| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/06/2013 | US8502372 Low-cost 3D face-to-face out assembly |
| 08/06/2013 | US8502371 Integrated circuit package system with extended corner leads |
| 08/06/2013 | US8502363 Semiconductor device packages with solder joint enhancement element and related methods |
| 08/06/2013 | US8502347 Bipolar junction transistor with epitaxial contacts |
| 08/06/2013 | US8502340 High density three-dimensional integrated capacitors |
| 08/06/2013 | US8502339 System-in-package having integrated passive devices and method therefor |
| 08/06/2013 | US8502334 Image sensor and method for manufacturing the same |
| 08/06/2013 | US8502326 Gate dielectric formation for high-voltage MOS devices |
| 08/06/2013 | US8502325 Metal high-K transistor having silicon sidewalls for reduced parasitic capacitance |
| 08/06/2013 | US8502323 Reliable normally-off III-nitride active device structures, and related methods and systems |
| 08/06/2013 | US8502322 Nonvolatile memory device and manufacturing method thereof |
| 08/06/2013 | US8502320 Zener diode structure and process |
| 08/06/2013 | US8502302 Integrating Schottky diode into power MOSFET |
| 08/06/2013 | US8502293 Capacitor with recessed plate portion for dynamic random access memory (DRAM) and method to form the same |
| 08/06/2013 | US8502282 Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making |
| 08/06/2013 | US8502279 Nano-electro-mechanical system (NEMS) structures with actuatable semiconductor fin on bulk substrates |
| 08/06/2013 | US8502273 Group III-nitride HEMT having a well region formed on the surface of substrate and contacted the buffer layer to increase breakdown voltage and the method for forming the same |
| 08/06/2013 | US8502249 Semiconductor light-emitting device having groove in P-type semiconductor layer and method for manufacturing the same |
| 08/06/2013 | US8502241 Method of driving a light emitting device |
| 08/06/2013 | US8502238 Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device |
| 08/06/2013 | US8502232 Capacitor, semiconductor device and manufacturing method thereof |
| 08/06/2013 | US8502231 Semiconductor device |
| 08/06/2013 | US8502221 Semiconductor device with two metal oxide films and an oxide semiconductor film |
| 08/06/2013 | US8502215 Semiconductor element and display device using the same |
| 08/06/2013 | US8502208 Organic light-emitting device |
| 08/06/2013 | US8502199 Blue-shifted triarylamine polymer |
| 08/06/2013 | US8502192 LED with uniform current spreading and method of fabrication |
| 08/06/2013 | US8502191 Semiconductor device, manufacturing method therefor, and solar cell |
| 08/06/2013 | US8502190 Device of light-emitting diode |
| 08/06/2013 | US8502182 Memory device having self-aligned cell structure |
| 08/06/2013 | US8502151 Optical proximity sensor package with lead frame |
| 08/06/2013 | US8502112 System and method for cutting using a variable astigmatic focal beam spot |
| 08/06/2013 | US8502082 Circuitized substrate utilizing three smooth-sided conductive layers as part thereof and electrical assemblies and information handling systems utilizing same |
| 08/06/2013 | US8501976 Scalable lead zirconium titanate (PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 08/06/2013 | US8501638 Laser annealing scanning methods with reduced annealing non-uniformities |
| 08/06/2013 | US8501637 Silicon dioxide thin films by ALD |
| 08/06/2013 | US8501636 Method for fabricating silicon dioxide layer |
| 08/06/2013 | US8501635 Modification of REO by subsequent III-N EPI process |
| 08/06/2013 | US8501634 Method for fabricating gate structure |
| 08/06/2013 | US8501633 Forming substrate structure by filling recesses with deposition material |
| 08/06/2013 | US8501632 Methods of fabricating isolation regions of semiconductor devices and structures thereof |
| 08/06/2013 | US8501631 Plasma processing system control based on RF voltage |
| 08/06/2013 | US8501630 Selective etch process for silicon nitride |
| 08/06/2013 | US8501629 Smooth SiConi etch for silicon-containing films |
| 08/06/2013 | US8501628 Differential metal gate etching process |
| 08/06/2013 | US8501627 Profile control in dielectric etch |
| 08/06/2013 | US8501626 Methods for high temperature etching a high-K material gate structure |
| 08/06/2013 | US8501624 Excited gas injection for ion implant control |
| 08/06/2013 | US8501623 Method of forming a semiconductor device having a metal silicide and alloy layers as electrode |
| 08/06/2013 | US8501622 Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof |
| 08/06/2013 | US8501621 Method of fabrication of the memristive device |
| 08/06/2013 | US8501620 Method for depositing tungsten film having low resistivity, low roughness and high reflectivity |
| 08/06/2013 | US8501619 Methods for forming a plurality of contact holes in a microelectronic device |
| 08/06/2013 | US8501618 Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis |
| 08/06/2013 | US8501617 Semiconductor devices including a topmost metal layer with at least one opening and their methods of fabrication |
| 08/06/2013 | US8501616 Self-aligned protection layer for copper post structure |
| 08/06/2013 | US8501615 Metal bump formation |
| 08/06/2013 | US8501614 Method for manufacturing fine-pitch bumps and structure thereof |
| 08/06/2013 | US8501613 UBM etching methods for eliminating undercut |
| 08/06/2013 | US8501612 Flip chip structure and method of manufacture |
| 08/06/2013 | US8501611 Methods of forming integrated circuit devices having electrically conductive layers therein with partially nitridated sidewalls |
| 08/06/2013 | US8501610 Non-volatile memories and methods of fabrication thereof |
| 08/06/2013 | US8501609 Method for generating a three-dimensional NAND memory with mono-crystalline channels using sacrificial material |
| 08/06/2013 | US8501608 Method for processing semiconductor device |
| 08/06/2013 | US8501607 FinFET alignment structures using a double trench flow |
| 08/06/2013 | US8501606 Methods of forming wiring structures |
| 08/06/2013 | US8501605 Methods and apparatus for conformal doping |
| 08/06/2013 | US8501604 Method for forming a doped region in a semiconductor layer of a substrate and use of such method |
| 08/06/2013 | US8501603 Method for fabricating high voltage transistor |
| 08/06/2013 | US8501602 Method of manufacturing devices having vertical junction edge |
| 08/06/2013 | US8501601 Drive current increase in field effect transistors by asymmetric concentration profile of alloy species of a channel semiconductor alloy |
| 08/06/2013 | US8501600 Methods for depositing germanium-containing layers |
| 08/06/2013 | US8501599 Substrate processing apparatus and substrate processing method |
| 08/06/2013 | US8501598 Semiconductor substrate, semiconductor device, and method of producing semiconductor substrate |
| 08/06/2013 | US8501597 Method for fabricating group III-nitride semiconductor |
| 08/06/2013 | US8501596 Method for fabricating a micro-electronic device equipped with semi-conductor zones on an insulator with a horizontal GE concentration gradient |
| 08/06/2013 | US8501595 Thin film containing nanocrystal particles and method for preparing the same |
| 08/06/2013 | US8501594 Methods for forming silicon germanium layers |
| 08/06/2013 | US8501592 Freestanding III-nitride single-crystal substrate and method of manufacturing semiconductor device utilizing the substrate |
| 08/06/2013 | US8501591 Method for manufacturing a multiple-bit-per-cell memory |
| 08/06/2013 | US8501590 Apparatus and methods for dicing interposer assembly |
| 08/06/2013 | US8501589 Method in the microelectronics fields of forming a monocrystalline layer |
| 08/06/2013 | US8501588 Method for making a semiconductor structure with a buried ground plane |
| 08/06/2013 | US8501587 Stacked integrated chips and methods of fabrication thereof |
| 08/06/2013 | US8501586 Power semiconductor |
| 08/06/2013 | US8501585 Manufacturing method of semiconductor device |
| 08/06/2013 | US8501584 Method of manufacturing multi-level, silicon, micromechanical parts and parts thereby obtained |
| 08/06/2013 | US8501583 Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates |
| 08/06/2013 | US8501582 Semiconductor structure having low thermal stress and method for manufacturing thereof |
| 08/06/2013 | US8501581 Methods of forming semiconductor constructions |
| 08/06/2013 | US8501580 Process of fabricating semiconductor device with low capacitance for high-frequency circuit protection |
| 08/06/2013 | US8501579 Process of fabricating chip |
| 08/06/2013 | US8501578 Semiconductor structure formed without requiring thermal oxidation |
| 08/06/2013 | US8501577 Preparation method for full-isolated SOI with hybrid crystal orientations |
| 08/06/2013 | US8501574 Resistive memory device and manufacturing method thereof and operating method thereof |
| 08/06/2013 | US8501572 Spacer structure for transistor device and method of manufacturing same |
| 08/06/2013 | US8501571 Method of manufacturing semiconductor device having silicon carbide layers containing phosphorus |
| 08/06/2013 | US8501570 Method of manufacturing source/drain structures |
| 08/06/2013 | US8501569 Semiconductor device having gradient doping profile |
| 08/06/2013 | US8501568 Method of forming flash memory with ultraviolet treatment |