Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/1998
07/01/1998EP0851496A2 A memory cell array
07/01/1998EP0851495A1 N-Channel MOS transistor with NO LDD junction and corresponding manufacturing method
07/01/1998EP0851494A2 Semiconductor device having a protection circuit
07/01/1998EP0851493A1 Contact structure and corresponding manufacturing method for EPROM or flash EPROM semiconductor electronic devices
07/01/1998EP0851491A2 Semiconductor device having multilevel interconnection structure and manufacturing method thereof
07/01/1998EP0851490A2 Semiconductor device and process for production thereof
07/01/1998EP0851488A1 Bipolar transistor with dielectric isolation
07/01/1998EP0851487A1 Antimony-phosphor buried layer for a MOs FET or like semiconductor device, and method of fabrication
07/01/1998EP0851486A1 A process for manufacturing a semiconductor device
07/01/1998EP0851485A1 Self-aligned etching process to realize word lines of semiconductor integrated memory devices
07/01/1998EP0851484A1 Self-aligned etching process to realize word lines of semiconductor integrated memory devices
07/01/1998EP0851483A2 Fully planarized dual damascene metallization using copper line interconnect and selective CVD aluminium plug
07/01/1998EP0851482A2 In-situ capped aluminium plug (cap) process using selective CVD al for integrated plug/interconnect metallization
07/01/1998EP0851481A2 Method of making an encapsulated metal lead for multi-level interconnect
07/01/1998EP0851480A2 Stress-adjusted insulating film forming method, semiconductor device and method of manufacturing the same
07/01/1998EP0851479A1 Process for deposing a multiple dielectric structure for enhancing the planarity of semiconductor electronic devices
07/01/1998EP0851478A2 Method of forming oxide isolation regions
07/01/1998EP0851476A2 Double mask hermetic passivation method providing enhanced resistance to moisture
07/01/1998EP0851475A2 Method of manufacturing an MOS controlled power semiconductor device
07/01/1998EP0851474A2 Improvements in or relating to integrated circuits
07/01/1998EP0851473A2 Method of making a layer with high dielectric K, gate and capacitor insulator layer and device
07/01/1998EP0851472A2 Method for etching oxide during the fabrication of an integrated circuit
07/01/1998EP0851471A2 Semiconductor device with two insulators of different dielectric constant and fabrication process thereof
07/01/1998EP0851470A1 Process for deposing a stratified dielectric for enhancing the planarity of semiconductor electronic devices
07/01/1998EP0851469A2 Semiconductor device having a tapered implanted region and method of fabrication using spin-on glass
07/01/1998EP0851468A2 Method of making integrated circuit with twin tub
07/01/1998EP0851467A2 Method and system for monocrystalline epitaxial deposition
07/01/1998EP0851465A1 Method of separation of at least two elements joined by ion implantation
07/01/1998EP0851464A1 Anti-reflective treatment of reflecting surfaces
07/01/1998EP0851463A1 Process for realizing an intermediate dielectric layer for enhancing the planarity in semiconductor electronic devices
07/01/1998EP0851453A1 Endcap for indirectly heated cathode of ion source
07/01/1998EP0851433A2 Semiconductor ROM
07/01/1998EP0851431A2 Non-volatile memory and method for operating the same
07/01/1998EP0851426A2 Memory block for realizing semiconductor memory devices and corresponding manufacturing process
07/01/1998EP0851371A2 Method of positioning semiconductor integrated circuit device and apparatus of carrying out the method
07/01/1998EP0851329A2 Integrated circuit for control device
07/01/1998EP0851305A1 Rinsing and stripping process for lithography
07/01/1998EP0851303A2 Moving interferometer wafer stage
07/01/1998EP0851302A1 Coating apparatus
07/01/1998EP0851298A1 Radiation sensitive composition adapted for roller coating
07/01/1998EP0851297A1 Radiation-sensitive composition adapted for roller coating
07/01/1998EP0851042A2 Crucible of pyrolytic boron nitride for molecular beam epitaxy
07/01/1998EP0851040A1 Surface treatment apparatus using gas jet
07/01/1998EP0850737A2 Multistep method of manufacturing semiconductor wafers
07/01/1998EP0850726A1 Method and apparatus automatically changing a polishing pad in a chemical mechanical polishing system
07/01/1998EP0850725A2 Platen coating structure for chemical mechanical polishing and method
07/01/1998EP0850723A1 Wafer holding jig
07/01/1998EP0850490A1 Process and device for testing a chip
07/01/1998EP0850489A1 Solder deposit support
07/01/1998EP0850484A1 A polysilicon resistor and a method of manufacturing it
07/01/1998EP0719299A4 Adhesive paste containing polymeric resin
07/01/1998EP0717749A4 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
07/01/1998EP0656031B1 Polymeric substrate with polymeric microelements
07/01/1998EP0515577B1 Making and testing an integrated circuit using high density probe points
07/01/1998CN1186588A Ground plane routing
07/01/1998CN1186570A Flexible leads for tape ball grid array circuit
07/01/1998CN1186479A Point-of-use ammonia purification for electronic component manufacture
07/01/1998CN1186347A Photovoltaic element and method of and apparatus for manufacturing the same
07/01/1998CN1186346A Semiconductor device and manufacturing method thereof
07/01/1998CN1186345A Semiconductor device having field isolating film of which upper surface is flat and method thereof
07/01/1998CN1186344A 半导体装置 Semiconductor device
07/01/1998CN1186343A Semiconductor device and manufacture thereof
07/01/1998CN1186342A Semiconductor device having protection circuit
07/01/1998CN1186341A Semiconductor device
07/01/1998CN1186339A Lead frame with pre-mold paddle for semiconductor chip package
07/01/1998CN1186338A Stacking type semiconductor chip package
07/01/1998CN1186337A Method of fabricating semiconductor device
07/01/1998CN1186336A Manufacture of semiconductor device
07/01/1998CN1186335A Method for manufacturing semiconductor device
07/01/1998CN1186334A Method of fabricating semiconductor device having dual-gate
07/01/1998CN1186333A Method of fabricating semiconductor device having trench isolation structure
07/01/1998CN1186332A Semiconductor wafer serving as master-slice with built-in additional current drivers for semi-custom-made integrated circuit device
07/01/1998CN1186331A Method for production of MOS-controlled power semiconductor component
07/01/1998CN1186330A Method for annealing film electroluminescent component
07/01/1998CN1186329A Wafer wet treating apparatus
07/01/1998CN1186328A Electron beam exposure of subpatterns of pattern
07/01/1998CN1186327A Method of making semiconductor device
07/01/1998CN1186326A Manufacture of crystal semiconductor
07/01/1998CN1186280A Method of laying out interconnections
07/01/1998CN1186143A Water purifier for drinking water
07/01/1998CN1186128A Dual vertical thermal processing furance
07/01/1998CN1186010A Chemical mechanical polishing method and apparatus thereof
07/01/1998CN1186009A Soft solder and electronic component using the same
07/01/1998CN1038968C 高压截断半导体器件 High-voltage cut-off semiconductor devices
07/01/1998CN1038964C Contact structure of semiconductor device and method for forming the same
07/01/1998CN1038948C Process and apparatus for plasma CVD coating or handle substrates
06/1998
06/30/1998US5774696 Triangle and tetrahedron mesh generation method
06/30/1998US5774646 Method for detecting faulty elements of a redundancy semiconductor memory
06/30/1998US5774575 Inspection apparatus, and exposure apparatus and device manufacturing method using the inspection apparatus
06/30/1998US5774398 Non-volatile semiconductor memory having a memory cell array divided into memory cell groups
06/30/1998US5774367 Computer implemented method
06/30/1998US5774327 High dielectric capacitors
06/30/1998US5774205 Exposure and method which tests optical characteristics of optical elements in a projection lens system prior to exposure
06/30/1998US5774007 Clock distributing apparatus having V/I and I/V converters
06/30/1998US5773989 Measurement of the mobile ion concentration in the oxide layer of a semiconductor wafer
06/30/1998US5773953 Substrate transfer system
06/30/1998US5773951 Wafer prober having sub-micron alignment accuracy
06/30/1998US5773917 Using a piezolelectric substrate made of aluminum and copper alloy
06/30/1998US5773899 Bonding pad for a semiconductor chip
06/30/1998US5773898 Hybrid integrated circuit with a spacer between the radiator plate and loading portion of the IC
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