Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1998
06/30/1998US5772906 Mechanism for uniform etching by minimizing effects of etch rate loading
06/30/1998US5772902 Method to prevent adhesion of micromechanical structures
06/30/1998US5772842 Apparatus for stripping pellicle
06/30/1998US5772838 Apparatus and method for making laminated electrical or electronic devices from a continuous tape coated on one side with ceramic material
06/30/1998US5772833 Plasma etching apparatus
06/30/1998US5772832 Fluorine scavenger ring
06/30/1998US5772817 Evaporation of solvent adhesive
06/30/1998US5772815 Method for making laminated integrated circuit devices
06/30/1998US5772784 Ultra-low particle semiconductor cleaner
06/30/1998US5772780 Using slurry of cerium oxide particles; for semiconductors
06/30/1998US5772773 Co-axial motorized wafer lift
06/30/1998US5772772 Plasma diffusion control apparatus
06/30/1998US5772771 Deposition chamber for improved deposition thickness uniformity
06/30/1998US5772769 Apparatus for coating a workpiece with fluid contamination detection
06/30/1998US5772764 Coating apparatus
06/30/1998US5772757 Molecular beam epitaxy
06/30/1998US5772700 Location guide bar which accommodates multiple size cassettes for use in a loader and unloader indexer
06/30/1998US5772451 Sockets for electronic components and methods of connecting to electronic components
06/30/1998US5772387 Device transfer apparatus and device reinspection method for IC handler
06/30/1998US5772386 Loading and unloading station for semiconductor processing installations
06/30/1998US5772325 Apparatus for providing surface images and method for making the apparatus
06/30/1998US5772106 Printhead for liquid metals and method of use
06/30/1998US5772040 Workpiece conveying apparatus used with workpiece inspection device
06/30/1998US5772038 Parts transporting tray
06/30/1998US5771966 For dissipating heat from a heat emitting component
06/30/1998US5771713 Cryogenic rectification system for recovery of fluorine compounds
06/30/1998US5771556 Acoustic wave device and manufacturing method
06/30/1998US5771555 Method for producing an electronic component using direct bonding
06/25/1998WO1998027646A1 Method of and apparatus for matching a load to a source
06/25/1998WO1998027596A1 High density electrical connectors
06/25/1998WO1998027595A1 A silicide agglomeration fuse device with notches to enhance programmability
06/25/1998WO1998027594A1 Memory cell arrangement and process for manufacturing the same
06/25/1998WO1998027593A1 Arrangement for controlling parallel lines in a storage cell arrangement
06/25/1998WO1998027590A1 Bumps in grooves for elastic positioning
06/25/1998WO1998027589A1 Flip-chip type connection with elastic contacts
06/25/1998WO1998027588A1 A via structure
06/25/1998WO1998027586A1 Method for manufacturing a memory cell configuration
06/25/1998WO1998027585A1 Electroplated interconnection structures on integrated circuit chips
06/25/1998WO1998027584A1 Method of fabricating a vertical field effect transistor
06/25/1998WO1998027583A1 Electronic devices and their manufacture
06/25/1998WO1998027582A1 Mis transistor with self-aligned metal grid and method for making it
06/25/1998WO1998027581A1 Methods for reducing plasma-induced charging damage
06/25/1998WO1998027580A1 Process for forming ultrathin oxynitride layers and thin layer devices containing ultrathin oxynitride layers
06/25/1998WO1998027579A1 Etchants
06/25/1998WO1998027578A1 Very long and highly stable atomic wires, method for making these wires, application in nano-electronics
06/25/1998WO1998027577A1 Wafer electrical discharge control by wafer lifter system
06/25/1998WO1998027576A2 Power management system for a semiconductor processing facility
06/25/1998WO1998027450A1 Short wavelength pulsed laser scanner
06/25/1998WO1998027277A1 Papermakers felts
06/25/1998WO1998027177A1 Die attach adhesive compositions
06/25/1998WO1998027161A1 Thermosetting encapsulants for electronics packaging
06/25/1998WO1998027160A1 Thermally reworkable binders for flip-chip devices
06/25/1998WO1998027005A1 Device and method for the storage, transportation and production of active fluorine
06/25/1998WO1998021780A3 A connection between two contacts and a process for producing such a connection
06/25/1998DE19757878A1 DRAM-Speicherzellengruppierung DRAM memory cell array
06/25/1998DE19756801A1 Pressure sensitive adhesive sheet for dicing objects, e.g. semiconductor wafers
06/25/1998DE19756227A1 Verfahren zum Bilden von Metall-Leitungen einer Halbleitervorrichtung A method for forming metal lines of a semiconductor device
06/25/1998DE19755675A1 Semiconductor housing with structure containing conductor parts for integrated circuit mfr.
06/25/1998DE19729600A1 Pattern comparison monitoring system using grey value raster, e.g. for electron beam lithography mask
06/25/1998DE19715501C1 Method for structuring thin metal layers.
06/25/1998DE19711702C1 Semiconductor substrate wafer processing apparatus e.g. for rapid thermal processing
06/25/1998DE19654980A1 Production of ceramic fibres based on PMN or PMNT
06/25/1998CA2275632A1 High density electrical connectors
06/25/1998CA2275523A1 Flip-chip type connection with elastic contacts
06/25/1998CA2275521A1 Bumps in grooves for elastic positioning
06/25/1998CA2275435A1 A via structure
06/25/1998CA2275366A1 Thermally reworkable binders for flip-chip devices
06/25/1998CA2275194A1 Die attach adhesive compositions
06/25/1998CA2274864A1 Thermosetting encapsulants for electronics packaging
06/25/1998CA2244712A1 Short wavelength pulsed laser scanner
06/24/1998EP0849983A1 Process to create metallic stand-offs on a circuit board
06/24/1998EP0849878A2 Improvements in or relating to integrated circuits
06/24/1998EP0849811A2 Apparatus for forming non-single-crystal semiconductor thin film, method for forming non-single-crystal semiconductor thin film, and method for producing photovoltaic device
06/24/1998EP0849807A1 Schottky diode
06/24/1998EP0849806A2 Improvements in or relating to semiconductor devices having tungsten nitride sidewalls
06/24/1998EP0849805A1 MOS type semiconductor device
06/24/1998EP0849804A2 Improvements in or relating to field effect transistors
06/24/1998EP0849803A2 Improvements in or relating to field effect transistors
06/24/1998EP0849801A2 Semiconductor device having NMOS and PMOS transistors on common substrate and method of fabricating the same
06/24/1998EP0849798A1 Photoconductive detector
06/24/1998EP0849797A2 Improvements in or relating to intergrated circuits
06/24/1998EP0849796A2 Improvements in or relating to integrated circuits
06/24/1998EP0849795A2 Adhesive promotion of TAB/FLEX tape in a laminar electronic package contruction
06/24/1998EP0849792A1 BiCMOS process with capacitor
06/24/1998EP0849791A1 Improvements in or relating to electronic devices
06/24/1998EP0849790A1 Non-volatile semiconductor memory cell with peripheral transistors
06/24/1998EP0849789A2 Method of etching a multilayer IC dielectric structure
06/24/1998EP0849788A2 Process for producing semiconductor article by making use of a substrate having a porous semiconductor layer
06/24/1998EP0849787A1 Method for fabricating an integrated circuit
06/24/1998EP0849786A2 Bonding pad structure for testing integrated circuits during manufacture
06/24/1998EP0849785A2 Method of making a self-aligned contact
06/24/1998EP0849784A2 A system for connecting a semiconductor device to a leadframe and a bonding support mechanism for a leadframe
06/24/1998EP0849783A2 Directionally deposited silicide on transistor electrodes and method for same
06/24/1998EP0849782A1 A mos transistor
06/24/1998EP0849781A1 Method for forming a rough polysilicon structure for a semiconductor memory device
06/24/1998EP0849780A2 Method for manufacturing ferroelectric thin film, substrate covered with ferroelectric thin film, and capacitor
06/24/1998EP0849779A2 Process for forming a semiconductor structure comprising ion cleaning and depositing steps and integrated cluster tool for performiong the process
06/24/1998EP0849778A2 Improvements in or relating to wafer polishing
06/24/1998EP0849777A2 Method of manufacturing a gate electrode
06/24/1998EP0849776A2 A method of manufacturing an insulated-gate field effect transistor
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