Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2013
08/08/2013DE112011102793T5 Positiv arbeitende lichtempfindliche Siloxanzusammensetzung Positive working photosensitive siloxane
08/08/2013DE112011102260T5 Photohärtbare Zusammensetzung zum Prägedruck und Verfahren zum Bilden eines Musters mittels der Zusammensetzung A photocurable composition for relief printing and method of forming a pattern by means of the composition
08/08/2013DE112008000994B4 Mikrochip mit aktiver Temperatursteuerung und Verfahren zu dessen Herstellung Microchip with active temperature control and process for its preparation
08/08/2013DE102013201868A1 Wire bonding system useful for forming wire loop, comprises bonding head, bonding tool, wire supply formed for bonding using bonding tool, and wire shaping tool, which is independently movable with respect to bonding head and bonding tool
08/08/2013DE102013201076A1 Gestalten einer grenzfläche zum optimieren von metall-iii-v-kontakten Create a surfactant to optimize of metal-iii-v-contacts
08/08/2013DE102013201035A1 Ersatz-gate-finfet-struktur und -prozess Replacement gate FinFET structure and process
08/08/2013DE102013101258A1 Halbleiterbauelement unter Verwendung von Diffusionslöten Semiconductor device using diffusion soldering
08/08/2013DE102013101222A1 Halbleitervorrichtung und Verfahren für ihre Herstellung Semiconductor device and methods for their preparation
08/08/2013DE102012223093A1 Verfahren zur Herstellung einer Halbleitervorrichtung A process for producing a semiconductor device
08/08/2013DE102012201688A1 Solarzelle und Verfahren zu deren Herstellung Solar cell and process for their preparation
08/08/2013DE102012201516A1 Semiconductor wafer polishing method for semiconductor industry, involves performing removal polishing on front and back sides of wafer, and single-sided polishing on front side of wafer in presence of polishing agent
08/08/2013DE102012201486A1 Dämpfungsvorrichtung für eine mikromechanische Sensoreinrichtung Damping device for a micromechanical sensor device
08/08/2013DE102012106660A1 PCB mit einer individuellen refektierenden Struktur und Verfahren zum Herstellen eines LED Pakets, das diese verwendet PCB with an individual refektierenden structure and method for manufacturing an LED package that uses this
08/08/2013DE102012100929A1 Substratbearbeitungsanlage Substrate processing system
08/08/2013DE102012002129A1 Method for exposing set of plated-through holes in silicon substrate, involves controlling removal rate of semiconductor material in portion of side of substrate by gas flow, where removal rate is produced by gas flow
08/08/2013DE102010015903B4 Ausrichtung eines rekonfigurierten Wafers Orientation of a reconfigured wafer
08/08/2013DE102009033442B4 Halbleiterbauelement mit einer Copolymerschicht und Verfahren zur Herstellung eines solchen Halbleiterbauelements A semiconductor device comprising a copolymer and method for producing such a semiconductor device
08/08/2013DE102009015747B4 Verfahren zur Herstellung von Transistoren mit Metallgateelektrodenstrukturen und Gatedielektrikum mit großem ε und einer Zwischenätzstoppschicht A process for the fabrication of transistors with metal gate electrodes and gate dielectric structures with large ε and a Zwischenätzstoppschicht
08/08/2013DE102007045854B4 Kontaktfreie Transportvorrichtung Non-contact transport device
08/07/2013EP2624318A1 Iii nitride semiconductor light-emitting element, and process for manufacturing same
08/07/2013EP2624302A1 Trench power MOSFET
08/07/2013EP2624294A1 Circuit board for large-capacity module peripheral circuit and large-capacity module containing peripheral circuit using said circuit board
08/07/2013EP2624292A1 Substrate transport method and substrate transport apparatus
08/07/2013EP2624291A1 Device for processing a substrate and method for this
08/07/2013EP2624290A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2624289A2 Interposers, electronic modules, and methods for forming the same
08/07/2013EP2624288A2 Semiconductor package with improved testability
08/07/2013EP2624287A1 Liquid resin composition and semiconductor device
08/07/2013EP2624286A1 Method of manufacturing semiconductor device
08/07/2013EP2624285A1 Thin film manufacturing method and thin film manufacturing apparatus
08/07/2013EP2624284A2 Low energy ion beam etch
08/07/2013EP2624283A1 Sapphire substrate and semiconductor light-emitting element
08/07/2013EP2624282A2 Exposure apparatus, exposure method, and method for producing device
08/07/2013EP2624281A1 Nanoimprinting mold, method of manufacturing thereof, and nanoimprinting method
08/07/2013EP2624280A1 Normal-temperature bonding device and normal-temperature bonding method
08/07/2013EP2624000A1 Integrated circuit
08/07/2013EP2623648A1 Growth method for gan crystal and gan crystal substrate
08/07/2013EP2623573A2 Temporary wafer bonding method and cyclic olefin compositions for temporary wafer bonding
08/07/2013EP2623437A1 Transfer system
08/07/2013EP2623285A1 Mold having fine irregular structure on surface, method of producing product having fine irregular structure on surface, use of product, stack expressing heterochromia and surface emitting member
08/07/2013EP2622640A1 Semiconductor device
08/07/2013EP2622638A1 Field effect transistors having improved breakdown voltages and methods of forming the same
08/07/2013EP2622635A1 Singulation of ic packages
08/07/2013EP2622634A1 Integrated shadow mask/carrier for pattern ion implantation
08/07/2013EP2622633A1 Corner structure for ic die
08/07/2013EP2622632A1 Method of making oxide thin film transistor array, and device incorporating the same
08/07/2013EP2622631A1 Method of grooving a chemical-mechanical planarization pad
08/07/2013EP2622630A1 Methods for processing a semiconductor wafer, a semiconductor wafer and a semiconductor device
08/07/2013EP2622629A1 An active carrier for carrying a wafer and method for release
08/07/2013EP2621699A1 Sawing apparatus of single crystal ingot
08/07/2013CN203118949U Non-volatile memory with P+ single polycrystalline architecture
08/07/2013CN203118948U Nonvolatile memory
08/07/2013CN203118925U High-speed grain suction track
08/07/2013CN203118924U Lifting apparatus for conveying wafers
08/07/2013CN203118923U Gripping and lifting device for conveying wafers
08/07/2013CN203118922U Contact type pneumatic suspension device of intelligent card module carrier band
08/07/2013CN203118921U Silicon boat
08/07/2013CN203118920U Wafer implantation system monitoring device
08/07/2013CN203118919U Wafer heating unit
08/07/2013CN203118918U Wafer leveling device
08/07/2013CN203118917U Step-distance-changeable plastic package product claw-poking mechanism
08/07/2013CN203118916U Wafer processing device
08/07/2013CN203118915U Wafer surface treatment device
08/07/2013CN203118914U Chip jointing device
08/07/2013CN203118913U Sealing container for producing electronic components
08/07/2013CN203118912U Novel sealing container for producing electronic components
08/07/2013CN203112961U Reaction furnace of etching baking device
08/07/2013CN203112919U Gas phase processing device
08/07/2013CN203109438U Wire bonder
08/07/2013CN203109437U Wire bonder
08/07/2013CN1447981B Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
08/07/2013CN103238252A A voltage-tunable phase shifter and associated methods
08/07/2013CN103238220A Ion implanted selective emitter solar cells with in situ surface passivation
08/07/2013CN103238217A Wiring structure and sputtering target
08/07/2013CN103238215A Arrays of nonvolatile memory cells
08/07/2013CN103238212A Holding device for holding and mounting a wafer
08/07/2013CN103238211A Method for treating wafers and dies
08/07/2013CN103238210A Gold-platinum-alladium alloy bonding wire
08/07/2013CN103238209A Method for arranging members
08/07/2013CN103238208A Silicon and silicon germanium nanowire structures
08/07/2013CN103238207A Using low pressure EPI to enable low RDSON fet
08/07/2013CN103238206A In-situ low-k capping to improve integration damage resistance
08/07/2013CN103238205A Auxiliary sheet for laser dicing
08/07/2013CN103238204A Electrolytic gold or gold palladium surface finish application in coreless substrate processing
08/07/2013CN103238203A Improved template layers for heteroepitaxial deposition of III nitride semiconductor materials using HVPE processes
08/07/2013CN103237931A Group 13 element nitride film and laminate thereof
08/07/2013CN103237745A Dry etching method of surface texture formation on silicon wafer
08/07/2013CN103237628A Slurry management device for wire saw
08/07/2013CN103236442A Thin film transistor, manufacture method of thin film transistor, array base plate and electronic device
08/07/2013CN103236440A Thin film transistor, array substrate, manufacture method of thin film transistor, manufacture method of array substrate, and display device
08/07/2013CN103236439A VDMOS (vertical double-diffusion metal-oxide-semiconductor) device in novel structure and manufacture method of VDMOS device
08/07/2013CN103236437A High-reliability N-type transverse insulated gate bipolar device and preparation process thereof
08/07/2013CN103236428A RPMC-comprising (replay protection monotonic counter-comprising) enhanced flash chip and packaging method thereof
08/07/2013CN103236425A DRAM (dynamic random access memory) double-chip stacking and packaging structure and packaging technology
08/07/2013CN103236424A Wafer level packaging structure and packaging method
08/07/2013CN103236422A Intelligent power module and manufacturing method thereof
08/07/2013CN103236421A Copper wire bonding structure between chip pad points and bonding method thereof
08/07/2013CN103236419A Preparation method of array substrate, array substrate and display device
08/07/2013CN103236418A Flexible base plate manufacture method
08/07/2013CN103236417A Method for filling TSV (Through Silicon Via) with high depth-to-width ratio
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