Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2003
09/09/2003US6615465 Method for producing an acceleration sensor
09/04/2003WO2003073805A2 Improved patching methods and apparatus for fabricating memory modules
09/04/2003WO2003073620A1 Floor planning for programmable gate array having embedded fixed logic circuitry
09/04/2003WO2003073570A1 Quantum nano-composite semiconductor laser and quantum nano-composite array
09/04/2003WO2003073565A2 Long wavelength vcsel comprising a tunnel junction with carbon doped gaassb
09/04/2003WO2003073514A1 Group iii-v nitride semiconductor multilayer structure and its production process
09/04/2003WO2003073511A1 Dual trench isolation for a phase-change memory cell and method of making same
09/04/2003WO2003073509A1 Bipolar transistor structure
09/04/2003WO2003073508A1 Circuit for generating a reference voltage having low temperature dependency
09/04/2003WO2003073505A1 Integrated circuit device and method of manufacturing thereof
09/04/2003WO2003073499A1 Floating gate memory cell, floating gate memory arrangement, switching circuit arrangement, and method for producing a floating gate memory cell
09/04/2003WO2003073498A1 Process for producing semiconductor device
09/04/2003WO2003073497A1 Treatment subject receiving vessel body, and treating system
09/04/2003WO2003073496A1 Method of operating substrate processing device
09/04/2003WO2003073495A1 Method of carrying substrate
09/04/2003WO2003073494A2 Method of controlling metal etch processes, and system for accomplishing same
09/04/2003WO2003073493A1 Probe area setting method and probe device
09/04/2003WO2003073492A1 Method for processing substrate
09/04/2003WO2003073491A1 Method of forming layers of oxide of different thicknesses on a surface of a substrate
09/04/2003WO2003073490A1 Shower head structure for processing semiconductor
09/04/2003WO2003073488A1 Method for dividing semiconductor wafer
09/04/2003WO2003073487A1 Heat treatment system
09/04/2003WO2003073486A1 Heat treatment device and heat treatment method
09/04/2003WO2003073485A1 Cooling device and heat treating device using the same
09/04/2003WO2003073484A1 Crystal manufacturing method
09/04/2003WO2003073483A1 Heating device for manufacturing semiconductor
09/04/2003WO2003073482A2 Process for forming isolated integrated inductive circuits
09/04/2003WO2003073481A2 Feedforward and feedback control of semiconductor fabrication process using secondary electron microscopy and a focused ion beam system
09/04/2003WO2003073479A1 Substrate support
09/04/2003WO2003073478A2 Plasma-resistant, welded aluminum structures for use in semiconductor processing apparatus
09/04/2003WO2003073477A2 Tiered structure having a multi-layered resist stack
09/04/2003WO2003073471A2 POWER SiC DEVICES HAVING RAISED GUARD RINGS
09/04/2003WO2003073468A2 Silicon carbide bipolar junction transistor with overgrown base region
09/04/2003WO2003073460A1 Faraday shields and plasma wafer processing
09/04/2003WO2003073448A2 Control of semiconductor fabrication process using scanning electron microscopy and a focused ion beam device
09/04/2003WO2003073441A1 Process of producing multicrystalline silicon substrate and solar cell
09/04/2003WO2003073357A1 Methods and apparatus for fabricating chip-on-board modules
09/04/2003WO2003073356A1 Memory module assembly using partially defective chips
09/04/2003WO2003073169A2 Fluorinated molecules and methods of making and using same
09/04/2003WO2003073167A1 Photosensitive resin composition
09/04/2003WO2003073166A1 Critical dimension control using full phase and trim masks
09/04/2003WO2003073165A2 Self-aligned pattern formation using dual wavelengths
09/04/2003WO2003073164A2 Novel planarization method for multi-layer lithography processing
09/04/2003WO2003073085A1 Surface foreign matters inspecting device
09/04/2003WO2003073055A1 Temperature measuring system, heating device using it and production method for semiconductor wafer, heat ray insulating translucent member, visible light reflection membner, exposure system-use reflection mirror and exposure system, and semiconductor device produced by using them and vetical heat treating device
09/04/2003WO2003072856A1 Process for producing group iii nitride compound semiconductor
09/04/2003WO2003072853A2 Apparatus with processing stations for manually and automatically processing microelectronic workpieces
09/04/2003WO2003072850A1 Semiconductor or liquid crystal producing device
09/04/2003WO2003072846A1 A method of depositing a barrier layer
09/04/2003WO2003072683A1 Slurry and method for chemical mechanical polishing of metal structures including refractory metal based barrier layers
09/04/2003WO2003072673A2 Adhesive compositions containing organic spacers and methods for use thereof
09/04/2003WO2003072672A1 Method and composition for polishing a substrate
09/04/2003WO2003072670A1 Improved chemical-mechanical polishing slurry for polishing of copper or silver films
09/04/2003WO2003072669A2 Polishing composition
09/04/2003WO2003072460A1 Wafer container cushion system
09/04/2003WO2003072325A1 Ceramic multilayer substrate manufacturing method and unfired composite multilayer body
09/04/2003WO2003072306A1 Polishing apparatus and method for detecting foreign matter on polishing surface
09/04/2003WO2003072305A1 Method and system for controlling the chemical mechanical polishing of substrates by calculating an overpolishing time and/or a polishing time of a final polishing step
09/04/2003WO2003072288A1 Connection comprising a diffusion soldered junction, and method for the production thereof
09/04/2003WO2003065443A3 Probe station
09/04/2003WO2003052890B1 Processing a memory link with a set of at least two laser pulses
09/04/2003WO2003050868A3 Method for producing a layered assembly and a layered assembly
09/04/2003WO2003041162A3 Method of forming reliable cu interconnects
09/04/2003WO2003038487A3 Improvements in and relating to optoelectronic devices
09/04/2003WO2003028091A3 Copper interconnect barrier layer structure and formation method
09/04/2003WO2003023818A3 Electromechanical memory having cell selection circuitry constructed with nanotube technology
09/04/2003WO2003022732A3 Method for the production of a membrane
09/04/2003WO2003019618A3 Plasma treating apparatus and plasma treating method
09/04/2003WO2003017336A3 Dram trench capacitor and method of making the same
09/04/2003WO2003015896A3 Apparatus for and method of trapping products in exhaust gas
09/04/2003WO2003007393A3 Semiconductor structures comprising a piezoelectric material and corresponding processes and systems
09/04/2003WO2003005452A3 Power mosfet having a trench gate electrode and method of making the same
09/04/2003WO2003001604A3 Double gated transistor and method of fabrication
09/04/2003WO2002097864A3 Low temperature load and bake
09/04/2003WO2002080263A3 Flip chip interconnection using no-clean flux
09/04/2003WO2002061808A3 Heat treatment apparatus and wafer support ring
09/04/2003WO2002059943A3 Chemical mechanical polishing of copper-oxide damascene structures
09/04/2003WO2002058152A3 Electronic circuit device and method for manufacturing the same
09/04/2003WO2002027782A3 Fault detection method and apparatus using multiple dimension measurements
09/04/2003WO2002015236A3 Wafer area pressure control
09/04/2003WO2002009153A3 Method of fabricating integrated circuits, providing improved so-called 'saw bow' conductive tracks
09/04/2003WO2002005318A3 High density giant magnetoresistive memory cell
09/04/2003US20030167452 Design system of semiconductor integrated circuit element, program, program product, design method of semiconductor integrated circuit element, and semiconductor integrated circuit element
09/04/2003US20030167451 Method, apparatus and program for designing a semiconductor integrated circuit
09/04/2003US20030167102 Valve/sensor assemblies
09/04/2003US20030166990 Radiation delivery catheters and dosimetry methods
09/04/2003US20030166828 Polyamic-imide polymer
09/04/2003US20030166746 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders
09/04/2003US20030166482 Composition for stripping resists
09/04/2003US20030166390 Pedestal
09/04/2003US20030166384 Polisher for polishing end surface of semiconductor wafer
09/04/2003US20030166382 Integrated system for processing semiconductor wafers
09/04/2003US20030166381 Chemical mechanical polishing slurry and chemical mechanical polishing method using the same
09/04/2003US20030166380 Chemical-mechanical polishing device, damascene wiring forming device, and dama-scene wiring forming method
09/04/2003US20030166356 Method and apparatus for forming modular sockets using flexible interconnects and resulting structures
09/04/2003US20030166346 Methods of fabricating capacitors including TA2O5 layers in a chamber including changing a TA2O5 layer to heater separation or chamber pressure
09/04/2003US20030166345 Method of improving an etching profile in dual damascene etching
09/04/2003US20030166344 Method for manufacturing a semiconductor device
09/04/2003US20030166341 Semiconductor device manufacturing method
09/04/2003US20030166339 CMP system for metal deposition
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