Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1998
06/02/1998US5759881 Low cost well process
06/02/1998US5759880 Resistless methods of fabricating FETs
06/02/1998US5759879 Method for forming polycrystalline silicon film and method for fabricating thin-film transistor
06/02/1998US5759878 Method of fabricating semiconductor device having epitaxially grown semiconductor single crystal film
06/02/1998US5759876 Method of making an antifuse structure using a metal cap layer
06/02/1998US5759874 Method for producing semiconductor element and adhesive sheet for adhering wafer
06/02/1998US5759873 Method of manufacturing chip-size package-type semiconductor device
06/02/1998US5759869 Second oxide layer is formed in bottom of contact opening; insulating layer is reflowed to form rounded contact corners
06/02/1998US5759868 Fabricating a semiconductor device
06/02/1998US5759867 Method of making a disposable corner etch stop-spacer for borderless contacts
06/02/1998US5759755 Semiconductor substrate containing anti-reflective layer
06/02/1998US5759751 Method of peeling photo-resist layer without damage to metal wiring
06/02/1998US5759750 Blend of water insoluble binder and compound which forms strong acid upon exposure to radiation
06/02/1998US5759748 Method for forming photoresist pattern
06/02/1998US5759747 Method of manufacturing a semiconductor device
06/02/1998US5759746 Fabrication process using a thin resist
06/02/1998US5759740 Oxime sulfonate
06/02/1998US5759737 Multilayer elements with carriers, bonding and applying photoresist patterns, exposure to radiation, screening and connecting pads, development and removal of photoresists
06/02/1998US5759722 Electron beam aperture structure and method for fabricating the same
06/02/1998US5759646 Vessel of pyrolytic boron nitride
06/02/1998US5759638 Process for forming electronic circuit
06/02/1998US5759635 Method for depositing substituted fluorocarbon polymeric layers
06/02/1998US5759616 Integrated circuit
06/02/1998US5759437 Etching of Ti-W for C4 rework
06/02/1998US5759426 Heat treatment jig for semiconductor wafers and a method for treating a surface of the same
06/02/1998US5759423 Electron beam writing method and apparatus for carrying out the same
06/02/1998US5759360 Wafer clean sputtering process
06/02/1998US5759344 Wafer slicer base peeling system
06/02/1998US5759336 Resist removing apparatus
06/02/1998US5759335 Photoresist removing apparatus
06/02/1998US5759334 Plasma processing apparatus
06/02/1998US5759331 Forming holes using a laser beam on a ceramic layer made by depositing and drying a slurry on a plastic carrier tape, there being two adjoining holes of differing diameters
06/02/1998US5759320 Placing thick, flat, elastic pads on ceramic green sheets then pressing to reinforce cavities removal of pads
06/02/1998US5759292 Solar cell
06/02/1998US5759287 Method of purging and passivating a semiconductor processing chamber
06/02/1998US5759285 Method and solution for cleaning solder connections of electronic components
06/02/1998US5759273 Cross-section sample staining tool
06/02/1998US5759269 Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture
06/02/1998US5759267 Liquid phase epitaxial
06/02/1998US5759266 Method for growing a CdTe layer on a Si substrate by a molecular beam epitaxy
06/02/1998US5759265 Forming a buffer layer having crystal orientation (111) and random in-plane directions on a single crystal semiconductor substrate, forming a ferrolectric thin film having molecular orientation in one of(111) and (0001) faces on buffer layer
06/02/1998US5759264 Method for vapor-phase growth
06/02/1998US5759262 Controlled seeding
06/02/1998US5759214 Nitrogen gas supply system
06/02/1998US5759087 Method for inducing damage for gettering to single crystal silicon wafer
06/02/1998US5759007 Notch finder and combination wafer transfer machine
06/02/1998US5759006 Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith
06/02/1998US5758830 Onto a semiconductor device
06/02/1998US5758776 Integrated circuit tray with flexural bearings
06/02/1998US5758537 Method and apparatus for mounting, inspecting and adjusting probe card needles
06/02/1998US5758418 Method of making an ultra high-density, high-performance heat sink
06/02/1998US5758413 Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias
06/02/1998US5758409 Conductive ball-placing apparatus
05/1998
05/28/1998WO1998022983A1 Semiconductor device and process for manufacturing the same
05/28/1998WO1998022981A1 Semiconductor integrated circuit with inductor
05/28/1998WO1998022980A1 Semiconductor device and process for manufacturing the same
05/28/1998WO1998022979A1 Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures
05/28/1998WO1998022978A1 Method of preparing silicon carbide wafers for epitaxial growth
05/28/1998WO1998022977A1 Plasma treating device
05/28/1998WO1998022976A1 Abrading method for semiconductor device
05/28/1998WO1998022896A1 Computer assisted method of partitioning an electrical circuit
05/28/1998WO1998022635A1 Method and apparatus for directional deposition of thin films using laser ablation
05/28/1998WO1998022568A1 Stripping formulation including catechol, hydroxylamine, non-alkanolamine, water for post plasma ashed wafer cleaning
05/28/1998WO1998022541A2 Method for coating substrates
05/28/1998WO1998022270A1 Template type cavity-formation device for low temperature cofired ceramic (ltcc) sheets
05/28/1998WO1998022230A1 Spinning device and spinning method
05/28/1998DE19752412A1 Process for joining solid bodies e.g. for microelectronic components
05/28/1998DE19751785A1 Filling recesses in a surface layer of a semiconductor wafer with conductive material
05/28/1998DE19751784A1 Verfahren zum Herstellen einer Barriereschicht A method for forming a barrier layer
05/28/1998DE19751745A1 Gateisolierschicht mit diamantähnlichem Kohlenstoff und Dünnfilmtransistor, der diese verwendet, und einen Prozeß zum Herstellen der Gateisolierschicht und des Dünnfilmtransistors Gate insulating film with diamond-like carbon, and thin film transistor using the same, and a process for producing the gate insulating layer and the thin film transistor
05/28/1998DE19749348A1 Muffle for installation for chemical precipitation from gas phase
05/28/1998DE19736787A1 Silicide interconnect structure formation
05/28/1998DE19729420A1 Semiconducting component
05/28/1998DE19728171A1 Semiconductor for evaluation of defects to isolation edge
05/28/1998DE19710491A1 Self-aligned process for semiconductor memory production
05/28/1998DE19648866A1 Method of manufacturing micromechnical components and assemblies
05/28/1998DE19648759A1 Method of manufacturing microstructures
05/28/1998DE19648501A1 Method for removable connection and finally separation of reversibly bonded and polished plates
05/28/1998CA2222343A1 Anodizing apparatus and apparatus and method associated with the same
05/27/1998EP0844737A2 Input buffer circuit and bidirectional buffer circuit for plural voltage systems
05/27/1998EP0844675A2 Light-emitting gallium nitride-based compound semiconductor device
05/27/1998EP0844671A1 Semiconductor element and semiconductor memory device using the same
05/27/1998EP0844670A1 Method for manufacturing thin film transistor, liquid crystal display and electronic device both produced by the method
05/27/1998EP0844668A2 MOS structure of semiconductor device and method of manufacturing the same
05/27/1998EP0844667A2 Storage capacitor for DRAM memory cell and the process of fabricating the same
05/27/1998EP0844664A2 A bond pad for an integrated circuit
05/27/1998EP0844663A1 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them
05/27/1998EP0844662A1 An EPROM cell array
05/27/1998EP0844661A1 A process for the production of silicon gate CMOS transistors, and resultant product
05/27/1998EP0844660A1 Semiconductor device and method of manufacturing the same
05/27/1998EP0844659A2 Puncture resistant electrostatic chuck
05/27/1998EP0844658A2 Integrated circuit, method of fabrication and evaluation of the same
05/27/1998EP0844657A1 Method for mounting semiconductor chip
05/27/1998EP0844656A1 Electronic component structure
05/27/1998EP0844655A2 An integrated circuit chip packaging method
05/27/1998EP0844654A2 Heat treatment method for a silicon wafer and a silicon wafer heat-treated by the method
05/27/1998EP0844653A2 Method for reducing surface layer defects in semiconductor materials having a volatile species
05/27/1998EP0844652A1 Integratable capacitor, its fabrication method and memory array utilizing the capacitor
05/27/1998EP0844651A1 Method of controlling oxidation in multilayer semiconductor structure comprising Group III elements
05/27/1998EP0844650A2 Method of etching SiO2 and process of cleaning silicon wafers using dilute chemical etchants and a megasonic field