, vapor depositing, crystallizing and doping on heated object
05/19/1998US5753038 Method for the growth of industrial crystals
05/19/1998US5752985 Clean room having an air conditioning system
05/19/1998US5752875 Method of chemically-mechanically polishing an electronic component
05/19/1998US5752797 Automated chamfering apparatus and method
05/19/1998US5752796 Vacuum integrated SMIF system
05/19/1998US5752771 Integrated circuit module fixing mechanism for temperature cycling test
05/19/1998US5752685 Vacuum pencil holder with turnable wand stand
05/19/1998US5752609 Wafer boat
05/19/1998US5752532 Method for the precision cleaning and drying surfaces
05/14/1998WO1998020716A1 Electrical means for extracting layer to layer registration
05/14/1998WO1998020563A1 Power field effect transistor in sic or gan
05/14/1998WO1998020562A1 High-voltage transistor with multi-layer conduction region and method of making the same
05/14/1998WO1998020557A1 Method for reducing via inductance in an electronic assembly and device
05/14/1998WO1998020556A1 Method of increasing package reliability by designing in plane cte gradients
05/14/1998WO1998020553A1 Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
05/14/1998WO1998020552A1 Improved leadframe structure and process for packaging integrated circuits
05/14/1998WO1998020546A1 High tolerance cavities in chip packages
05/14/1998WO1998020545A1 Method for manufacturing high tolerance cavities in chip packages
05/14/1998WO1998020543A2 Method for making a thin film on a support and resulting structure
05/14/1998WO1998020542A1 Electronic parts device
05/14/1998WO1998020541A1 Method for forming bump and semiconductor device
05/14/1998WO1998020540A1 Method and apparatus for improving wireability in chip modules
05/14/1998WO1998020539A1 Method for preparing vias for subsequent metallization
05/14/1998WO1998020538A1 Multiple pulse space processing to enhance via entrance formation at 355 nm
05/14/1998WO1998020537A1 Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation