Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/06/2013US8501567 Manufacturing method of high voltage device
08/06/2013US8501566 Method for fabricating a recessed channel access transistor device
08/06/2013US8501565 Method for fabricating deep trench isolation
08/06/2013US8501564 Semiconductor element, semiconductor device, and method for manufacturing the same
08/06/2013US8501563 Devices with nanocrystals and methods of formation
08/06/2013US8501562 Fabricating a gate oxide
08/06/2013US8501560 Method for manufacturing thin film capacitor and thin film capacitor obtained by the same
08/06/2013US8501559 Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same
08/06/2013US8501558 Semiconductor device and manufacturing method of the same
08/06/2013US8501557 Method of manufacturing nitride semiconductor device
08/06/2013US8501556 Thin film transistor formed on flexible substrate and method of manufacturing the same
08/06/2013US8501555 Semiconductor device and manufacturing method thereof
08/06/2013US8501554 Methods for manufacturing thin film transistor and display device
08/06/2013US8501553 Method for manufacturing thin film transistor (TFT) array substrate
08/06/2013US8501552 Pixel structure and method of fabricating the same
08/06/2013US8501551 Thin film transistor array substrate and method of fabricating the same
08/06/2013US8501550 Method of fabricating gate and method of manufacturing semiconductor device using the same
08/06/2013US8501549 Method of manufacturing a reverse blocking insulated gate bipolar transistor
08/06/2013US8501548 Method for producing a semiconductor device using laser annealing for selectively activating implanted dopants
08/06/2013US8501547 Implantable microelectronic device and method of manufacture
08/06/2013US8501546 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
08/06/2013US8501545 Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime
08/06/2013US8501544 Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation
08/06/2013US8501543 Direct-write wafer level chip scale package
08/06/2013US8501542 Double-faced electrode package, and its manufacturing method
08/06/2013US8501541 Semiconductor device and method of conforming conductive vias between insulating layers in saw streets
08/06/2013US8501540 Method for manufacture of inline integrated circuit system
08/06/2013US8501539 Semiconductor device package
08/06/2013US8501538 Method for connecting substrate and method for manufacturing semiconductor device
08/06/2013US8501537 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
08/06/2013US8501536 Integrating and aligning laser chips on sliders for HAMR applications
08/06/2013US8501535 Integrated circuit package system with dual side connection and method for manufacturing thereof
08/06/2013US8501534 Method for housing an electronic component in a device package and an electronic component housed in the device package
08/06/2013US8501533 Method of etching a programmable memory microelectronic device
08/06/2013US8501532 Method of fabricating organic light emitting diode display
08/06/2013US8501530 Method for manufacturing semiconductor device with organic semiconductor layer
08/06/2013US8501528 Radiofrequency plasma reactor and method for manufacturing vacuum process treated substrates
08/06/2013US8501526 Synthesizing photovoltaic thin films of high quality copper-zinc-tin alloy with at least one chalcogen species
08/06/2013US8501525 Method of fabrication of programmable memory microelectric device
08/06/2013US8501524 Method of manufacturing thin-film light-absorbing layer, and method of manufacturing thin-film solar cell using the same
08/06/2013US8501523 Depositing titanium silicon nitride films for forming phase change memories
08/06/2013US8501522 Intermetal stack for use in a photovoltaic cell
08/06/2013US8501521 Copper species surface treatment of thin film photovoltaic cell and manufacturing method
08/06/2013US8501519 Method of production of CIS-based thin film solar cell
08/06/2013US8501518 Method of manufacturing thermoelectric conversion element and thermoelectric conversion element
08/06/2013US8501517 Method of assembling pressure sensor device
08/06/2013US8501516 Method for producing micromechanical patterns having a relief-like sidewall outline shape or an adjustable angle of inclination
08/06/2013US8501514 Method for manufacturing light emitting diode by etching with alkaline solution
08/06/2013US8501511 Method of manufacturing laser diode
08/06/2013US8501510 Optoelectronic component with three-dimension quantum well structure and method for producing the same
08/06/2013US8501509 Multi-dimensional solid state lighting device array system and associated methods and structures
08/06/2013US8501508 Method of forming quantum well mosfet channels having uni-axial strains caused by metal source/drains
08/06/2013US8501507 Method for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration
08/06/2013US8501506 Method for manufacturing light emitting diode
08/06/2013US8501505 Methods of combinatorial processing for screening multiple samples on a semiconductor substrate
08/06/2013US8501504 Method and system for non-destructive determination of dielectric breakdown voltage in a semiconductor wafer
08/06/2013US8501503 Methods of inspecting and manufacturing semiconductor wafers
08/06/2013US8501502 Package method for electronic components by thin substrate
08/06/2013US8501501 Measurement of a sample using multiple models
08/06/2013US8501500 Method for monitoring the removal of polysilicon pseudo gates
08/06/2013US8501499 Adaptive recipe selector
08/06/2013US8501393 Anti-reflective coating forming composition containing vinyl ether compound
08/06/2013US8501269 Sensitive materials for gas sensing and method of making same
08/06/2013US8501143 Single crystal diamond prepared by CVD
08/06/2013US8501141 Method for producing group III nitride semiconductor
08/06/2013US8501045 Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
08/06/2013US8501027 Polishing composition and polishing method
08/06/2013US8501026 Method for making a planar membrane
08/06/2013US8500974 Carrier and sputtering device using the same
08/06/2013US8500953 Edge ring assembly with dielectric spacer ring
08/06/2013US8500952 Plasma confinement rings having reduced polymer deposition characteristics
08/06/2013US8500951 Low-K damage avoidance during bevel etch processing
08/06/2013US8500950 Exposure condition setting method, substrate processing apparatus, and computer program
08/06/2013US8500930 Device and method for the application of a sheet-like jointing means onto a contact area of a wafer
08/06/2013US8500907 Masking system for the masking of a cylinder bore
08/06/2013US8500382 Airflow management for particle abatement in semiconductor manufacturing equipment
08/06/2013US8499998 Component built-in circuit substrate and method of producing the same
08/06/2013US8499669 Methods and apparatus for singulating micro-well tape
08/06/2013CA2643655C Aluminum - boron solar cell contacts
08/01/2013WO2013112902A1 Conditioning a pad in a cleaning module
08/01/2013WO2013112779A1 Qualitative crystal defect evaluation method
08/01/2013WO2013112764A1 Retaining ring monitoring and control of pressure
08/01/2013WO2013112727A1 Methods for uv-assisted conformal film deposition
08/01/2013WO2013112702A1 Devices including metal-silicon contacts using indium arsenide films and apparatus and methods
08/01/2013WO2013112659A1 Method and apparatus separate modules for processing a substrate
08/01/2013WO2013112587A1 Slurry for planarizing photoresist
08/01/2013WO2013112577A1 Power supply with electrostatic discharge (esd) protection
08/01/2013WO2013112490A1 Slurry for cobalt applications
08/01/2013WO2013112435A1 Light - emitting devices having discrete phosphor chips and fabrication methods
08/01/2013WO2013112313A1 Thermal processing chamber with top substrate support assembly
08/01/2013WO2013112301A1 Methods and apparatus for sensing a substrate in a load cup
08/01/2013WO2013112293A1 Method of forming single-crystal semiconductor layers and photovoltaic cell thereon
08/01/2013WO2013112275A1 Copula-based system and method for management of manufacturing test and product specification throughout the product lifecycle for electronic systems or integrated circuits
08/01/2013WO2013112270A1 Member peeling method, member peeling apparatus, and semiconductor chip manufacturing method
08/01/2013WO2013112253A1 Memory cell structures and memory arrays
08/01/2013WO2013112205A2 Wire bonding tool
08/01/2013WO2013112196A1 Cleaning module and process for particle reduction
08/01/2013WO2013111840A1 Coating liquid for forming diffusion prevention layer, method for producing semiconductor substrate with dopant diffusion layer using same, and method for manufacturing solar cell
08/01/2013WO2013111812A1 Fine unevenness structure body, dry etching thermo-reactive resist material, mold fabrication method, and mold
08/01/2013WO2013111775A1 Semiconductor device manufacturing method, and adhesive film used in semiconductor device manufacturing method
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