Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/01/2013US20130193997 System and method for test structure on a wafer
08/01/2013US20130193593 Bump structural designs to minimize package defects
08/01/2013US20130193591 Power Semiconductor Module with Pressed Baseplate and Method for Producing a Power Semiconductor Module with Pressed Baseplate
08/01/2013US20130193590 Semiconductor device including voltage converter circuit, and method of making the semiconductor device
08/01/2013US20130193589 Packaged integrated circuit using wire bonds
08/01/2013US20130193585 Fabrication method and structure of through silicon via
08/01/2013US20130193584 On-chip radial cavity power divider/combiner
08/01/2013US20130193582 Method and apparatus for connecting memory dies to form a memory system
08/01/2013US20130193581 Packaged microdevices and methods for manufacturing packaged microdevices
08/01/2013US20130193578 Through-silicon vias for semicondcutor substrate and method of manufacture
08/01/2013US20130193577 Structure of electrical contact and fabrication method thereof
08/01/2013US20130193576 Encapsulant with corosion inhibitor
08/01/2013US20130193575 Optimization of copper plating through wafer via
08/01/2013US20130193573 Methods of stress balancing in gallium arsenide wafer processing
08/01/2013US20130193571 Semiconductor package and method and system for fabricating the same
08/01/2013US20130193570 Bumping process and structure thereof
08/01/2013US20130193569 Integrated Circuit Die And Method Of Fabricating
08/01/2013US20130193567 Lead frame and method of manufacturing the same, and semiconductor device and method of manufacturing the same
08/01/2013US20130193566 Integrated Circuit Shielding Film and Manufacturing Method Thereof
08/01/2013US20130193565 Semiconductor mask blanks with a compatible stop layer
08/01/2013US20130193564 Semiconductor structure and method and tool for forming the semiconductor structure
08/01/2013US20130193560 Semiconductor substrate having dot marks and method of manufacturing the same
08/01/2013US20130193558 Method for manufacturing a group iii nitride substrate using a chemical lift-off process
08/01/2013US20130193555 Semiconductor Devices and Methods of Manufacture Thereof
08/01/2013US20130193550 3d integrated circuit
08/01/2013US20130193549 Semiconductor devices including conductive plugs and methods of manufacturing the same
08/01/2013US20130193548 Semiconductor devices having a trench isolation layer and methods of fabricating the same
08/01/2013US20130193534 Capacitive pressure sensor and method of manufacturing the same
08/01/2013US20130193530 Semiconductor Component and Corresponding Production Method
08/01/2013US20130193528 Systems and methods for conductive pillars
08/01/2013US20130193526 FinFET Body Contact and Method of Making Same
08/01/2013US20130193518 Semiconductor devices having double-layered metal contacts and methods of fabricating the same
08/01/2013US20130193517 Semiconductor device with lateral and vertical channel confinement and method of fabricating the same
08/01/2013US20130193516 Sram integrated circuits and methods for their fabrication
08/01/2013US20130193515 Sram with hybrid finfet and planar transistors
08/01/2013US20130193514 Method to enable the formation of silicon germanium channel of fdsoi devices for pfet threshold voltage engineering
08/01/2013US20130193508 Semiconductor device with super junction structure and method for fabricating the same
08/01/2013US20130193506 Semiconductor device having different non-volatile memories having nanocrystals of differing densities and method therefor
08/01/2013US20130193504 Semiconductor device and method for manufacturing same
08/01/2013US20130193503 Semiconductor device and method of manufacturing the same
08/01/2013US20130193500 Decoupling finfet capacitors
08/01/2013US20130193499 Decoupling capacitor and layout for the capacitor
08/01/2013US20130193492 Silicon carbon film structure and method
08/01/2013US20130193489 Integrated circuits including copper local interconnects and methods for the manufacture thereof
08/01/2013US20130193483 Mosfet Structures Having Compressively Strained Silicon Channel
08/01/2013US20130193482 Fin Structures with Damage-Free Sidewalls for Multi-Gate Mosfets
08/01/2013US20130193481 Field effect transistor and a method of forming the transistor
08/01/2013US20130193480 Epitaxy Technique for Reducing Threading Dislocations in Stressed Semiconductor Compounds
08/01/2013US20130193459 Light-emitting device and method of manufacturing the same
08/01/2013US20130193457 Light-Emitting Circuit, Luminaire, and Manufacturing Method for the Light-Emitting Circuit
08/01/2013US20130193449 PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON SiC
08/01/2013US20130193446 Finfet and method of fabricating the same
08/01/2013US20130193445 Soi structures including a buried boron nitride dielectric
08/01/2013US20130193444 High voltage switching devices and process for forming same
08/01/2013US20130193441 Semiconductor Substrates Using Bandgap Material Between III-V Channel Material and Insulator Layer
08/01/2013US20130193438 Semiconductor device
08/01/2013US20130193437 Device for protecting an integrated circuit against back side attacks
08/01/2013US20130193412 Transistors and methods of manufacturing the same
08/01/2013US20130193411 Graphene device and method of manufacturing the same
08/01/2013US20130193410 Nano-devices formed with suspended graphene membrane
08/01/2013US20130193402 Phase-change random access memory device and method of manufacturing the same
08/01/2013US20130193401 Self-aligned process to fabricate a memory cell array with a surrounding-gate access transistor
08/01/2013US20130193398 Memory arrays and methods of forming same
08/01/2013US20130193394 Incorporation of oxygen into memory cells
08/01/2013US20130193354 Drawing method and drawing device
08/01/2013US20130193136 Photonic heating of silver grids
08/01/2013US20130192760 Microwave emitting device and surface wave plasma processing apparatus
08/01/2013US20130192759 Plasma processing device
08/01/2013US20130192754 Room Temperature Debonding Composition, Method and Stack
08/01/2013US20130192630 Foreign matter removal device and foreign matter removal method
08/01/2013US20130192524 Continuous Substrate Processing System
08/01/2013US20130192435 Wafer cutting method and device
08/01/2013US20130192310 Laser annealing apparatus
08/01/2013DE112011103702T5 Zusammensetzung zum Polieren und Verfahren zum Polieren eines Halbleitersubstrats unter Verwendung derselben A composition for polishing and method of polishing a semiconductor substrate using the same
08/01/2013DE112011103633T5 Vorrichtungsspezifische Markierungen Device-specific markers
08/01/2013DE112011103476T5 SOI-Substrat SOI substrate
08/01/2013DE112011103470T5 Halbleiterbauelement und Verfahren zum Herstellen desselben Of the same semiconductor device and method of manufacturing
08/01/2013DE112011103281T5 Verfahren zum Ausbilden einer E-Sicherung in einem Prozess zum Fertigen eines Ersatzmetall-Gates A method for forming an electric fuse in a process of manufacturing a replacement metal gates
08/01/2013DE112011103230T5 Non-Punch-Through-Bipolarleistungshalbleiterbauelement Non-punch-through Bipolarleistungshalbleiterbauelement
08/01/2013DE112009000535B4 Siliziumkarbid-Halbleitervorrichtung und Verfahren zu deren Herstellung Silicon carbide semiconductor device and process for their preparation
08/01/2013DE112004003075B4 Filme mit niedriger Dielektrizitätskonstante und Herstellungsverfahren für diese Filme sowie elektronische Bauteile, die diese Filme verwenden Low dielectric constant films and manufacturing methods for these films, and electronic components using these films
08/01/2013DE102013201235A1 Verfahren zum Herstellen einer Siliziumkarbid-Halbleitervorrichtung A method of manufacturing a silicon carbide semiconductor device
08/01/2013DE102013200907A1 Transparente Polyurethane, enthaltend elektronische Bauteile Transparent polyurethanes containing electronic components
08/01/2013DE102013200549A1 Verbesserte silicium-kohlenstoff-dünnschichtstruktur und verfahren Improved silicon-carbon thin film structure and method
08/01/2013DE102013200547A1 Halbleitersubstrate, die material mit bandlücke zwischen iii-v- kanalmaterial und isolatorschicht verwenden Semiconductor substrates, using material with band gap between iii-v channel material and insulator layer
08/01/2013DE102013200214A1 Nanoeinheiten, gebildet mit eingehängter Graphen-Membran Nano units formed with hinged graphene membrane
08/01/2013DE102013100709A1 Vorrichtungen und Verfahren zum Polieren, Ätzen und Reinigen mit einer mit Gas gemischten Flüssigkeit Devices and methods for polishing, etching and cleaning with a mixed gas with liquid
08/01/2013DE102013000993A1 Zweistrahl-Laserglühen bzw. -Annealing mit verbessertem Temperaturverhalten Two-beam laser annealing or -Annealing with improved temperature behavior
08/01/2013DE102012210618A1 Vorrichtung und Verfahren zum Behandeln von plattenförmigem Prozessgut Device and method for treating process material plate-
08/01/2013DE102012201172A1 Leistungshalbleitermodul mit geprägter Bodenplatte und Verfahren zur Herstellung eines Leistungshalbleitermoduls mit geprägter Bodenplatte The power semiconductor module with an embossed bottom plate and method for producing a power semiconductor module with an embossed bottom plate
08/01/2013DE102012112957A1 Drahtbonding-Verfahren bei einer Schaltungsvorrichtung Wire-bonding method for a circuit device
08/01/2013DE102012101399B3 Method for processing substrates, involves grinding chips from back side using grinding device, until the chips are separated from each other, and applying finished chips on the carrier
08/01/2013DE102012016377A1 Method for forming flat-structured electrode for passive matrix type organic LED display, involves setting steep slope angle of side walls of recess to provide electrical isolation for layer and deposited layer to form electrode
08/01/2013DE102012001721A1 Method for rinsing of workpiece e.g. carrier of wafer used in e.g. solar cell, involves providing rinsing spacers in nozzle to pump out rinsing fluid from fluid tank and to drip off the rinsing fluid to workpiece
08/01/2013DE102012001620A1 Verfahren zur Herstellung von dünnen Platten aus Werkstoffen geringer Duktilität mittels temperaturinduzierter mechanischer Spannung unter Verwendung von vorgefertigten Polymer-Folien A process for the production of thin sheets of materials by means of low ductility temperature-induced mechanical stress using prefabricated polymer films
08/01/2013DE102012001508A1 Producing electrically conductive or semi-conductive metal oxide, comprises applying metal oxide precursor-solution or -dispersion on substrate, optionally drying the precursor layer, thermally transferring layer, and optionally cooling
08/01/2013DE102011050228B4 Halbleiter-Package und Verfahren zur Herstellung eines Halbleiter-Packages mit Induktionsspule The semiconductor package and method for manufacturing a semiconductor package with inductor
08/01/2013DE102008036766B4 Vorrichtung und Verfahren zum Erzeugen dielektrischer Schichten im Mikrowellenplasma Apparatus and method for producing dielectric layers in the microwave plasma
08/01/2013DE102006046844B4 Leistungshalbleiterbauelement mit Feldstoppzone und Verfahren zur Herstellung eines solchen Leistungshalbleiterbauelements A power semiconductor device with a field stop zone and process for the preparation of such a power semiconductor device
08/01/2013DE102006045214B4 Halbleitervorrichtung mit einem LDMOS-Transistor und Verfahren zur Herstellung derselben A semiconductor device comprising a LDMOS transistor and method of manufacturing the same
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