Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/09/2003US6617222 Selective hemispherical silicon grain (HSG) conversion inhibitor for use during the manufacture of a semiconductor device
09/09/2003US6617221 Method of making capacitors
09/09/2003US6617220 Method for fabricating an epitaxial base bipolar transistor with raised extrinsic base
09/09/2003US6617219 Semiconductor device and method for lowering miller capacitance by modifying source/drain extensions for high speed microprocessors
09/09/2003US6617218 Manufacturing method for semiconductor device
09/09/2003US6617217 Reduction in well implant channeling and resulting latchup characteristics in shallow trench isolation by implanting wells through nitride
09/09/2003US6617216 Quasi-damascene gate, self-aligned source/drain methods for fabricating devices
09/09/2003US6617215 Memory wordline hard mask
09/09/2003US6617214 Integrated circuit structure and method therefore
09/09/2003US6617213 Method for achieving high self-aligning vertical gate studs relative to the support isolation level
09/09/2003US6617212 Semiconductor device and method for fabricating the same using damascene process
09/09/2003US6617211 Method for forming a memory integrated circuit
09/09/2003US6617210 Method for making a semiconductor device having a high-k gate dielectric
09/09/2003US6617209 Method for making a semiconductor device having a high-k gate dielectric
09/09/2003US6617208 High capacitance damascene capacitors
09/09/2003US6617207 Method and system for forming a stacked gate insulating film
09/09/2003US6617206 Method of forming a capacitor structure
09/09/2003US6617205 Semiconductor storage device and process for manufacturing the same
09/09/2003US6617204 Method of forming the protective film to prevent nitride read only memory cell charging
09/09/2003US6617203 Flat panel display device and method of manufacturing the same
09/09/2003US6617202 Method for fabricating a full depletion type SOI device
09/09/2003US6617201 U-shape tape for BOC FBGA package to improve moldability
09/09/2003US6617200 System and method for fabricating a semiconductor device
09/09/2003US6617196 Semiconductor device
09/09/2003US6617195 Method of reflowing organic packages using no-clean flux
09/09/2003US6617194 Electronic component, communication device, and manufacturing method for electronic component
09/09/2003US6617193 Semiconductor device, semiconductor device substrate, and methods of fabricating the same
09/09/2003US6617191 Method for anodizing silicon substrates for surface type acceleration sensors
09/09/2003US6617189 Method of fabricating an image sensor
09/09/2003US6617188 Quantum well intermixing
09/09/2003US6617187 Method for fabricating an electrically addressable silicon-on-sapphire light valve
09/09/2003US6617182 Semiconductor device and semiconductor substrate, and method for fabricating the same
09/09/2003US6617180 Test structure for detecting bridging of DRAM capacitors
09/09/2003US6617179 Method and system for qualifying an ONO layer in a semiconductor device
09/09/2003US6617178 Test system for ferroelectric materials and noble metal electrodes in semiconductor capacitors
09/09/2003US6617177 Liquid crystal display devices having fill holes and electrical contacts on the back side of the die
09/09/2003US6617176 Method of determining barrier layer effectiveness for preventing metallization diffusion by forming a test specimen device and using a metal penetration measurement technique for fabricating a production semiconductor device and a test specimen device thereby formed
09/09/2003US6617175 Infrared thermopile detector system for semiconductor process monitoring and control
09/09/2003US6617174 Fieldless CMOS image sensor
09/09/2003US6617173 Integration of ferromagnetic films with ultrathin insulating film using atomic layer deposition
09/09/2003US6617172 Semiconductor device having identification number, manufacturing method thereof and electronic device
09/09/2003US6617097 Using masking pattern
09/09/2003US6617096 Forming trenches surrounding active regions in main surface of semiconductor substrate; applying photoresist layer on insulating layer, structuring photoresist layer to form a mask using a data processing device; filling trenches
09/09/2003US6617095 Evaluating method of hydrophobic process, forming method of resist pattern, and forming system of resist pattern
09/09/2003US6617086 Forming a pattern of a negative photoresist
09/09/2003US6617085 Wet etch reduction of gate widths
09/09/2003US6617084 Efficiency
09/09/2003US6617080 Photomask, semiconductor device, and method for exposing through photomask
09/09/2003US6617060 Gallium nitride materials and methods
09/09/2003US6617059 Method of forming silicon carbide film on aluminum nitride, film structure and silicon carbide film
09/09/2003US6617046 For sealing gaps between printed circuit boards and semiconductor packages
09/09/2003US6617034 SOI substrate and method for production thereof
09/09/2003US6617021 Blend of epoxy resin, phenolic resin, butadiene-styrene copolymer and organosilicon compound
09/09/2003US6617010 Semiconductor thin film and thin film device
09/09/2003US6616987 Procedure and device for specific particle manipulation and deposition
09/09/2003US6616986 Sequential chemical vapor deposition
09/09/2003US6616967 Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process
09/09/2003US6616965 Non-hydrolytic-sol-gel process for high K dielectric
09/09/2003US6616898 Processing apparatus with pressure control and gas recirculation system
09/09/2003US6616890 Fabrication of an electrically conductive silicon carbide article
09/09/2003US6616887 Method for precise molding and alignment of structures on a substrate using a stretchable mold
09/09/2003US6616880 Method for encasing array packages
09/09/2003US6616864 Z-axis electrical contact for microelectronic devices
09/09/2003US6616857 Ferroelectric
09/09/2003US6616855 Process to reduce surface roughness of low K damascene
09/09/2003US6616854 Method of bonding and transferring a material to form a semiconductor device
09/09/2003US6616816 Substrate processing device and method
09/09/2003US6616801 Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
09/09/2003US6616799 Sheet removing apparatus and method
09/09/2003US6616774 Tray comprises grasping grooves formed in band-shaped peripheral wall surrounding wafers; semiconductors; automatic
09/09/2003US6616773 Substrate treatment method
09/09/2003US6616772 Applying isopropyl alcohol vapor gas through plurality of source inlets to semiconductor wafer surface when source inlets and outlets are in close proximity to the wafer surface
09/09/2003US6616767 High temperature ceramic heater assembly with RF capability
09/09/2003US6616766 Method and apparatus for providing uniform gas delivery to substrates in CVD and PECVD processes
09/09/2003US6616762 Treatment solution supply apparatus and treatment solution supply method
09/09/2003US6616760 Film forming unit
09/09/2003US6616759 Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
09/09/2003US6616758 Method and apparatus for spin coating
09/09/2003US6616718 Aqueous solution for colloidal polishing of silicate substrates
09/09/2003US6616717 Containing an oxidizer for oxidizing the metal, a metal complexing compound, and a polymer to bond with silanol surface groups on the silica to inhibit its removal during removal of the layer of metal by the polishing.
09/09/2003US6616526 Clean room and method for fabricating semiconductor device
09/09/2003US6616520 Polishing cloth and method for attaching/detaching the polishing cloth to/from polishing machine base plate
09/09/2003US6616516 Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates
09/09/2003US6616514 For use in removing a first substance from a surface of an article in preference to silicon nitride; includes an abrasive, an aqueous medium, and an organic polyol that does not dissociate protons
09/09/2003US6616512 Including a cleaning box, in which a substrate such as a semiconductor wafer is cleaned with a cleaning liquid and then dried; upper wall with an air intake opening and the exhaust system is fluidly connected to the box
09/09/2003US6616510 Chemical mechanical polishing method for copper
09/09/2003US6616509 Method for performing two wafer preparation operations on vertically oriented semiconductor wafer in single enclosure
09/09/2003US6616436 Apparatus for manufacturing semiconductor packages
09/09/2003US6616394 Apparatus for processing wafers
09/09/2003US6616031 Apparatus and method for bond force control
09/09/2003US6616014 Precision liquid mixing apparatus and method
09/09/2003US6615994 Wafer boat
09/09/2003US6615871 Fluid control apparatus
09/09/2003US6615854 Wafer cleaning apparatus
09/09/2003US6615679 An ensemble manifold having a plurality of sample ports, a delivery port, and flow junction having no open-close valves or other flow selectors connecting all of said sample ports to said delivery port.
09/09/2003US6615510 Wafer drying apparatus and method
09/09/2003US6615485 Probe card assembly and kit, and methods of making same
09/09/2003US6615484 Method of manufacturing an electrical connection using solder flux compatible with flip chip underfill material
09/09/2003US6615481 Utilizes laser machining to provide high resolution, dense coil wire patterns on both sides of a ceramic vane substrate. A firing operation is first performed that eutectically bonds the copper to the ceramic.
09/09/2003US6615477 Method and apparatus for processing workpiece by using X-Y stage capable of improving position accuracy
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