Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/1999
11/30/1999US5994206 Patterning photoresist, etching a dielectric, sputtering electroconductivie metal on walls
11/30/1999US5994205 Method of separating semiconductor devices
11/30/1999US5994204 Single crystal semiconductor on glass substrate
11/30/1999US5994203 Process for stress reduction in silicon during field isolation
11/30/1999US5994202 Threshold voltage tailoring of the corner of a MOSFET device
11/30/1999US5994201 Method for manufacturing shallow trench isolation regions
11/30/1999US5994200 Trench isolation structure of a semiconductor device and a method for thereof
11/30/1999US5994199 Method for fabricating semiconductor device on SOI substrate
11/30/1999US5994198 Fabrication method for fully landing subminimum features on minimum width lines
11/30/1999US5994197 Method for manufacturing dynamic random access memory capable of increasing the storage capacity of the capacitor
11/30/1999US5994196 Methods of forming bipolar junction transistors using simultaneous base and emitter diffusion techniques
11/30/1999US5994194 Controlling spacings between ohmic metal and emitters on integraterd circuit
11/30/1999US5994193 Method of making high performance MOSFET with integrated poly/metal gate electrode
11/30/1999US5994192 Compensation of the channel region critical dimension, after polycide gate, lightly doped source and drain oxidation procedure
11/30/1999US5994191 Elevated source/drain salicide CMOS technology
11/30/1999US5994190 Semiconductor device with impurity layer as channel stopper immediately under silicon oxide film
11/30/1999US5994189 High withstand voltage semiconductor device and manufacturing method thereof
11/30/1999US5994187 N-type junctions
11/30/1999US5994186 Contactless flash eprom using poly silicon isolation and process of making the same
11/30/1999US5994185 Method of fabricating flash memory cell
11/30/1999US5994184 Semiconductor memory device and method of manufacturing the same
11/30/1999US5994183 Method for forming charge storage structure
11/30/1999US5994182 Method of reducing outdiffusion from a doped three-dimensional polysilicon film into substrate by using angled implants
11/30/1999US5994181 Method for forming a DRAM cell electrode
11/30/1999US5994180 Method of making SRAM having part of load resistance layer functions as power supply line
11/30/1999US5994179 Method of fabricating a MOSFET featuring an effective suppression of reverse short-channel effect
11/30/1999US5994178 Method of fabricating CMOS transistors with a planar shallow trench isolation
11/30/1999US5994176 Method for forming self-aligned silicided MOS transistors with asymmetric ESD protecting transistors
11/30/1999US5994175 High performance MOSFET with low resistance design
11/30/1999US5994174 Method of fabrication of display pixels driven by silicon thin film transistors
11/30/1999US5994173 Thin film transistor matrix device and method for fabricating the same
11/30/1999US5994172 Method for producing semiconductor device
11/30/1999US5994171 Method of making lateral components in power semiconductor devices
11/30/1999US5994170 Silicon segment programming method
11/30/1999US5994168 Method of manufacturing semiconductor device
11/30/1999US5994166 Method of constructing stacked packages
11/30/1999US5994165 Method for mounting a semiconductor chip
11/30/1999US5994164 Nanostructure tailoring of material properties using controlled crystallization
11/30/1999US5994163 Multilayer; applying metallic layer to substrate.interface containing copper indium selenide; then semiconductor material
11/30/1999US5994160 Forming oxide film on walls of mold; vapor deposition of diamond particles; removal substrate
11/30/1999US5994158 Controlling gas flow
11/30/1999US5994156 Conductors covered with dielectric
11/30/1999US5994155 Method of fabricating a thin film transistor liquid crystal display
11/30/1999US5994153 Fabrication process of a capacitor structure of semiconductor memory cell
11/30/1999US5994152 Fabricating interconnects and tips using sacrificial substrates
11/30/1999US5994142 Method for collecting a metallic contaminants from a wafer
11/30/1999US5994036 Storage of semiconductors; controlling temperature and humidity
11/30/1999US5994030 Pattern-forming method and lithographic system
11/30/1999US5994025 Mixture of polymer and acid generator
11/30/1999US5994022 Radiation sensitive resin composition
11/30/1999US5994004 Levenson type phase shift photomask and manufacture method of semiconductor device using such photomask
11/30/1999US5994003 A lithographic process for scanning a mask with exposure light such as synchrotron radiation light to transfer a pattern of the mask onto a wafer.
11/30/1999US5993973 Transparent conductive composition, transparent conductive layer formed of the same, and manufacturing method thereof
11/30/1999US5993945 Does not requiring drilling of vias, yet provides good adhesion of circuitization to dielectric layer.
11/30/1999US5993908 Depositing polycrystalline aluminum film containing copper, heating to a target temperature, controlled cooling to a final temperature
11/30/1999US5993901 Preparing complex alkoxides of the metals by liquid phasereaction of lead carboxylate with the alkoxides, dissolving in water, immersing substrate in solution
11/30/1999US5993893 Evaluation method for polycrystalline silicon film
11/30/1999US5993770 Thermal conductivity along the direction of the sic crystal growth between 150 and 250 w/m.k, an internal structure having an average grain diameter between 5 to 8 mu
11/30/1999US5993699 Aluminum nitride based composite body electronic functional material, electrostatic chuck and method of producing aluminum nitride based composite body
11/30/1999US5993686 Fluoride additive containing chemical mechanical polishing slurry and method for use of same
11/30/1999US5993685 Planarization composition for removing metal films
11/30/1999US5993681 Method and apparatus for aiming a spray etcher nozzle
11/30/1999US5993678 Device and method for processing a plasma to alter the surface of a substrate
11/30/1999US5993677 Process for transferring a thin film from an initial substrate onto a final substrate
11/30/1999US5993639 Method for producing electrolytic ionic water and an apparatus for the same
11/30/1999US5993597 Single-crystal or polycrystalline silicon, which has an electric resistance of 0.0001-40 omega cm, whose crystal faces are (100), which is doped with boron or phosphorus, whose surface has been acid etched & vacuum heat treated
11/30/1999US5993594 Silicon nitride liner, focus ring and/or gas distribution plate, the member having an exposed surface adjacent the substrate holder being effective to minimize particle contamination during processing of substrates.
11/30/1999US5993591 Coring of leadframes in carriers via radiant heat source
11/30/1999US5993555 Apparatus and process for growing silicon epitaxial layer
11/30/1999US5993552 Processing apparatus
11/30/1999US5993547 Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer
11/30/1999US5993546 Apparatus for forming a solid thin film from a layer of liquid material without void
11/30/1999US5993542 Having an excellent quality with a good crystallographic property and no surface roughness or cracks.
11/30/1999US5993539 Method for pulling a single crystal
11/30/1999US5993538 Method of forming single-crystalline thin film using beam irradiating method
11/30/1999US5993493 Method of manufacturing mirror-polished silicon wafers, and apparatus for processing silicon wafers
11/30/1999US5993303 Hand-held cutting tool for cutting fiber-cement siding
11/30/1999US5993302 Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
11/30/1999US5993292 Production of notchless wafer
11/30/1999US5993202 Baking furnace and control method therefor
11/30/1999US5993165 In Situ getter pump system and method
11/30/1999US5993148 Article transfer methods
11/30/1999US5993141 Independent linear dual-blade robot and method for transferring wafers
11/30/1999US5993081 In-line processing system
11/30/1999US5993050 Method of and apparatus for extracting model parameters
11/30/1999US5993043 Lithography processing apparatus for manufacturing semiconductor devices
11/30/1999US5992974 Ink-jet head having nozzle openings with a constant width and manufacturing method thereof
11/30/1999US5992725 Apparatus and method for producing electronic elements
11/30/1999US5992688 Dispensing method for epoxy encapsulation of integrated circuits
11/30/1999US5992638 Advanced wafer shipper
11/30/1999US5992463 Gas panel
11/30/1999US5992431 Device for treating substrates in a fluid container
11/30/1999US5992429 Method for cleaning semiconductor wafers with an external heat source
11/30/1999US5992046 Semiconductor wafer temperature measurement and control thereof using gas temperature measurement
11/30/1999US5992012 Method for making electrical interconnections between layers of an IC package
11/30/1999US5991965 Apparatus for dry-cleaning dust-contaminated auxiliary objects for handling and storing semiconductor wafers
11/30/1999CA2146908C Contactless sheet resistant measurement method and apparatus
11/30/1999CA2113290C Wafer sensing and clamping monitor
11/30/1999CA2099049C Permanent metallic bonding method
11/29/1999CA2273387A1 Compositions and methods involving direct write optical lithography
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