Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/02/1998 | US5759881 Low cost well process |
06/02/1998 | US5759880 Resistless methods of fabricating FETs |
06/02/1998 | US5759879 Method for forming polycrystalline silicon film and method for fabricating thin-film transistor |
06/02/1998 | US5759878 Method of fabricating semiconductor device having epitaxially grown semiconductor single crystal film |
06/02/1998 | US5759876 Method of making an antifuse structure using a metal cap layer |
06/02/1998 | US5759874 Method for producing semiconductor element and adhesive sheet for adhering wafer |
06/02/1998 | US5759873 Method of manufacturing chip-size package-type semiconductor device |
06/02/1998 | US5759869 Second oxide layer is formed in bottom of contact opening; insulating layer is reflowed to form rounded contact corners |
06/02/1998 | US5759868 Fabricating a semiconductor device |
06/02/1998 | US5759867 Method of making a disposable corner etch stop-spacer for borderless contacts |
06/02/1998 | US5759755 Semiconductor substrate containing anti-reflective layer |
06/02/1998 | US5759751 Method of peeling photo-resist layer without damage to metal wiring |
06/02/1998 | US5759750 Blend of water insoluble binder and compound which forms strong acid upon exposure to radiation |
06/02/1998 | US5759748 Method for forming photoresist pattern |
06/02/1998 | US5759747 Method of manufacturing a semiconductor device |
06/02/1998 | US5759746 Fabrication process using a thin resist |
06/02/1998 | US5759740 Oxime sulfonate |
06/02/1998 | US5759737 Multilayer elements with carriers, bonding and applying photoresist patterns, exposure to radiation, screening and connecting pads, development and removal of photoresists |
06/02/1998 | US5759722 Electron beam aperture structure and method for fabricating the same |
06/02/1998 | US5759646 Vessel of pyrolytic boron nitride |
06/02/1998 | US5759638 Process for forming electronic circuit |
06/02/1998 | US5759635 Method for depositing substituted fluorocarbon polymeric layers |
06/02/1998 | US5759616 Integrated circuit |
06/02/1998 | US5759437 Etching of Ti-W for C4 rework |
06/02/1998 | US5759426 Heat treatment jig for semiconductor wafers and a method for treating a surface of the same |
06/02/1998 | US5759423 Electron beam writing method and apparatus for carrying out the same |
06/02/1998 | US5759360 Wafer clean sputtering process |
06/02/1998 | US5759344 Wafer slicer base peeling system |
06/02/1998 | US5759336 Resist removing apparatus |
06/02/1998 | US5759335 Photoresist removing apparatus |
06/02/1998 | US5759334 Plasma processing apparatus |
06/02/1998 | US5759331 Forming holes using a laser beam on a ceramic layer made by depositing and drying a slurry on a plastic carrier tape, there being two adjoining holes of differing diameters |
06/02/1998 | US5759320 Placing thick, flat, elastic pads on ceramic green sheets then pressing to reinforce cavities removal of pads |
06/02/1998 | US5759292 Solar cell |
06/02/1998 | US5759287 Method of purging and passivating a semiconductor processing chamber |
06/02/1998 | US5759285 Method and solution for cleaning solder connections of electronic components |
06/02/1998 | US5759273 Cross-section sample staining tool |
06/02/1998 | US5759269 Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture |
06/02/1998 | US5759267 Liquid phase epitaxial |
06/02/1998 | US5759266 Method for growing a CdTe layer on a Si substrate by a molecular beam epitaxy |
06/02/1998 | US5759265 Forming a buffer layer having crystal orientation (111) and random in-plane directions on a single crystal semiconductor substrate, forming a ferrolectric thin film having molecular orientation in one of(111) and (0001) faces on buffer layer |
06/02/1998 | US5759264 Method for vapor-phase growth |
06/02/1998 | US5759262 Controlled seeding |
06/02/1998 | US5759214 Nitrogen gas supply system |
06/02/1998 | US5759087 Method for inducing damage for gettering to single crystal silicon wafer |
06/02/1998 | US5759007 Notch finder and combination wafer transfer machine |
06/02/1998 | US5759006 Semiconductor wafer loading and unloading apparatus, and semiconductor wafer transport containers for use therewith |
06/02/1998 | US5758830 Onto a semiconductor device |
06/02/1998 | US5758776 Integrated circuit tray with flexural bearings |
06/02/1998 | US5758537 Method and apparatus for mounting, inspecting and adjusting probe card needles |
06/02/1998 | US5758418 Method of making an ultra high-density, high-performance heat sink |
06/02/1998 | US5758413 Method of manufacturing a multiple layer circuit board die carrier with fine dimension stacked vias |
06/02/1998 | US5758409 Conductive ball-placing apparatus |
05/28/1998 | WO1998022983A1 Semiconductor device and process for manufacturing the same |
05/28/1998 | WO1998022981A1 Semiconductor integrated circuit with inductor |
05/28/1998 | WO1998022980A1 Semiconductor device and process for manufacturing the same |
05/28/1998 | WO1998022979A1 Methods for forming an intermetallic region between a solder bump and an under bump metallurgy layer and related structures |
05/28/1998 | WO1998022978A1 Method of preparing silicon carbide wafers for epitaxial growth |
05/28/1998 | WO1998022977A1 Plasma treating device |
05/28/1998 | WO1998022976A1 Abrading method for semiconductor device |
05/28/1998 | WO1998022896A1 Computer assisted method of partitioning an electrical circuit |
05/28/1998 | WO1998022635A1 Method and apparatus for directional deposition of thin films using laser ablation |
05/28/1998 | WO1998022568A1 Stripping formulation including catechol, hydroxylamine, non-alkanolamine, water for post plasma ashed wafer cleaning |
05/28/1998 | WO1998022541A2 Method for coating substrates |
05/28/1998 | WO1998022270A1 Template type cavity-formation device for low temperature cofired ceramic (ltcc) sheets |
05/28/1998 | WO1998022230A1 Spinning device and spinning method |
05/28/1998 | DE19752412A1 Process for joining solid bodies e.g. for microelectronic components |
05/28/1998 | DE19751785A1 Filling recesses in a surface layer of a semiconductor wafer with conductive material |
05/28/1998 | DE19751784A1 Verfahren zum Herstellen einer Barriereschicht A method for forming a barrier layer |
05/28/1998 | DE19751745A1 Gateisolierschicht mit diamantähnlichem Kohlenstoff und Dünnfilmtransistor, der diese verwendet, und einen Prozeß zum Herstellen der Gateisolierschicht und des Dünnfilmtransistors Gate insulating film with diamond-like carbon, and thin film transistor using the same, and a process for producing the gate insulating layer and the thin film transistor |
05/28/1998 | DE19749348A1 Muffle for installation for chemical precipitation from gas phase |
05/28/1998 | DE19736787A1 Silicide interconnect structure formation |
05/28/1998 | DE19729420A1 Semiconducting component |
05/28/1998 | DE19728171A1 Semiconductor for evaluation of defects to isolation edge |
05/28/1998 | DE19710491A1 Self-aligned process for semiconductor memory production |
05/28/1998 | DE19648866A1 Method of manufacturing micromechnical components and assemblies |
05/28/1998 | DE19648759A1 Method of manufacturing microstructures |
05/28/1998 | DE19648501A1 Method for removable connection and finally separation of reversibly bonded and polished plates |
05/28/1998 | CA2222343A1 Anodizing apparatus and apparatus and method associated with the same |
05/27/1998 | EP0844737A2 Input buffer circuit and bidirectional buffer circuit for plural voltage systems |
05/27/1998 | EP0844675A2 Light-emitting gallium nitride-based compound semiconductor device |
05/27/1998 | EP0844671A1 Semiconductor element and semiconductor memory device using the same |
05/27/1998 | EP0844670A1 Method for manufacturing thin film transistor, liquid crystal display and electronic device both produced by the method |
05/27/1998 | EP0844668A2 MOS structure of semiconductor device and method of manufacturing the same |
05/27/1998 | EP0844667A2 Storage capacitor for DRAM memory cell and the process of fabricating the same |
05/27/1998 | EP0844664A2 A bond pad for an integrated circuit |
05/27/1998 | EP0844663A1 Circuit member for semiconductor device, semiconductor device using the same, and method for manufacturing them |
05/27/1998 | EP0844662A1 An EPROM cell array |
05/27/1998 | EP0844661A1 A process for the production of silicon gate CMOS transistors, and resultant product |
05/27/1998 | EP0844660A1 Semiconductor device and method of manufacturing the same |
05/27/1998 | EP0844659A2 Puncture resistant electrostatic chuck |
05/27/1998 | EP0844658A2 Integrated circuit, method of fabrication and evaluation of the same |
05/27/1998 | EP0844657A1 Method for mounting semiconductor chip |
05/27/1998 | EP0844656A1 Electronic component structure |
05/27/1998 | EP0844655A2 An integrated circuit chip packaging method |
05/27/1998 | EP0844654A2 Heat treatment method for a silicon wafer and a silicon wafer heat-treated by the method |
05/27/1998 | EP0844653A2 Method for reducing surface layer defects in semiconductor materials having a volatile species |
05/27/1998 | EP0844652A1 Integratable capacitor, its fabrication method and memory array utilizing the capacitor |
05/27/1998 | EP0844651A1 Method of controlling oxidation in multilayer semiconductor structure comprising Group III elements |
05/27/1998 | EP0844650A2 Method of etching SiO2 and process of cleaning silicon wafers using dilute chemical etchants and a megasonic field |