Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/1998
05/14/1998WO1998020536A1 Method for using ultrasonic treatment in combination with uv-lasers to enable plating of high aspect ratio micro-vias
05/14/1998WO1998020535A2 Multiple frequency processing to minimize manufacturing variability of high aspect ratio micro through-vias
05/14/1998WO1998020534A1 Method for using fiducial schemes to increase nominal registration
05/14/1998WO1998020533A2 Method for using photoabsorptive coatings to enhance both blind and through micro-via entrance quality
05/14/1998WO1998020532A1 Method and apparatus for coining solder balls on an electrical circuit package
05/14/1998WO1998020531A2 Method for forming a through-via in a laminated substrate
05/14/1998WO1998020530A1 Method to correct astigmatism of fourth yag to enable formation of sub 25 micron micro-vias using masking techniques
05/14/1998WO1998020529A1 Method for minimizing pink ring in blind laser vias
05/14/1998WO1998020528A1 METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE
05/14/1998WO1998020526A1 Dry etching gas
05/14/1998WO1998020525A1 Suppression of transient enhanced diffusion in ion implanted silicon
05/14/1998WO1998020524A1 Forming a crystalline semiconductor film on a glass substrate
05/14/1998WO1998020522A1 Substrate treatment device
05/14/1998WO1998020521A1 Device for producing oxidic thin films
05/14/1998WO1998020517A1 Micromachining using high energy light ions
05/14/1998WO1998020496A1 Spin dependent tunneling memory
05/14/1998WO1998019964A1 Method for the synthesis of group iii nitride crystals
05/14/1998WO1998019863A1 Method and apparatus for aligning and laminating substrates to stiffeners in electrical circuits
05/14/1998WO1998019827A1 Wet etch for silicon carbide
05/14/1998DE19739073A1 Forming electrode coupling metal bumps on electronic device
05/14/1998DE19736685A1 Bonding appliance for chip and lead frame
05/14/1998DE19736210A1 Microelectronic component esp. semiconductor memory component
05/14/1998DE19728461A1 Distortion resistant lead frame for semiconductor chip
05/14/1998DE19726590A1 FET with active layers forming heterojunction structure
05/14/1998DE19723918A1 Semiconductor workpiece cleaning apparatus
05/14/1998DE19723636A1 FET chip of reduced area and high output power
05/14/1998DE19719156A1 Transistor structure especially of access transistor
05/14/1998DE19718394A1 Thin film transistor with self-aligned offset region
05/14/1998DE19717880A1 Semiconductor device isolation region production
05/14/1998DE19710471A1 Test instrument for evaluating reliability of connecting wires in semiconductors
05/14/1998DE19646693A1 Microelectronic component esp. semiconductor memory component
05/14/1998DE19646691A1 Leadframe element mfr. for electronic component
05/14/1998DE19646476A1 Structure forming thermal connection for several components
05/14/1998DE19646369A1 Manufacturing ceramic multilayer circuit of green ceramic foils
05/14/1998DE19646273A1 Silicon wafer etching process
05/14/1998DE19643904C1 DRAM capacitor structure with ribbed via
05/14/1998CA2271117A1 Method for the synthesis of group iii nitride crystals
05/14/1998CA2269539A1 Spin dependent tunneling memory
05/13/1998EP0841840A1 Method for the manufacture of micro solder bumps on copper pads
05/13/1998EP0841838A1 Plasma treatment apparatus and plasma treatment method
05/13/1998EP0841705A2 Bipolar transistor and a method of manufacturing the same
05/13/1998EP0841704A1 Semiconductor transistor device and method of manufacturing the same
05/13/1998EP0841703A2 Ultrafine particle structure and production method thereof
05/13/1998EP0841701A1 Component characteristics measurement circuit in an integrated semiconductor circuit system
05/13/1998EP0841700A2 Semiconductor integrated circuit assembly with custom circuit mounted on standard IC
05/13/1998EP0841698A2 Wafer level contact sheet and method of assembly
05/13/1998EP0841697A2 Method of using a permanent z-axis material
05/13/1998EP0841695A2 High planarity, low CTE base and method of making the same
05/13/1998EP0841694A1 Semiconductor package with multilayered circuit and semiconductor device
05/13/1998EP0841693A1 An erasable programmable read only memory and method of manufacture thereof
05/13/1998EP0841692A2 Apparatus and method for optical evaluation of a semiconductor device
05/13/1998EP0841691A1 Field effect transistor and fabrication process thereof
05/13/1998EP0841690A1 Tungsten nitride (WNx) layer manufacturing method and metal wiring manufacturing method
05/13/1998EP0841689A2 Method of processing semiconductor substrate
05/13/1998EP0841688A2 Processing apparatus
05/13/1998EP0841683A2 Active shield for generating a plasma for sputtering
05/13/1998EP0841667A2 Flash-erasable semiconductor memory device having an improved reliability
05/13/1998EP0841593A1 Method and apparatus for depositing a photoresist layer on a substrate
05/13/1998EP0841573A2 Method and apparatus for performing testing of double-sided ball grid array device
05/13/1998EP0841572A2 Wafer-level burn-in system
05/13/1998EP0841571A2 Wafer level burn-in base unit substrate and assembly
05/13/1998EP0841568A2 A method of wafer level burn-in
05/13/1998EP0841561A2 Method for the production of a sensor with a metal electrode in a MOS device
05/13/1998EP0841123A1 A carrier head with a flexible membrane for a chemical mechanical polishing system
05/13/1998EP0841122A1 Endpoint detector for a chemical mechanical polishing system
05/13/1998EP0841102A1 Turning-over machine and polishing apparatus
05/13/1998EP0840942A1 GaAs SUBSTRATE WITH COMPOSITIONALLY GRADED AlGaAsSb BUFFER FOR FABRICATION OF HIGH-INDIUM FETS
05/13/1998EP0840941A2 Method of and apparatus for controlling reactive impedances of a matching network connected between an rf source and an rf plasma processor
05/13/1998EP0840930A1 Programmable non-volatile bidirectional switch for programmable logic
05/13/1998EP0840900A1 Optical structure and method for its production
05/13/1998EP0840811A2 System and method for thermal processing of a semiconductor substrate
05/13/1998EP0840664A1 Compositions for polishing silicon wafers and methods
05/13/1998EP0840660A1 Fluxless contacting of components
05/13/1998EP0826244A4 Lateral field effect transistor having reduced drain-to-source on-resistance
05/13/1998EP0794821B1 Process and device for transforming a liquid stream into a gas stream
05/13/1998EP0619935B1 Multi-layer circuit construction methods and structures with customization features and components for use therein
05/13/1998EP0606350B1 Gallium arsenide mesfet imager
05/13/1998EP0597103B1 Apparatus for neutralizing charged body
05/13/1998CN1181843A Emitter ballast bypass for radio frequency power transistors
05/13/1998CN1181842A Bipolar silicon-on-insulator transistor with increased breakdown voltage
05/13/1998CN1181841A Solder bump fabrication methods and structure including a titanium barrier layer
05/13/1998CN1181840A Bottom electrode structure for dielectric capacitors and method of making the same
05/13/1998CN1181787A Modification of surfaces of polymers, metal or ceramic
05/13/1998CN1181658A Semiconductor device
05/13/1998CN1181644A Input pad having enable terminal employed in low-current-consuming integrated circuit
05/13/1998CN1181636A Gan Compound semiconductor element and manufacturing method therefor
05/13/1998CN1181635A Quantum wires formed on substrate, manufacturing method thereof, and device having quantum wires on substrate
05/13/1998CN1181632A Dynamic memory
05/13/1998CN1181631A 功率晶体管 Power Transistors
05/13/1998CN1181629A Semiconductor chip-mounting board and mounting method for semiconductor chip
05/13/1998CN1181628A Method for manufacturing semiconductor memory device having self-aligned contact
05/13/1998CN1181627A Method for making semiconductor device and semiconductor device
05/13/1998CN1181626A Method for making integrated circuit
05/13/1998CN1181625A Method for making alignment mark with high staging
05/13/1998CN1181624A Pre-bond cavity air bridge
05/13/1998CN1181623A Method for forming isolation layer of semiconductor device
05/13/1998CN1181622A Method of forming well of semiconductor device
05/13/1998CN1181621A Semiconductor wafer carrier featuring effective reduction of airborne particles attaching to wafers
05/13/1998CN1181620A Method for wire bonding
05/13/1998CN1181619A Flip chip attach on flexible circuit carrier using chip with metallic cap on solder
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